Datasheet Operational Amplifiers Low Noise Operational Amplifier LM4559F ●Key Specifications Wide Operating Supply Voltage Wide Temperature Range: High Voltage Gain High Unity Gain Bandwidth High Slew Rate Low Noise Voltage ●General Description BA4559 is dual operational amplifier with high gain and wide bandwidth. It has good performance of input referred noise voltage(5 nV/ Hz ) and total harmonic distortion(0.002%). These are suitable for Audio applications. ●Features High Voltage Gain High Slew Rate Low Noise Voltage Low distortion Wide Common-mode Voltage Range Low Power Consumption ●Package SOP8 ±4V to ±18V -40°C to +85°C 110dB (Typ.) 3.3MHz (Typ.) 3.5V/µS (Typ.) 0.7µVrms (Typ.) W(Typ.) xD(Typ.) xH(Max.) 5.00mm x 6.20mm x 1.71mm ●Application Audio application General Purpose ●Block Diagram VCC -IN VOUT +IN VEE Figure 1. Simplified schematic (1 channel only) ○Product structure:Silicon monolithic integrated circuit www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed to be protected against radioactive rays. 1/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Pin Configuration SOP8 OUT1 1 -IN1 2 +IN1 3 VEE Pin No. Symbol 1 OUT1 2 -IN1 3 +IN1 4 VEE 5 +IN2 6 -IN2 7 OUT2 8 VCC 8 VCC 7 OUT2 CH1 - + CH2 + - 4 6 -IN2 5 +IN2 ●Ordering Information L M 4 5 5 Part Number LM4559F 9 F - Package F:SOP8 E2 Packaging and forming specification E2: Embossed tape and reel (SOP8) ●Line-up Topr Package -40°C to +85°C SOP8 Operable Part Number Reel of 2500 LM4559F-E2 ●Absolute Maximum Ratings(Ta=25°C) Parameter Supply Voltage Symbol Ratings Unit VCC – VEE +36 V *1*2 Power dissipation Pd Differential Input Voltage*3 Input Common-mode Voltage Range Operating Supply Voltage Vid 690 36 mW V Vicm (VEE - 0.3) to (VEE + 36) V Vopr ±4 to ±18 V Operating Temperature Topr - 40 to +85 °C Storage Temperature Maximum Junction Temperature Tstg - 55 to +150 °C Tjmax +150 °C Note: Absolute maximum rating of each item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or usage out of absolute maximum rated temperature environment may cause deterioration of characteristics. *1 When used at temperature above Ta=25℃, reduce by 5.52mW/℃. *2 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm). *3 Differential input voltage is the voltage difference between inverting input and non-inverting input. Input terminal voltage is set to more than VEE. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Electrical Characteristics: ○LM4559F (Unless otherwise specified VCC=+15V, VEE=-15V) Parameter Symbol Limits Condition Temperature Range Min. Typ. Max. Unit Input Offset Voltage*4*5 Vio 25°C - 0.5 1.5 mV OUT=0V Input Offset Current*4*5 Iio 25°C - 5 100 nA OUT=0V Input Bias Current*4*5 Ib 25°C - 40 200 nA OUT=0V Input Common-mode Voltage Range Vicm 25°C ±12 ±13 - V Maximum Output Voltage*5 VOM 25°C ±12 ±13 - ±11 ±12.5 - Large Signal Voltage Gain*5 Av 25°C 20 300 - V/mV 25°C 86 110 - dB 25°C - 3.3 5.0 Full range - - 6.5 Bom 25°C - 32 fT 25°C - GBW 25°C θ Common-mode Rejection Ratio Power Supply Rejection Ratio Supply Current *5 Maximum Output Swing Bandwidth Unity Gain Frequency Gain Band Width Phase margin Equivalent Input Noise Voltage Total Harmonic Distortion+ Noise ICC V - RL ≥2kΩ RL = 600Ω OUT=±10V, RL=2kΩ mA RL=∞, All Op-Amps - kHz OUTP-P = 20V, RL=2kΩ 3.3 - MHz RL=2kΩ - 4 - MHz RL=2kΩ, f=1MHz 25°C - 50 - deg RL=2kΩ CMRR 25°C 80 100 - dB OUT=0V PSRR 25°C 82 100 - dB OUT=0V - 0.7 - µVrms Av= 40dB, RS=1kΩ f=20Hz to 20kHz - 5 - nV/ Hz Vicm=0V, f=1kHz Vn 25°C THD+N 25°C - 0.002 - % f=1kHz, RL=2kΩ, Channel Separation CS 25°C - 110 - dB Av=40dB, RS=1kΩ f=10kHz Slew Rate SR 25°C 1.5 3.5 - V/µS RL=2kΩ, CL=100pF *4 *5 Absolute value. Full range: Ta=-40°C to +85°C www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F Description of electrical characteristics Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown. Note that item name, symbol and their meaning may differ from those on other manufacturer’s document or general documents. