Order this document
by MOC2A60–10/D
SEMICONDUCTOR TECHNICAL DATA
2 Amp Zero–Cross Triac Output
This device consists of a gallium arsenide infrared emitting diode optically
coupled to a zero–cross triac driver circuit and a power triac. It is capable of
driving a load of up to 2 amps (rms) directly, on line voltages from 20 to 280 volts
ac (rms).
*Motorola Preferred Device
• Provides Normally Open Solid State AC Output with 2 Amp Rating
OPTOISOLATOR
2 AMP ZERO CROSS
TRIAC OUTPUT
600 VOLTS
• 70 Amp Single Cycle Surge Capability
• Zero–Voltage Turn–on and Zero–Current Turn–off
• High Input–Output Isolation of 3750 vac (rms)
• Static dv/dt Rating of 400 Volts/µs Guaranteed
• 2 Amp Pilot Duty Rating Per UL508 W117 (Overload Test)
and W118 (Endurance Test)
[File No. 129224]
• CSA Approved [File No. CA77170–1].
• SEMKO Approved Certificate #9507228
• Exceeds NEMA 2–230 and IEEE472 Noise Immunity Test Requirements (See Fig.14)
7
23
DEVICE RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
CASE 417–02
Style 2
PLASTIC PACKAGE
9
INPUT LED
Forward Current — Maximum Continuous
Forward Current — Maximum Peak
(PW = 100µs, 120 pps)
Reverse Voltage — Maximum
IF
50
mA
IF(pk)
1.0
A
VR
6.0
V
CASE 417A–02
Style 1
PLASTIC PACKAGE
OUTPUT TRIAC
Output Terminal Voltage — Maximum Transient (1)
VDRM
600
V(pk)
Operating Voltage Range — Maximum Continuous
(f = 47 – 63 Hz)
VT
20 to 280
Vac(rms)
IT(rms)
0.03 to 2.0
A
ITSM
70
A
Main Terminal Fusing Current (t = 8.3 ms)
I2T
26
A2sec
Load Power Factor Range
PF
0.3 to 1.0
—
Junction Temperature Range
TJ
– 40 to 125
°C
On–State Current Range
(Free Air, Power Factor ≥ 0.3)
Non–Repetitive Single Cycle Surge Current —
Maximum Peak (t = 16.7 ms)
Input–Output Isolation Voltage — Maximum(2)
47 – 63 Hz, 1 sec Duration
VISO
Thermal Resistance — Power Triac Junction to Case
(See Fig. 15)
RθJC
8.0
°C/W
Ambient Operating Temperature Range
Toper
– 40 to +100
°C
Tstg
– 40 to +150
°C
TL
260
°C
Lead Soldering Temperature — Maximum
(1/16″ from Case, 10 sec Duration)
DEVICE SCHEMATIC
7
3
2
TOTAL DEVICE
Storage Temperature Range
CASE 417B–01
Style 1
PLASTIC PACKAGE
3750
Vac(rms)
ZVA
*
9
1. Test voltages must be applied within dv/dt rating.
2. Input–Output isolation voltage, VISO, is an internal device dielectric breakdown rating. For this
2. test, pins 2, 3 and the heat tab are common, and pins 7 and 9 are common.
* Zero Voltage Activate Circuit
1, 4, 5, 6, 8.
2.
3.
7.
9.
NO PIN
LED CATHODE
LED ANODE
MAIN TERMINAL 2
MAIN TERMINAL 1
POWER OPTO is a trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
Optoelectronics
Device Data
Motorola
Motorola, Inc.
