INTERSIL HGTG30N120D2

HGTG30N120D2
30A, 1200V N-Channel IGBT
April 1995
Features
Package
• 30A, 1200V
JEDEC STYLE TO-247
• Latch Free Operation
EMITTER
COLLECTOR
• Typical Fall Time - 580ns
GATE
• High Input Impedance
COLLECTOR
(BOTTOM SIDE
METAL)
• Low Conduction Loss
Description
The HGTG30N120D2 is a MOS gated high voltage switching
device combining the best features of MOSFETs and bipolar
transistors. The device has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor.
The much lower on-state voltage drop varies only moderately
between +25oC and +150oC.
Terminal Diagram
N-CHANNEL ENHANCEMENT MODE
The IGBTs are ideal for many high voltage switching applications
operating at moderate frequencies where low conduction losses
are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors.
C
PACKAGING AVAILABILITY
PART NUMBER
PACKAGE
HGTG30N120D2
TO-247
G
BRAND
G30N120D2
E
Formerly Developmental Type TA49010
Absolute Maximum Ratings
TC = +25oC, Unless Otherwise Specified
Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BVCES
Collector-Gate Voltage, RGE =1MΩ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCGR
Collector Current Continuous at TC = +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25
at VGE =15V at TC = +90oC . . . . . . . . . . . . . . . . . . . . IC90
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM
Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES
Gate-Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM
Switching Safe Operating Area at TJ = +150oC . . . . . . . . . . . . . . . . . . . . . . . . . . . .SSOA
Power Dissipation Total at TC = +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Power Dissipation Total Derating TC > +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Short Circuit Withstand Time (Note 2) at VGE = 15V . . . . . . . . . . . . . . . . . . . . . . . . . tSC
at VGE = 10V . . . . . . . . . . . . . . . . . . . . . . . . . tSC
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. VCE(PEAK) = 720V, TC = +125oC, RGE = 25Ω.
HGTG30N120D2
1200
1200
50
30
200
±20
±30
200A at 0.8 BVCES
208
1.67
-55 to +150
260
6
15
UNITS
V
V
A
A
A
V
V
W
W/oC
oC
oC
µS
µS
HARRIS SEMICONDUCTOR IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS:
4,364,073
4,587,713
4,641,162
4,794,432
4,860,080
4,969,027
4,417,385
4,598,461
4,644,637
4,801,986
4,883,767
4,430,792
4,605,948
4,682,195
4,803,533
4,888,627
4,443,931
4,618,872
4,684,413
4,809,045
4,890,143
4,466,176
4,620,211
4,694,313
4,809,047
4,901,127
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
3-111
4,516,143
4,631,564
4,717,679
4,810,665
4,904,609
4,532,534
4,639,754
4,743,952
4,823,176
4,933,740
4,567,641
4,639,762
4,783,690
4,837,606
4,963,951
File Number
2834.2
Specifications HGTG30N120D2
Electrical Specifications
TC = +25oC, Unless Otherwise Specified
LIMITS
PARAMETERS
SYMBOL
TEST CONDITIONS
TYP
MAX
UNITS
1200
-
-
V
TC =
+25oC
-
-
1.0
mA
TC =
+125oC
-
-
4.0
mA
IC = IC90,
VGE = 15V
TC =
+25oC
-
3.0
3.5
V
TC =
+125oC
-
3.2
3.5
V
IC = IC90,
VGE = 10V
TC = +25oC
-
3.2
3.8
V
TC = +125oC
-
3.4
3.8
V
VGE(TH)
VGE = VCE,
IC = 1mA
+25oC
3.0
4.5
6.0
V
Gate-Emitter Leakage Current
IGES
VGE = ±20V
-
-
±500
nA