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 Supply Voltage (VCC – VEE) Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruction of characteristics of internal circuit. 1.2 Differential Input Voltage (Vid) Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and destruction of characteristics of IC. 1.3 Input Common-mode Voltage Range (Vicm) Indicates the maximum voltage that can be applied to the non-inverting terminal and inverting terminal without deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assures normal operation of IC. When normal Operation of IC is desired, the input common-mode voltage of characteristics item must be followed. 1.4 Power dissipation (Pd) Indicates the power that can be consumed by the IC when mounted on a specific board at ambient temperature 25°C (normal temperature). As for the packaged product, Pd is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package 2. Electrical characteristics item 2.1 Input Offset Voltage (Vio) Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the input voltage difference required for setting the output voltage to 0 V. 2.2 Input Offset Current (Iio) Indicates the difference of input bias current between non-inverting terminal and inverting terminal. 2.3 Input Bias Current (Ib) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at non-inverting and inverting terminals. 2.4 Input Common-mode Voltage Range (Vicm) Indicates the input voltage range where IC operates normally. 2.5 Maximum Output Voltage (VOM) Indicates the voltage range that the IC can output under specified load condition. It is typically divided into high-level output voltage and low-level output voltage. High-level output voltage indicates the upper limit of output voltage. Low-level output voltage indicates the lower limit. 2.6 Large Signal Voltage Gain (Av) Indicates the amplification rate (gain) of the output voltage against the voltage difference between the non-inverting and inverting terminals. It is normally the amplification rate (gain) with reference to DC voltage. Av = (Output voltage fluctuation) / (Input offset fluctuation) 2.7 Supply Current (ICC) Indicates the current that flows within the IC under specified no-load conditions. 2.8 Maximum Output Swing Bandwidth (Bom) Indicates the range of frequency within which the maximum output voltage swing. 2.9 Unity Gain Frequency (fT) Indicates the frequency where the voltage gain of Op-Amp is 1. 2.10 Gain Band Width (GBW) Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave. 2.11 Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. 2.12 Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) 2.13 Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) 2.14 Equivalent Input Noise Voltage (Vn) Indicates a noise voltage generated inside the operational amplifier reflected back to an ideal voltage source connected in series with the input terminal. 2.15 Total Harmonic Distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F 2.16 Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. 2.17 Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Typical Performance Curves ○LM4559F 4.5 800 -40°C LM4559F 600 SUPPLY CURRENT [mA] POWER DISSIPATION [mW] 4.0 400 200 3.5 3.0 25°C 2.5 85°C 2.0 1.5 1.0 0.5 0 0.0 85 0 25 50 75 AMBIENT TEMPERATURE [℃] 100 ±0 ±10 ±15 ±20 SUPPLY VOLTAGE [V] Figure 2. Derating curve Figure 3. Supply Current – Supply Voltage 4.5 20 -40°C MAXIMUM OUTPUT VOLTAGE [V 4.0 SUPPLY CURRENT [mA] ±5 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 15 25°C 85°C 10 5 0 85°C -5 25°C -40°C -10 -15 -20 ±0 100 ±5 ±10 ±15 SUPPLY VOLTAGE [V] ±20 Figure 5. Maximum Output Voltage – Supply Voltage (RL=2kΩ) Figure 4. Supply Current – Ambient Temperature (VCC/VEE=±15V) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Typical Performance Curves (Reference data) – Continued ○LM4559F MAXIMUM OUTPUT VOLTAGE [V]. 