1995
1
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Forward Voltage (IF = 10 mA)
VF
1.00
1.17
1.50
V
Reverse Leakage Current (VR = 6.0 V)
IR
—
1.0
100
µA
Capacitance
C
—
18
—
pF
IDRM
—
0.25
10
µA
dv/dt(s)
400
—
—
V/µs
IH
—
10
—
mA
IFT(on)
IFT(on)
—
—
7.0
3.5
10
5.0
mA
mA
On–State Voltage, Either Direction (IF = Rated IFT(on), ITM = 2.0 A)
VTM
—
0.96
1.3
V
Inhibit Voltage, Either Direction (IF = Rated IFT(on))(5)
(Main Terminal Voltage above which device will not trigger)
VINH
—
8.0
10
V
Commutating dv/dt (Rated VDRM, IT = 30 mA – 2.0 A(rms),
TA = – 40 ± 100°C, f = 60 Hz)(2)
dv/dt (c)
5.0
—
—
V/µS
Common–mode Input–Output dv/dt(2)
dv/dt(cm)
—
40,000
—
V/µS
CISO
—
1.3
—
pF
RISO
1012
1014
—
Ω
INPUT LED
OUTPUT TRIAC
Off–State Leakage, Either Direction
(IF = 0, VDRM = 600 V)
Critical Rate of Rise of Off–State Voltage (Static)
Vin = 400 vac(pk)) (1)(2)
Holding Current, Either Direction (IF = 0, VD = 12 V, IT = 200 mA)
COUPLED
LED Trigger Current Required to Latch Output
Either Direction (Main Terminal Voltage = 2.0 V)(3)(4)
MOC2A60–10
MOC2A60–5
Input–Output Capacitance (V = 0, f = 1.0 MHz)
Isolation Resistance (VI–O = 500 V)
1.
2.
3.
3.
4.
5.
Per EIA/NARM standard RS–443, with VP = 200 V, which is the instantaneous peak of the maximum operating voltage.
Additional dv/dt information, including test methods, can be found in Motorola applications note AN1048/D, Figure 43.
All devices are guaranteed to trigger at an IF value less than or equal to the max IFT. Therefore, the recommended operating IF lies between
the device’s maximum IFT(on) limit and the Maximum Rating of 50 mA.
Current–limiting resistor required in series with LED.
Also known as “Zero Voltage Turn–On.”
TYPICAL CHARACTERISTICS
2.00
60
40
20
0
–40
1.60
1.40
TA = – 40°C
1.20
1.00
25°C
100°C
0.80
–20
0
20
40
60
80
TA, AMBIENT TEMPERATURE (°C)
100
Figure 1. Maximum Allowable Forward LED
Current versus Ambient Temperature
2
PULSE ONLY
PULSE OR DC
1.80
80
V F, FORWARD VOLTAGE (V)
I F, FORWARD LED CURRENT (mA)
100
120
1
10
100
IF, FORWARD CURRENT (mA)
1000
Figure 2. LED Forward Voltage
versus LED Forward Current
Motorola Optoelectronics Device Data
1.60
2.4
2.0
1.40
I T, TERMINAL CURRENT (A)
I IFT , FORWARD TRIGGER CURRENT
1.50
WORST CASE UNIT
NORMALIZED TO
TA = 25°C
1.30
1.20
1.10
1.00
0.90
0.80
–40
0
20
40
60
80
TA, AMBIENT TEMPERATURE (°C)
–20
100
1.2
0.8
0.4
0.0
–40
120
Figure 3. Forward LED Trigger Current
versus Ambient Temperature
–20
PD, POWER DISSIPATION (WATTS)
PULSE ONLY
PULSE OR DC
1.80
1.60
1.40
1.20
1.00
TJ = 25°C
0.80
0.60
0.03
120
100°C
0.1
1.0
ITM, INSTANTANEOUS ON–STATE CURRENT (A)
2.0
1.5
MAXIMUM
1.0
MEAN
0.5
0.0
0.01
Figure 6. Power Dissipation
versus Main Terminal Current
IDRM , LEAKAGE CURRENT (NORMALIZED)
120
TA = 25°C
100
80
60
40
20
0.1
1
IT, MAIN TERMINAL CURRENT (A)
Figure 7. Junction Temperature versus Main
Terminal RMS Current (Free Air)
Motorola Optoelectronics Device Data
10
0.1
1.0
IT, MAIN TERMINAL CURRENT (A)
Figure 5. On–State Voltage Drop versus
Output Terminal Current
TJ , JUNCTION TEMPERATURE (°C)
100
2.5
2.00
0
0.01
0
20
40
60
80
TA, AMBIENT TEMPERATURE (°C)
Figure 4. Maximum Allowable On–State RMS Output
Current (Free Air) versus Ambient Temperature
2.20
VTM, MAIN TERMINAL VOLTAGE (V)
1.6
10
100
10
NORMALIZED TO
TA = 25°C
1.0
0.1
0.01
– 40
– 20
0
20
40
60
80
TA, AMBIENT TEMPERATURE (°C)
100
120
Figure 8. Leakage with LED Off versus
Ambient Temperature
3
2.00
1000
STATIC
1.60
NORMALIZED TO
TA = 25°C
1.40
100
1.20
dv / dt (V/ µS)
IH , HOLDING CURRENT (mA)
1.80
1.00
0.80
0.60
COMMUTATING
10
0.40
IT = 30 mA – 2A(RMS)
F = 60 Hz
0.20
0.00
– 40
– 20
0
+ 25
+ 40
+ 60
TA, AMBIENT TEMPERATURE (°C)
+ 80
0
– 40
+ 100
Figure 9. Holding Current versus
Ambient Temperature
– 20
40
0
20
60
80
TA, AMBIENT TEMPERATURE (°C)
100
120
Figure 10. dv/dt versus Ambient Temperature
LED INPUT
VOLTAGE
PIN 7 TO 9
TURN ON
POINTS
Figure 11. Operating Waveforms
Select the value of R1 according to the following formulas:
[1] R1 = (VCC – VF) / Max. IFT (on) per spec.
