ROHM RW1C020UN

1.5V Drive Nch MOSFET
RW1C020UN
zDimensions (Unit : mm)
zStructure
Silicon N-channel MOSFET
WEMT6
zFeatures
1) Low On-resistance.
2) Built-in G-S Protection Diode.
3) Space Saving,
Small Surface Mount Package (WEMT6).
4) Low voltage drive (1.5V drive).
(6)
(5)
(4)
(1)
(2)
(3)
Abbreviated symbol : XK
zInner circuit
zApplications
Switching
(6)
Package
(4)
∗2
zPackaging specifications
Type
(5)
Taping
Code
T2R
Basic ordering unit (pieces)
8000
∗1
RW1C020UN
(1)
(2)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
(3)
(1) Drain
(2) Drain
(3) Gate
(4) Source
(5) Drain
(6) Drain
zAbsolute maximum ratings (Ta=25°C)
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body diode)
Continuous
Pulsed
Continuous
Pulsed
Total power dissipation
Channel temperature
Range of Storage temperature
Symbol
VDSS
VGSS
ID
IDP ∗1
IS
ISP ∗1
PD ∗2
Tch
Tstg
Limits
20
±10
±2
±6
0.5
6
0.7
150
−55 to +150
Unit
V
V
A
A
A
A
W
°C
°C
Symbol
Rth (ch-a) ∗
Limits
179
Unit
°C / W
∗1 Pw≤10µs, Duty cycle≤1%
∗2 When mounted on a ceramic board
zThermal resistance
Parameter
Channel to ambient
∗ When mounted on a ceramic board
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c 2009 ROHM Co., Ltd. All rights reserved.
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1/4
2009.05 - Rev.A
Data Sheet
RW1C020UN
zElectrical characteristics (Ta=25°C)
Parameter
Symbol
IGSS
Gate-source leakage
Drain-source breakdown voltage V(BR) DSS
Zero gate voltage drain current
IDSS
Gate threshold voltage
VGS (th)
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
RDS (on) ∗
Yfs
Ciss
Coss
Crss
td (on)
tr
td (off)
tf
Total gate charge
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
∗
∗
∗
∗
∗
Min.
−
20
−
0.3
−
−
−
−
1.8
−
−
−
−
−
−
−
Typ.
−
−
−
−
75
95
130
170
−
180
45
25
6
17
30
30
Max.
±10
−
1
1.0
105
135
185
240
−
−
−
−
−
−
−
−
Unit
µA
V
µA
V
mΩ
mΩ
mΩ
mΩ
S
pF
pF
pF
ns
ns
ns
ns
∗
−
2.0
−
nC
∗
−
0.6
−
nC
∗
−
0.4
−
nC
Conditions
VGS= ±10V, VDS=0V
ID= 1mA, VGS=0V
VDS= 20V, VGS=0V
VDS= 10V, ID= 1mA
ID= 2A, VGS= 4.5V
ID= 2A, VGS= 2.5V
ID= 1A, VGS= 1.8V
ID= 0.4A, VGS= 1.5V
VDS= 10V, ID= 2A
VDS= 10V
VGS=0V
f=1MHz
VDD 10V
ID= 1A
VGS= 4.5V
RL 10Ω
RG=10Ω
VDD 10V
ID= 2A
VGS= 4.5V
RL 5Ω
RG=10Ω
∗Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter
Forward voltage
Symbol
Min.
Typ.
Max.
Unit
VSD ∗
−
−
1.2
V
Conditions
IS= 2A, VGS=0V
∗Pulsed
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c 2009 ROHM Co., Ltd. All rights reserved.