20 30 OUTPUT VOLTAGE SWING [V] 15 10 5 0 -5 -10 -15 20 15 10 5 0 -20 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [℃] 1 100 10 2 10 103 104 105 FREQUENCY [kHz] Figure 6. Maximum Output Voltage – Ambient Temperature (VCC/VEE=±15V, RL=2kΩ) Figure 7. Maximum Output Swing Bandwidth – Frequency (VCC/VEE=±15V, Ta=25°C, RL=2kΩ) 6 6 4 INPUT OFFSET VOLTAGE [mV] INPUT OFFSET VOLTAGE [mV] 25 2 0 -2 -4 -6 4 2 -40°C 0 85°C 25°C -2 -4 -6 -50 -25 0 25 50 75 100 -15 -10 -5 0 5 10 15 INPUT COMMON-MODE VOLTAGE [V] AMBIENT TEMPERATURE [°C] Figure 8. Input Offset Voltage – Ambient Temperature (VCC/VEE=±15V) Figure 9. Input Offset Voltage – Input Common-mode Voltage (VCC/VEE=±15V) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Typical Performance Curves (Reference data) – Continued ○LM4559F COMMON MODE REJECTION RATIO [dB] . LARGE SIGNAL VOLTAGE GAIN [dB] . 150 140 130 120 110 100 90 -50 150 140 130 120 110 100 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE [℃] Figure 10. Large Signal Voltage Gain – Ambient Temperature (VCC/VEE=±15V, RL=2kΩ) -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] Figure 11. Common Mode Rejection Ratio – Ambient Temperature (VCC/VEE=±15V) 120 6 115 5 110 SLEW RATE L-H [V/µs] POWER SUPPLY REJECTION RATIO [dB] 160 105 100 95 90 4 3 2 1 85 0 80 -50 -25 0 25 50 75 -50 100 -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] AMBIENT TEMPERATURE [°C] Figure 12. Power Supply Rejection Ratio – Ambient Temperature Figure 13. Slew Rate L-H – Ambient Temperature (VCC/VEE=±15V, RL=2kΩ, CL=100pF) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Typical Performance Curves (Reference data) - Continued ○LM4559 6 100 200 80 160 60 120 4 GAIN[dB] SLEW RATE H-L [V/µs] 5 3 Gain 40 80 20 40 2 1 0 0 -50 -25 0 25 50 75 0 2 103 1.E+05 104 0.1 1.E+01 1 10 1.E+03 10 1.E+04 1.E+00 1.E+02 100 AMBIENT TEMPERATURE [°C] FREQUENCY [kHz] Figure 14. Slew Rate H-L – Ambient Temperature (VCC/VEE=±15V, RL=2kΩ, CL=100pF) Figure 15. Voltage Gain・Phase – Frequency (VCC/VEE=±15V, RL=2kΩ) 150 30 INPUT OFFSET CURRENT [nA] INPUT BIAS CURRENT [nA] PHASE [deg] Phase 125 100 75 50 25 0 20 10 0 -10 -20 -30 -50 -25 0 25 50 75 100 -50 AMBIENT TEMPERATURE [°C] Figure 16. Input Bias Current – Ambient Temperature (VCC/VEE=±15V) -25 0 25 50 75 100 AMBIENT TEMPERATURE [°C] Figure 17. Input Offset Current – Ambient Temperature (VCC/VEE=±15V) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Typical Performance Curves (Reference data) - Continued ○LM4559 Equivalent Input Noise Voltage [nV/√Hz] TOTAL HARMONIC DISTORTION [%] 1 0.1 0.01 20Hz 0.001 1kHz 20kHz 0.0001 0.01 0.1 1 10 OUTPUT VOLTAGE [Vrms] 60 50 40 30 20 10 0 100 1 10 2 10 103 104 105 FREQUENCY [kHz] Figure 18. Total Harmonic Distortion - Output Voltage (VCC/VEE=±15V, RL=2kΩ) Figure 19. Equivalent Input Noise Voltage - Frequency (VCC/VEE=±15V, Ta=25°C, Av=40dB) Equivalent Input Noise Voltage [µVrms] 1 0.8 0.6 0.4 0.2 0 ±0 ±5 ±10 ±15 SUPPLY VOLTAGE [V] ±20 Figure 20. Equivalent Input Noise Voltage – Supply Voltage (Ta=25°C, DIN AUDIO) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Application Information NULL method condition for Test Circuit 1 VCC, VEE, EK, Vicm Unit:V Parameter Input Offset Voltage VF S1 S2 S3 VCC VEE EK VF1 ON ON OFF 15 -15 0 ON ON ON 15 -15 VF2 Vicm Calculation VF3 0 2 10 VF4 -10 ON ON OFF 15 -15 0 3 VF5 10 VF6 Power Supply Rejection Ratio 1 -10 Large Signal Voltage Gain Common Mode Rejection Ratio (Input Common-mode Voltage Range) 0 ON ON 4 -4 18 -18 OFF VF7 0 0 4 - Calculation- |VF1| 