[2] R1 = (VCC – VF) / 0.050
MOC2A60
VCC
R2
R1
MOV
C1
ZVA
*
LOAD
*ZERO VOLTAGE ACTIVATE CIRCUIT
Typical values for C1 and R2 are 0.01 µF and 39 Ω, respectively. You may adjust these values for specific applications.
The maximum recommended value of C1 is 0.022 µF. See
application note AN1048 for additional information on component values.
The MOV may or may not be needed depending upon the
characteristics of the applied ac line voltage. For applications where line spikes may exceed the 600 V rating of the
MOC2A60, an MOV is required.
Figure 12. Typical Application Circuit
4
Motorola Optoelectronics Device Data
Use care to maintain the minimum spacings as shown.
Safety and regulatory requirements dictate a minimum
of 8.0 mm between the closest points between input
and output conducting paths, Pins 3 and 7. Also, 0.070
inches distance is required between the two output
Pins, 7 and 9.
0.070″ MIN
Keep pad sizes on Pins 7 and 9 as large as possible
for optimal performance.
0.315″ MIN
[8 MM MIN]
Figure 13. PC Board Layout Recommendations
DEVICE UNDER TEST
Each device, when installed in the circuit shown
in Figure 14, shall be capable of passing the following conducted noise tests:
2
3
7
NOISE
SOURCE
9
AC
SUPPLY
• IEEE 472 (2.5 KV)
• Lamp Dimmer (NEMA Part DC33, w 3.4.2.1)
10Ω
• NEMA ICS 2–230.45 Showering Arc
IF = RATED IF
• MIL–STD–461A CS01, CS02 and CS06
0.022µF
MOV
150V
Z LOAD
Figure 14. Test Circuit for Conducted Noise Tests
NO ADDITIONAL HEATSINK
TJ
JUNCTION
TEMPERATURE OF
MOC2A60 . . .
OUTPUT CHIP
{
TC
RθJC
HEAT FLOW
TA
RθCA
WITH ADDITIONAL HEATSINK
TS
TC
TJ
RθJC
RθCS
}
AMBIENT AIR
TEMPERATURE
TA
RθSA
Terms in the model signify:
TA = Ambient temperature
RθSA = Thermal resistance, heat sink to ambient
TS = Optional additional
RθCA = Thermal resistance, case to ambient
TS = heat sink temperature
RθCS = Thermal resistance, heat sink to case
TC = Case temperature
RθJC = Thermal resistance, junction to case
TJ = Junction temperature
PD = Power dissipation
Values for thermal resistance components are: RθCA = 36°C/W/in maximum
Values for thermal resistance components are: RθJC = 8.0°C/W maximum
The design of any additional heatsink will determine the values of RθSA and RθCS.
TC – TA = PD (RθCA)
TC – TA = PD (RθJC) + RθSA), where PD = Power Dissipation in Watts.
Thermal measurements of RθJC
are referenced to the point on
the heat tab indicated with an
‘X’. Measurements should be
taken with device orientated
along its vertical axis.
