PANASONIC 2SK1860

Silicon Junction FETs (Small Signal)
2SK1860
Silicon N-Channel Junction FET
Unit: mm
For impedance conversion in low frequency
For electret capacitor microphone
+0.10
0.40 –0.05
+0.02
2.1±0.1
0.12 –0.01
2
2.20±0.15
1
5˚
1.5±0.2
• High mutual conductance gm
• Low noise voltage of NV
5.8±0.2
3
■ Features
■ Absolute Maximum Ratings Ta = 25°C
Symbol
Rating
Unit
Drain-source voltage (Gate open)
VDSO
20
V
Drain-gate voltage (Souse open)
VDGO
20
V
Drain-source current (Gate open)
IDSO
2
mA
Drain-gate current (Souse open)
IDGO
2
mA
Gate-source cutoff current (Drain open)
IGSO
2
mA
(0.95)
(0.5)
1.9±0.1
2.9±0.2
10˚
Power dissipation
PD
200
mW
Operating ambient temperature
Topr
−20 to +80
°C
Storage temperature
Tstg
−55 to +150
°C
0.7±0.1
Parameter
(0.95)
1: Drain
2: Source
3: Gate
Minit3-F1 Package
Marking Symbol: 1H
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Conditions
Min
ID
Typ
Max
Unit
VDS = 4.5 V, CO = 10 pF,
RD = 2.2 kΩ ± 1%
100
600
µA
Drain-sourse cutoff current
(G-S short)
IDSS
VDS = 4.5 V, VGS = 0
95
480
µA
Mutual conductance
gm
VD = 4.5 V, VGS = 0,f = 1 kHz
700
Noise voltage
NV
VD = 4.5 V, RD = 2.2 kΩ ± 1%
CO = 10 pF, A-curve
Voltage gain
Gv1
VD = 4.5 V, RD = 2.2 kΩ ± 1%
CO = 10 pF, eG = 10 mV,f = 1 kHz
−3
2
dB
Gv2
VD = 12 V, RD = 2.2 kΩ ± 1%
CO = 10 pF, eG = 10 mV,f = 1 kHz
0
3.3
dB
Gv3
VD = 1.5 V, RD = 2.2 kΩ ± 1%
CO = 10 pF, eG = 10 mV,f = 1 kHz
−4.5
− 0.3
dB
Drain current
∆Gv · f*
µS
1 600
4
VD = 4.5 V, RD = 2.2 kΩ ± 1%
0
µV
1.5
dB
CO = 10 pF, eG = 10 mV,f = 1 kHz to 70 Hz
Voltage gain difference
∆Gv2 − Gv1
0
3.5
dB
∆Gv1 − Gv3
0
3.5
dB
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. * : ∆Gv · f is assured for AQL0.065%. (the measurment method is used by source-grounded circuit.)
Publication date: August 2003
SJF00039AED
1
2SK1860
ID  VDS
0.45
VGS = 0 V
0.40
0.30
Drain current ID (mA)
0.35
− 0.05 V
0.25
0.20
− 0.1 V
0.15
− 0.15 V
0.10
Ta = −25°C
0.35
0.30
0.25
25°C
0.20
0.15
0.10
− 0.2 V
0.05
85°C
0.05
0
0
2
4
6
8
10
12
Drain-source voltage VDS (V)
0
− 0.6 − 0.5 − 0.4 − 0.3 − 0.2 − 0.1
Gate-source voltage VGS (V)
Yfs  ID
Forward transfer admittance Yfs (mS)
2.0
VDS = 10 V
Ta = 25°C
1.5
1.0
0.5
0
0
0.1
0.2
0.3
0.4
Drain current ID (mA)
2
Yfs  VGS
2.0
VDS = 10 V
0.40
Drain current ID (mA)
ID  VGS
0.50
Ta = 25°C
Forward transfer admittance Yfs (mS)
0.45
SJF00039AED
0
1.8
VDS = 10 V
Ta = 25°C
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
−2.5
−2.0
−1.5
−1.0
− 0.5
Gate-source voltage VGS (V)
0
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
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product or technologies as described in this material.
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electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
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(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
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2002 JUL