Gate-Emitter Plateau Voltage
VGEP
IC = IC90, VCE = 0.5 BVCES
-
7.3
-
V
IC = IC90,
VCE = 0.5 BVCES
VGE = 15V
-
185
240
nC
VGE = 20V
-
240
315
nC
L = 50µH, IC = IC90, RG = 25Ω,
VGE = 15V, TJ = +125oC,
VCE = 0.8 BVCES
-
100
-
ns
-
150
-
ns
tD(OFF)I
-
760
990
ns
tFI
-
580
750
ns
-
8.4
-
mJ
-
100
-
ns
-
150
-
ns
tD(OFF)I
-
610
790
ns
tFI
-
580
750
ns
WOFF
-
8.4
-
mJ
0.6
oC/W
Collector-Emitter Breakdown Voltage
BVCES
Zero Gate Voltage Collector Current
ICES
IC = 250µA, VGE = 0V
MIN
VCE = BVCES
VCE = 0.8 BVCES
Collector-Emitter Saturation Voltage
VCE(SAT)
Gate-Emitter Threshold Voltage
On-State Gate Charge
QG(ON)
Current Turn-On Delay Time
tD(ON)I
Current Rise Time
tRI
Current Turn-Off Delay Time
Current Fall Time
Turn-Off Energy (Note 1)
WOFF
Current Turn-On Delay Time
tD(ON)I
Current Rise Time
tRI
Current Turn-Off Delay Time
Current Fall Time
Turn-Off Energy (Note 1)
Thermal Resistance Junction-to-Case
TC =
L = 50µH, IC = IC90, RG = 25Ω,
VGE = 10V, TJ = +125oC,
VCE = 0.8 BVCES
RθJC
-
0.5
NOTE: 1. Turn-Off Energy Loss (WOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and
ending at the point where the collector current equals zero (ICE = 0A) The HGTG20N100D2 was tested per JEDEC standard No. 24-1
Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
Typical Performance Curves
PULSE DURATION = 250µs
DUTY CYCLE < 0.5%, TC = +25oC
PULSE DURATION = 250µs
DUTY CYCLE < 0.5%, VCE = 10V
90
ICE, COLLECTOR-EMITTER CURRENT (A)
ICE, COLLECTOR-EMITTER CURRENT (A)
100
80
70
60
50
TC = +150oC
40
30
TC = +25oC
20
10
TC = -40oC
0
0
2
4
6
8
10
100
VGE = 15V
90
VGE = 10V
80
VGE = 8V
70
60
VGE = 7.5V
50
40
30
VGE = 6.0V
20
VGE = 6.5V
10
0
0
VGE, GATE-TO-EMITTER VOLTAGE (V)
FIGURE 1. TRANSFER CHARACTERISTICS (TYPICAL)
VGE = 7.0V
2
4
6
8
VCE, COLLECTOR-TO-EMITTER VOLTAGE (V)
10
FIGURE 2. SATURATION CHARACTERISTICS (TYPICAL)
3-112
HGTG30N120D2
Typical Performance Curves (Continued)
ICE, DC COLLECTOR CURRENT (A)
50
2.0
VGE = 15V
VGE =10V AND 15V, TJ = +150oC,
RG = 25Ω, L = 50µH
40
1.5
30
VCE = 480V
tFI , FALL TIME (µs)
VGE = 10V
20
1.0
VCE = 960V
0.5
10
0
0.0
+50
+75
+100
+125
+150
1
10
TC , CASE TEMPERATURE (oC)
FIGURE 3. DC COLLECTOR CURRENT vs CASE TEMPERATURE
FIGURE 4. FALL TIME vs COLLECTOR-EMITTER CURRENT
10000
VCE, COLLECTOR-EMITTER VOLTAGE (V)
1000
f = 1MHz
8000
C, CAPACITANCE (pF)
100
ICE, COLLECTOR-EMITTER CURRENT (A)
CISS
6000
4000
COSS
2000
CRSS
RL = 29Ω
IG(REF) = 1.8mA
VCC = BVCES
GATEEMITTER
VOLTAGE
750
VGE = 10V
VCC = BVCES
500
5
0.75 BVCES 0.75 BVCES
0.50 BVCES 0.50 BVCES
0.25 BVCES 0.25 BVCES
250
COLLECTOR-EMITTER VOLTAGE
0
0
0
0
5
10
15
20
20
25
VCE, COLLECTOR-TO-EMITTER VOLTAGE (V)
FIGURE 5. CAPACITANCE vs COLLECTOR-EMITTER VOLTAGE
TJ =
VCE(ON), SATURATION VOLTAGE (V)
7
WOFF , TURN-OFF SWITCHING LOSS (mJ)
100
VGE = 10V
6
5
4
VGE = 15V
3
2
1
IG(REF)
IG(ACT)
TIME (µs)
80
IG(REF)
IG(ACT)
FIGURE 6. NORMALIZED SWITCHING WAVEFORMS AT CONSTANT GATE CURRENT (REFER TO APPLICATION
NOTES AN7254 AND AN7260)
8
+150oC
10
VGE, GATE-EMITTER VOLTAGE (V)
+25
TJ = +150oC, RG = 25Ω,
L = 50µH
VCE = 960V, VGE = 10V, 15V
10
1.0
VCE = 480V, VGE = 10V, 15V
0.1
0
1
10
1
100
10
100
ICE, COLLECTOR-EMITTER CURRENT (A)
ICE, COLLECTOR-EMITTER CURRENT (A)
