NJRC NJL5901R

NJL5901R
COBP PHOTO REFLECTOR
GENERAL DESCRIPTION
NJL5901R is the compact surface mount type photo reflector in which Lead(Pb) – free reflow soldering is possible. It is
possible to perform reflow soldering temperature 260°C and 2 times. NJL5901R has realized the high output current and the
high S/N ratio combining a high output infrared LED and a high sensitivity Si photo-transister.
FEATURES
OUTLINE (typ.)
• Pb free solder re-flowing permitted(260°C, 2times)
Unit : mm
2.4
0.1
0.65
0.2
0.1
0.65
K
E
• Detecting the location of CD/DVD optical pickup head
LED CENTER
PT CENTER
• Detecting the location of lens for DSC and Cellular
Phone’s camera module
0.1
0.5
0.5
0.1
0.65
0.65
0.1
0.7
0.85
0.8
0.85
0.5
• End detection of VCR tape
0.5 0.4
• Rotation detection of various motors
A:anode
K:cathode
C:collector
E:emitter
PCB Pattern
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
PARAMETER
Emitter
Forward Current (Continuous)
Reverse Voltage (Continuous)
Power Dissipation
0.1
APPLICATIONS
0.1
0.5
0.2
(1.05)
1.6
• High output, high S/N ratio
A
(0.47)
• Built-in visible light cut-off filter
(0.33)
0.5
(0.73)
C
0.1
1.47
• Miniature, thin, surface mount 1.6mm × 2.4mm × 0.8mm
SYMBOL
RATINGS
UNIT
IF
VR
PD
30
6
45
mA
V
mW
Detector
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Current
Collector Power Dissipation
VCEO
VECO
IC
PC
16
6
10
25
V
V
mA
mW
Coupled
Total Power Dissipation
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
Ptot
Topr
Tstg
Tsol
60
-20 to +85
-40 to +85
260
mW
°C
°C
°C
ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C)
PARAMETER
Emitter
Forward Voltage
Reverse Current
Capacitance
SYMBOL
TEST CONDITION
MIN
TYP
MAX
UNIT
—
—
1.4
10
25
—
V
µA
pF
—
—
0.2
—
—
380
2
30
30
—
—
VF
IR
Ct
IF=4mA
VR=6V
VR=0V,f=1MHz
—
—
—
Detector
Dark Current
Collector-Emitter Voltage
ICEO
VCEO
VCE=10V
IC=100µA
16
Coupled
Output Current
Operating Dark Current *1
Rise Time
Fall Time
IO
ICEOD
tr
tf
IF=4mA,VCE=2V,d=0.7mm
IF=4mA,VCE=2V
IO=100µA,VCE=2V,RL=1KΩ,d=0.7mm
IO=100µA,VCE=2V,RL=1KΩ,d=0.7mm
—
120
—
—
—
—
µA
V
µA
µA
µs
µs
*1 Icoed may increase according to the periphery situation of the surface mounted product.
-1-
NJL5901R
OUTPUT CURRENT TEST CONDITION
DARK CURRENT TEST CONDITION
The infrared signal from LED is reflected at the aluminum surface.
Light Sealed Dark Box
0.7mm
Aluminum
Evapolation
Surface
Io
ICEOD
IF
IF
VCE
VCE
RESPONSE TIME TEST CONDITION
0.7mm
Aluminum
Input
Evapolation
90%
Surface
V+
RD
P.G
IF
RL
Output
10%
OSC
tr
tf
Io
EDGE RESPONSE TEST CONDITION
l=0mm
l=0mm
0.7mm
0.7mm
Aluminum
Evaporation
Surface
Aluminum
Evaporation
Surface
-2-
NJL5901R
Forward Current vs. Temperature
100
50
90
45
80
40
70
35
Forward Current IF(mA)
Power Dissipation P(mW)
Power Dissipation vs. Temperature
60
50
Total Power
40
Dissipation
30
20
30
25
20
15
10
Collector Power
10
5
Dissipation
0
0
0
20
40
60
80
100
0
20
Ambient Temperature Ta(°C)
40
60
80
100
Ambient Temperature Ta(°C)
TYPICAL CHARACTERISTICS
Forward Voltage vs. Forward Current
Forward Voltage vs. Temperature
1.6
100
Forward Voltage VF(V)
Forward Current IF(mA)
1.4
10
IF=30mA
1.2
IF=4mA
1
1
0.8
0
1
-40
2
-20
0
20
40
60
80
100
Ambient Temperature Ta(°C)
Forward Voltage VF(V)
Dark Current vs. Temperature
Operating Dark Current vs. Temperature
10000
10
Operating Dark Current Iceod(µA)
Dark Current Iceo(nA)
1000
100
10
1
0.1
1
0.1
Vce=10V
0.01
IF=4mA,Vce=2V
0.001
0.01
-40
-20
0
20
40
60
Ambient Temperature Ta(°C)
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature Ta(°C)
-3-
NJL5901R
Output Current vs. Forward Current
(Ta=25°C)
Output Current vs. Temperature
1000
120
