INTERSIL HCS244T

HCS244T
Data Sheet
July 1999
Radiation Hardened Octal Buffer/Line
Driver, Three-State
Intersil‘s Satellite Applications FlowTM (SAF) devices are
fully tested and guaranteed to 100kRAD total dose. These
QML Class T devices are processed to a standard flow
intended to meet the cost and shorter lead-time needs of
large volume satellite manufacturers, while maintaining a
high level of reliability.
The Intersil HCS244T is a Radiation Hardened NonInverting Octal Buffer/Line Driver, Three-State, with two
active-low output enables.
File Number
4616.1
Features
• QML Class T, Per MIL-PRF-38535
• Radiation Performance
- Gamma Dose (γ) 1 x 105 RAD(Si)
- Latch-Up Free Under Any Conditions
- SEP Effective LET No Upsets: >100 MEV-cm2/mg
- Single Event Upset (SEU) Immunity < 2 x 10-9
Errors/Bit-Day (Typ)
• 3 Micron Radiation Hardened CMOS SOS
• Fanout (Over Temperature Range)
Specifications
• Bus Driver Outputs - 15 LSTTL Loads
Specifications for Rad Hard QML devices are controlled by
the Defense Supply Center in Columbus (DSCC). The SMD
numbers listed below must be used when ordering.
• Significant Power Reduction Compared to LSTTL ICs
Detailed Electrical Specifications for the HCS244T are
contained in SMD 5962-95731. A “hot-link” is provided from
our website for downloading.
www.intersil.com/spacedefense/newsafclasst.asp
Intersil‘s Quality Management Plan (QM Plan), listing all
Class T screening operations, is also available on our
website.
www.intersil.com/quality/manuals.asp
• DC Operating Voltage Range: 4.5V to 5.5V
• Input Logic Levels
- VIL = 0.3 VCC Max
- VIH = 0.7 VCC Min
• Input Current Levels Ii ≤ 5µA at VOL, VOH
Pinouts
HCS244DTR (SBDIP), CDIP2-T20
TOP VIEW
Ordering Information
ORDERING
INFORMATION
5962R9573101TRC
5962R9573101TXC
PART
NUMBER
HCS244DTR
HCS244KTR
OE 1
1
20
A0 1
2
19 2 OE
VCC
Y3 2
3
18 1 Y0
TEMP.
RANGE
(oC)
A1 1
4
17 2 A3
Y2 2
5
16 1 Y1
A2 1
6
15 2 A2
-55 to 125
Y1 2
7
14 1 Y2
A3 1
8
13 2 A1
Y0 2
9
12 1 Y3
10
11 2 A0
-55 to 125
NOTE: Minimum order quantity for -T is 150 units through
GND
distribution, or 450 units direct.
HCS244KTR (FLATPACK), CDFP4-F20
TOP VIEW
1
20
A0 1
2
19
2 OE
Y3 2
3
18
1 Y0
A1 1
4
17
2 A3
Y2 2
5
16
1 Y1
A2 1
6
15
2 A2
Y1 2
7
14
1 Y2
A3 1
8
13
2 A1
Y0 2
9
12
1 Y3
10
11
2 A0
GND
1
VCC
OE 1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
Satellite Applications Flow™ (SAF) is a trademark of Intersil Corporation.
HCS244T
Functional Diagram
1Y0
18
N
P
1Y1
16
N
P
1Y2
14
N
P
1Y3
12
N
2Y0
9
P
P
N
2Y1
7
P
N
2Y2
5
P
N
2Y3
3
P
N
19
2OE
1
1OE
2
1A0
4
1A1
6
1A2
8
1A3
11
2A0
13
2A1
15
2A2
TRUTH TABLE
INPUTS
H
L
X
Z
2
=
=
=
=
OUTPUT
1OE, 2OE
A
Y
L
L
L
L
H
H
H
X
Z
High Voltage Level
Low Voltage Level
Immaterial
High Impedance
17
2A3
HCS244T
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
(2747µm x 2693µm x 533µm ±51.0µm)
Type: Silox (SiO2)
108 x 106 x 21mils ±2mil
Thickness: 13.0kÅ ±2.6kÅ
METALLIZATION:
WORST CASE CURRENT DENSITY:
< 2.0e5 A/cm2
Type: Al Si
Thickness: 11.0kÅ ±1kÅ
TRANSISTOR COUNT:
SUBSTRATE POTENTIAL:
224
Unbiased Silicon on Sapphire
PROCESS:
BACKSIDE FINISH:
CMOS SOS
Sapphire
Metallization Mask Layout
HCS244T
Y3 2
(3)
A0 1
(2)
OE
(1)
VCC
(20)
OE 2
(19)
(18) Y0 1
A1 1 (4)
(17) A3 2
Y2 2 (5)
(16) Y1 1
A2 1 (6)
(15) A2 2
Y1 2 (7)
(14) Y2 1
(8)
(9)
(10)
(11)
(12)
(13)
A3 1
Y0 2
GND
A0 2
Y3 1
A1 2
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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