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2/4
2009.05 - Rev.A
Data Sheet
RW1C020UN
zElectrical characteristics curves
4
VGS= 10V
VGS= 4.5V
VGS= 2.5V
3
VGS= 1.8V
2
VGS= 1.5V
VGS= 1.3V
1
3
VGS= 1.5V
2
VGS= 1.3V
1
0.4
0.6
0.8
1
0
2
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
10
0.01
10
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : R DS(on)[mΩ]
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
0.1
1
1
10
DRAIN-CURRENT : ID [A]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅳ)
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○
10
0.01
VGS= 2.5V
Pulsed
10
0.01
10
DRAIN-CURRENT : ID [A]
Fig.8 Static Drain-Source On-State
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
0.1
1
10
DRAIN-CURRENT : ID [A]
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
1
2
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅲ)
10
0.1
1.5
100
VGS= 1.5V
Pulsed
100
1
GATE-SOURCE VOLTAGE : VGS[V]
DRAIN-CURRENT : ID [A]
100
10
0.01
0.5
Fig.3 Typical Transfer Characteristics
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅱ)
1000
VGS= 1.8V
Pulsed
0
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
0.1
DRAIN-CURRENT : ID [A]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : R DS(on)[mΩ]
8
1000
VGS= 4.5V
Pulsed
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅰ)
1000
6
100
1
0.01
FORWARD TRANSFER
ADMITTANCE : |Yfs| [S]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : R DS(on)[mΩ]
1000
VGS= 1.5V
VGS= 1.8V
VGS= 2.5V
VGS= 4.5V
0.1
0.1
Fig.2 Typical Output Characteristics(Ⅱ)
100
10
0.01
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
DRAIN-SOURCE VOLTAGE : VDS[V]
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics(Ⅰ)
Ta= 25°C
Pulsed
4
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[mΩ]
0.2
1
0.001
0
0
VDS= 10V
Pulsed
VGS= 1.2V
VGS= 1.2V
0
1000
10
Ta=25°C
Pulsed
VGS= 4.5V
VGS= 2.5V
VGS= 1.8V
DRAIN CURRENT : ID [A]
Ta=25°C
Pulsed
DRAIN CURRENT : ID [A]
DRAIN CURRENT : ID [A]
4
10
VDS= 10V
Pulsed
1
Ta= -25°C
Ta=25°C
Ta=75°C
Ta=125°C
0.1
0.01
0.1
1
10
DRAIN-CURRENT : ID [A]
Fig.9 Forward Transfer Admittance
vs. Drain Current
Resistance vs. Drain Current(Ⅴ)
3/4
2009.05 - Rev.A
Data Sheet
RW1C020UN
300
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
250
ID = 2.0A
200
ID = 1.0A
150
100
tf
100
0.5
1
10
td (on)
tr
0
0
Ta=25°C
VDD = 10V
VGS=4.5V
R G=10Ω
Pulsed
td (off)
50
0.01
1.5
1
0
2
4
6
8
10
0.01
0.1
GATE-SOURCE VOLTAGE : VGS[V]
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.10 Reverse Drain Current
vs. Sourse-Drain Voltage
1
10
DRAIN-CURRENT : ID [A]
Fig.11 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
Fig.12 Switching Characteristics
1000
5
Ciss
CAPACITANCE : C [pF]
GATE-SOURCE VOLTAGE : VGS [V]
1000
Ta= 25°C
Pulsed
SWITCHING TIME : t [ns]
VGS=0V
Pulsed
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[mΩ]
REVERSE DRAIN CURRENT : Is [A]
10
4
3
2
Ta=25°C
VDD = 10V
ID = 2A
RG=10Ω
Pulsed
1
0
0
0.5
1
1.5
2
2.5
100
10
Coss
Ta=25°C
f=1MHz
VGS=0V
0.01
3
Crss
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS[V]
TOTAL GATE CHARGE : Qg [nC]
Fig.14 Typical Capacitance
vs. Drain-Source Voltage
Fig.13 Dynamic Input Characteristics
zMeasurement circuit
Pulse Width
VGS
ID
VDS
RL
VDS
50%
10%
D.U.T.
VDD
RG
90%
50%
10%
VGS
10%
90%
td(on)
90%
td(off)
tr
ton
Fig.1-1 Switching Time Measurement Circuit
tr
toff
Fig.1-2 Switching Waveforms
VG
VGS
ID
VDS
Qg
VGS
RL
D.U.T.
IG (Const.)
RG
Qgs
Qgd
VDD
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
zNotice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
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4/4
2009.05 - Rev.A
Notice
Notes
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illustrate the standard usage and operations of the Products. The peripheral conditions must
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However, should you incur any damage arising from any inaccuracy or misprint of such
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R0039A