Relative Output Current Io/Io(25°C)(%)
900
Output Current Io(µA)
800
700
600
500
400
300
200
100
80
60
40
20
100
IF=4mA,Vce=2V
IVce=2V,d=0.7m
0
0
0
2
4
6
8
10
-40
Output Characteristics (Ta=25°C)
0
20
40
60
80
100
Vce Saturation (Ta=25°C)
1000
0.5
IF=10mA
900
Collector-Emitter Voltage Vce(V)
800
IF=8mA
Output Current Io(µA)
-20
Ambient Temperature Ta(°C)
Forward Current IF(mA)
700
600
IF=6mA
500
400
IF=4mA
300
200
0.4
0.3
Io=400µA
Io=300µA
Io=200µA
Io=100µA
0.2
0.1
IF=2mA
100
0
0
0
1
2
3
4
5
0.1
1
Collector-Emitter Voltage Vce(V)
10
Forward Current IF(mA)
Output Current vs. Distance (Ta=25°C)
Output Current vs. Edge Distance (Ta=25°C)
120
120
Relative Output Current Io/Io(max.)(%)
Relative Output Current Io/Io(max.)(%)
IF=4mA,Vce=2V,d=0.7mm
100
IF=4mA,Vce=2V
80
60
40
20
0
100
Direction Y
80
60
40
Direction X
20
0
0
1
2
3
Reflector Distance d(mm)
4
5
0
0.4
0.8
1.2
1.6
2
2.4
Edge Distance l(mm)
-4-
NJL5901R
Spectral Response (Ta=25°C)
Switching Time vs. Load Resistance
(Ta=25°C)
1000
120
tr
Vce=2V
Switching Time t(µs)
Relative Response (%)
100
80
60
40
100
tf
td
10
20
0
500
Vce=2V,Io=100µA
1
600
700
800
Wavelength λ(nm)
900
1000
0.1
1
10
Load Resistance RL(k Ω )
-5-
NJL5901R
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
The surface temperature of plastic package is lower than 260 °C.
Soldering Method
1) Reflow Method
Soldering to be done within twice under the recommended condition mentioned below
f
260°C
e
230°C
220°C
d
180°C
150°C
a : Temperature ramping rate
b : Pre-heating temperature
time
c : Temperature ramping rate
d : 220°C or higher time
e : 230°C or higher time
f : Peak temperature
: 1 to 4°C/s
: 150 to 180°C
: 60 to 120s
: 1 to 4°C /s
: Shorter than 60s
: Shorter than 40s
g : Temperature ramping rate
: 1 to 6°C /s
: Lower than 260°C
The temperature of the surface of mold package
Room
Temp.
a
b
c
g
2) Reflow Method (In case of infrared heating)
The temperature profile is same as the above
Avoid direct irradiation to the plastic package because it may absorb the Infrared Radiation and its surface
temperature will be higher than the lead.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS).
Solder the device in short time as soon as possible.
If the device is heated and kept in high temperature for longer time, its reliability would be affected.
2. Cleaning
Avoid washing the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials on the lens surface such as paint, bonding material, etc.
4. Storage
Mount the device as soon as possible after opening the envelope. In order to prevent from degradation by the moisture at
the reflow process, the device is contained in deaeration packaging.
-6-
NJL5901R
NJL5901R Taping Specification
(TE1)
1. Taping Size
1) Carrier tape is used with Styrene type Carbonated Plastic.
2) Cover tape is used with electro statistically prevention treated Polyester type tape.
3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing.
Pull out direction of tape
UNIT : mm
2.0
φ 1.5
0.2
8.0
2.75
3.5
1.75
4.0
1.2
1.8
Carrier Tape
4.0
Cover Tape
2. Taping Strength
Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15°, and the peeling-off
strength is to be within the power of 20 to 70g.
3. Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing.
2) Rolling up specification
2-1) Start rolling
: Carrier tape open space more than 20 Pieces.
2-2) End of rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only.
3) Taping quantity
: 2,000 Pieces.
4) Seal off after putting each reels in a damp proof bag with silica gel (3 bags).
8.5
φ 180
φ 60
φ 13
Label
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
-7-