Figure 15. Approximate Thermal Circuit Model
Motorola Optoelectronics Device Data
5
PACKAGE DIMENSIONS
C
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
DIM
A
B
C
D
E
G
H
J
K
L
N
P
S
V
S
–B–
P
2
3
7
9
N
–T–
SEATING
PLANE
K
V
L
J
G
H
D 4 PL
0.13 (0.005)
T A
M
B
M
INCHES
MIN
MAX
0.965
1.005
0.416
0.436
0.170
0.190
0.025
0.035
0.040
0.060
0.400 BSC
0.040
0.060
0.012
0.018
0.134
0.154
0.200 BSC
0.190
0.210
0.023
0.043
0.695
0.715
0.100 BSC
M
STYLE 2:
PIN 2.
3.
7.
9.
MILLIMETERS
MIN
MAX
24.51
25.53
10.57
11.07
4.32
4.83
0.64
0.89
1.02
1.52
10.16 BSC
1.02
1.52
0.30
0.46
3.40
3.91
5.08 BSC
4.83
5.33
0.58
1.09
17.65
18.16
2.54 BSC
LED CATHODE
LED ANODE
TRIAC MT
TRIAC MT
CASE 417–02
PLASTIC
STANDARD HEAT TAB
ISSUE C
ORDER “F” SUFFIX
HEAT TAB OPTION
(EX: MOC2A60–10F)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
–A–
C
E
W
U
Z RADIUS
Y
Q
X
S
R
–B–
P
2
3
7
9
N
–T–
SEATING
PLANE
K
V
G
J
L
D 4 PL
0.13 (0.005)
H
M
T A
M
B
M
CASE 417A–02
PLASTIC
FLUSH MOUNT HEAT TAB
ISSUE A
6
DIM
A
B
C
D
E
G
H
J
K
L
N
P
Q
R
S
U
V
W
X
Y
Z
INCHES
MIN
MAX
0.965
1.005
0.416
0.436
0.170
0.190
0.025
0.035
0.040
0.060
0.400 BSC
0.040
0.060
0.012
0.018
0.134
0.154
0.200 BSC
0.190
0.210
0.023
0.043
0.057
0.067
0.734
0.754
0.840
0.870
0.593
0.613
0.100 BSC
0.074
0.094
0.265
0.295
0.079
0.089
0.026
0.036
STYLE 1:
PIN 2.
3.
7.
9.
MILLIMETERS
MIN
MAX
24.51
25.53
10.57
11.07
4.32
4.83
0.64
0.89
1.02
1.52
10.16 BSC
1.02
1.52
0.30
0.46
3.40
3.91
5.08 BSC
4.83
5.33
0.58
1.09
1.45
1.70
18.64
19.15
21.34
22.10
15.06
15.57
2.54 BSC
1.88
2.39
6.73
7.49
2.01
2.26
0.66
0.91
LED CATHODE
LED ANODE
TRIAC MT
TRIAC MT
Motorola Optoelectronics Device Data
PACKAGE DIMENSIONS — CONTINUED
ORDER “C” SUFFIX
HEAT TAB OPTION
(EX: MOC2A60–10C)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
–A–
E
–B–
S P
2
–T–
SEATING
PLANE
3
7
N
9
K
V
L
J
H
G
D 4 PL
0.13 (0.005) M T A
M
B
DIM
A
B
C
D
E
G
H
J
K
L
N
P
S
V
INCHES
MIN
MAX
0.965
1.005
0.416
0.436
0.170
0.190
0.025
0.035
0.040
0.060
0.400 BSC
0.040
0.060
0.012
0.060
0.134
0.154
0.200 BSC
0.190
0.210
0.023
0.043
0.439
0.529
0.100 BSC
MILLIMETERS
MIN
MAX
24.51
25.53
10.57
11.07
4.32
4.83
0.64
0.89
1.02
1.52
10.16 BSC
1.02
1.52
0.30
0.46
3.40
3.91
5.08 BSC
4.83
5.33
0.58
1.09
11.15
13.44
2.54 BSC
M
STYLE 1:
PIN 2.
3.
7.
9.
LED CATHODE
LED ANODE
TRIAC MT
TRIAC MT
CASE 417B–01
PLASTIC
CUT HEAT TAB
ISSUE O
Motorola Optoelectronics Device Data
7
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
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associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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8
◊
*MOC2A60-10/D*
Motorola Optoelectronics
Device Data
MOC2A60–10/D