FIGURE 7. SATURATION VOLTAGE vs COLLECTOR-EMITTER
CURRENT
3-113
FIGURE 8. TURN-OFF SWITCHING LOSS vs COLLECTOREMITTER CURRENT
HGTG30N120D2
Typical Performance Curves (Continued)
2.0
100
fOP , OPERATING FREQUENCY (kHz)
VGE = 15V, RG = 50Ω
tD(OFF)I , TURN-OFF DELAY (µs)
VGE = 10V, RG = 50Ω
VGE = 15V, RG = 25Ω
1.5
VGE = 10V, RG = 25Ω
1.0
TJ = +150oC
0.5
VCE = 960V
L = 50µH
VCE = 480V
fMAX1 = 0.05/tD(OFF)I
fMAX2 = (PD - PC)/WOFF
PC = DUTY FACTOR = 50%
RθJC = 0.5oC/W
10
VCE = 960V
TJ = +150oC, TC = +75oC, VGE = 15V
RG = 25Ω, L = 50µH
1
1
0.0
1
10
10
NOTE:
PD = ALLOWABLE DISSIPATION
100
ICE, COLLECTOR-EMITTER CURRENT (A)
FIGURE 9. TURN-OFF DELAY vs COLLECTOR-EMITTER
CURRENT
ICE, COLLECTOR-EMITTER CURRENT (A)
VGE = 10V
TJ = +150oC
TJ = +25oC
1
1
0
2
3
4
5
6
7
8
VCE(ON), SATURATION VOLTAGE (V)
FIGURE 11. COLLECTOR-EMITTER SATURATION VOLTAGE
Test Circuit
L = 25µH
1/RG = 1/RGEN + 1/RGE
VCC
960V
RGEN = 50Ω
20V
0V
PC = CONDUCTION DISSIPATION
FIGURE 10. OPERATING FREQUENCY vs COLLECTOREMITTER CURRENT AND VOLTAGE
100
10
70
ICE, COLLECTOR-EMITTER CURRENT (A)
RGE = 50Ω
FIGURE 12. INDUCTIVE SWITCHING TEST CIRCUIT
3-114
+
-
HGTG30N120D2
Operating Frequency Information
Operating frequency information for a typical device (Figure
10) is presented as a guide for estimating device performance
for a specific application. Other typical frequency vs collector
current (ICE) plots are possible using the information shown
for a typical unit in Figures 7, 8 and 9. The operating
frequency plot (Figure 10) of a typical device shows fMAX1 or
fMAX2 whichever is smaller at each point. The information is
based on measurements of a typical device and is bounded
by the maximum rated junction temperature.
fMAX1 is defined by fMAX1 = 0.05/tD(OFF)I. tD(OFF)I deadtime
(the denominator) has been arbitrarily held to 10% of the onstate time for a 50% duty factor. Other definitions are possible.
tD(OFF)I is defined as the time between the 90% point of the
trailing edge of the input pulse and the point where the
collector current falls to 90% of its maximum value. Device
turn-off delay can establish an additional frequency limiting
condition for an application other than TJMAX. tD(OFF)I is
important when controlling output ripple under a lightly loaded
condition.
fMAX2 is defined by fMAX2 = (PD - PC)/WOFF. The allowable
dissipation (PD) is defined by PD = (TJMAX - TC)/RθJC. The sum
of device switching and conduction losses must not exceed PD.
A 50% duty factor was used (Figure 10) and the conduction
losses (PC) are approximated by PC = (VCE • ICE)/2. WOFF is
defined as the integral of the instantaneous power loss starting
at the trailing edge of the input pulse and ending at the point
where the collector current equals zero (ICE = 0A).
The switching power loss (Figure 10) is defined as fMAX2 •
WOFF. Turn-on switching losses are not included because they
can be greatly influenced by external circuit conditions and components.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (407) 724-7000
FAX: (407) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
3-115
ASIA
Intersil (Taiwan) Ltd.
Taiwan Limited
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029