1. Input Offset Voltage (Vio) Vio = 2. Large Signal Voltage Gain (Av) Av = 20Log [V] 1+RF/RS ∆EK × (1+RF/RS) [dB] |VF2-VF3| 3. Common Mode Rejection Ratio (CMRR) ∆Vicm × (1+RF/RS) CMRR = 20Log [dB] |VF4 - VF5| 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log ∆Vcc × (1+ RF/RS) [dB] |VF6 - VF7| 0.1µF RF=50kΩ 0.1µF 500kΩ SW1 VCC EK RS=50Ω 15V Vo Ri=10kΩ 500kΩ 0.1µF 0.1µF DUT NULL SW3 RS=50Ω 1000pF Ri=10kΩ Vicm 50kΩ VF RL VRL -15V VEE Figure 21. Test circuit 1 www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F Switch Condition for Test Circuit 2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=2kΩ OFF OFF OFF ON OFF OFF Slew Rate OFF OFF Maximum Frequency ON ON ON ON OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF ON ON ON Input voltage SW3 VH SW4 R2 100kΩ ● ● VCC=30V VL - SW1 t Input wave SW2 Output voltage + SW5 SW6 SW8 SW7 SW9 SW10 SW11 SW12 R1 1kΩ 90% SR=ΔV/Δt VH VEE RL VIN- VIN+ ΔV CL 10% Vo VL Δt t Output wave Figure 22. Test circuit2 Figure 23. Slew rate input output wave R2=100kΩ R2=100kΩ VCC VCC R1=1kΩ R1=1kΩ V ~ R1//R2 VIN VEE OUT1 =1Vrms V OUT2 ~ R1//R2 VEE CS=20Log 100×OUT1 OUT2 Figure 24. Test circuit 3 (Channel Separation) www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F Application example ○Voltage follower Voltage gain is 0dB. Using this circuit, the output voltage (OUT) is controlled to be equal to the input voltage (IN). This circuit also stabilizes OUT due to high input impedance and low output impedance. Computation for OUT is shown below. OUT=IN VCC OUT IN VEE Figure 25. Voltage follower ○Inverting amplifier R2 For inverting amplifier, IN is amplified by a voltage gain decided by the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression. OUT=-(R2/R1)・IN This circuit has input impedance equal to R1. VCC R1 IN OUT R1//R2 VEE Figure 26. Inverting amplifier circuit ○Non-inverting amplifier R1 R2 For non-inverting amplifier, IN is amplified by a voltage gain decided by the ratio of R1 and R2. OUT is in-phase with IN and is shown in the next expression. OUT=(1+R2/R1)・IN Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. VCC OUT IN VEE Figure 27. Non-inverting amplifier circuit www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at Ta=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θja°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 28 (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θja), given the ambient temperature (Ta), maximum junction temperature (Tjmax), and power dissipation (Pd). θja = (Tjmax-Ta) / Pd °C/W ・・・・・ (Ⅰ) The Derating curve in Figure 28 (b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 29 (c) shows an example of the derating curve for LM4559. LSIの 消 費 力 [W] Power dissipation of 電 LSI θja=(Tjmax-Ta)/Pd Pd (max) °C/W θja2 < θja1 P2 Ambient temperature Ta[ °C ] θ' ja2 P1 θ ja2 Tj ' (max) Tj (max) θ' ja1 Chip surface temperature Tj[ °C ] 0 25 50 θ ja1 75 100 125 150 Ambient temperature 周 囲 温 度 Ta [℃ ] (a) Thermal resistance (b) Derating curve Figure 28. Thermal resistance and Derating Curve POWER DISSIPATION [mW] 800 LM4559F 600 400 200 0 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 (c) LM4559 5.52 mW/°C When using the unit above Ta=25°C, subtract the value above per °C. Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted Figure 29. Derating Curve www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Operational Notes 1) Processing of unused circuit It is recommended to apply the connection (see Figure 30.) and set the non-inverting input terminal at a potential within the Input Common-mode Voltage Range (Vicm) for any unused circuit. 2) Applied voltage to the input terminal For normal circuit operation of voltage comparator, please input a voltage for its input terminal within Input Common-mode Voltage Range (Vicm). Then, regardless of power supply voltage, (VEE) – 0.3V can be applied to input terminals without deterioration or destruction of its characteristics. VCC + Connect to Vicm Vicm VEE VEE Figure 30. The example of application circuit for unused op-amp 3) Operating power supply (split power supply/single power supply) The voltage comparator operates if a certain level of voltage is applied between VCC and VEE. Therefore, the operational amplifier can be operated under single power supply or split power supply. 4) Power dissipation (Pd) If the IC is used under excessive power dissipation, an increase in the chip temperature will cause deterioration of the electrical characteristics of IC. As an example, reduction of current capability may happen. Take consideration of the effective power dissipation and thermal design with a sufficient margin. Pd is referenced to the provided power dissipation curve. 5) Short circuits between pins and incorrect mounting When mounting the IC on a printed circuit board, take notice of the direction and position of the IC. If IC is mounted erroneously, it may be damaged. Also, when a foreign object is inserted between outputs, between output and VCC terminal, or between output and VEE terminal, it causes short circuit which may damage the IC. 6) Usage under strong electromagnetic field Be careful when using the IC under strong electromagnetic field because it may malfunction. 7) Usage of IC When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to the piezo effect. Be careful with the warp on the printed circuit board. 8) Testing IC on the application board When testing IC on the application board, in cases where the capacitor is connected to low impedance, make sure to discharge per process because there is a possibility that the IC may be damaged due to stress. When removing IC from the application board, it is essential to cut the supply voltage. As a countermeasure against the static electricity, observe proper grounding during fabrication process and take due care when carrying and storing it. 9) The IC destruction caused by capacitive load The IC may be damaged when VCC terminal and VEE terminal is shorted with the charged output terminal capacitor. When IC is used as an operational amplifier or as an application circuit where oscillation is not activated by an output capacitor, output capacitor must be kept below 0.1μF in order to prevent the damage mentioned above. 10) Decoupling capacitor Insert a decoupling capacitor between VCC and VEE for stable operation of operational amplifier. Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for reference to help in reading the formal version. If there are any differences in the transplanted version of this document, the formal version takes priority. www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Physical Dimensions Tape and Reel Information SOP8 <Tape and Reel information> 6 5 0.3MIN 7 4.4±0.2 6.2±0.3 8 +6° 4° −4° 1 2 3 0.9±0.15 5.0±0.2 (MAX 5.35 include BURR) Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 1pin 0.42±0.1 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram SOP8(TOP VIEW) Part Number Marking LOT Number 1PIN MARK Product Name LM4559 Package Type Marking SOP8 4559 F ●Land pattern data PKG Land pitch e Land space MIE SOP8 1.27 4.60 all dimensions in mm Land length Land width ≥ℓ 2 b2 1.10 0.76 b2 e MIE ℓ2 www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet LM4559F ●Revision History Date Revision Changes 30.NOV.2012 001 New Release www.rohm.com ©2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/17 TSZ02201-0RAR1G200580-1-2 1.NOV.2012 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. 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Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.