VISHAY SI4971DY-T1

Si4971DY
New Product
Vishay Siliconix
Dual P-Channel 25-V (G-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
rDS(on) (W)
ID (A)
0.026 @ VGS = - 10 V
- 7.2
0.033 @ VGS = - 6 V
- 6.4
D TrenchFETr Power MOSFET
D 25-V VGS Provides Extra Head Room for
Safe Operation
APPLICATIONS
- 30
D Notebook
- Load Switch
- Battery Charger Switch
S1
S2
SO-8
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
G1
G2
Top View
Ordering Information: Si4971DY
Si4971DY-T1 (with Tape and Reel)
D1
D2
P-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
- 30
Gate-Source Voltage
VGS
"25
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
V
- 7.2
- 5.4
- 5.7
- 4.3
ID
TA = 70_C
Pulsed Drain Current
IDM
continuous Source Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
Unit
TA = 70_C
Operating Junction and Storage Temperature Range
PD
A
- 30
- 1.7
- 0.9
2.0
1.1
1.3
0.7
TJ, Tstg
W
_C
- 55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
46
62.5
80
110
24
32
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1 ” x 1” FR4 Board.
Document Number: 72174
S-03598—Rev. A, 31-Mar-03
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Si4971DY
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = - 250 mA
-1
Typ
Max
Unit
-3
V
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "20 V
"100
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "25 V
"200
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
nA
Drain Source On-State
Drain-Source
On State Resistancea
-1
- 25
VDS = - 5 V, VGS = - 10 V
Voltagea
mA
- 30
A
VGS = - 10 V, ID = - 7.2 A
0.021
0.026
VGS = - 6 V, ID = - 6.4 A
0.025
0.033
gfs
VDS = - 10 V, ID = - 7.2 A
18
VSD
IS = - 1.7 A, VGS = 0 V
- 0.8
- 1.2
30
45
VDS = - 15 V, VGS = - 10 V, ID = - 7.2 A
5.1
rDS(on)
DS( )
Forward Transconductancea
Diode Forward
VDS = - 24 V, VGS = 0 V
VDS = - 24 V, VGS = 0 V, TJ = 55_C
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
11
tr
15
25
75
120
60
90
75
110
Rise Time
Turn-Off Delay Time
VDD = - 15 V, RL = 15 W
ID ^ - 1 A, VGEN = - 10 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
nC
8.9
IF = - 1.7 A, di/dt = 100 A/ms
17
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
30
30
VGS = 10 thru 5 V
24
I D - Drain Current (A)
I D - Drain Current (A)
24
4V
18
12
6
18
12
TC = 125_C
6
3V
25_C
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
1.0
1.5
2.0
- 55_C
2.5
3.0
3.5
4.0
4.5
VGS - Gate-to-Source Voltage (V)
Document Number: 72174
S-03598—Rev. A, 31-Mar-03
Si4971DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
2000
0.04
1600
0.03
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
On-Resistance vs. Drain Current
0.05
VGS = 6 V
VGS = 10 V
0.02
Ciss
1200
800
Coss
400
0.01
Crss
0.00
0
0
6
12
18
24
30
0
5
10
ID - Drain Current (A)
Gate Charge
25
30
On-Resistance vs. Junction Temperature
1.6
VDS = 15 V
ID = 7.2 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
20
VDS - Drain-to-Source Voltage (V)
10
8
6
4
2
VGS = 10 V
ID = 7.2 A
1.4
1.2
1.0
0.8
0
0
10
20
0.6
- 50
30
- 25
0
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.10
r DS(on) - On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
1
0.0
25
TJ - Junction Temperature (_C)
30
I S - Source Current (A)
15
0.08
0.06
ID = 7.2 A
0.04
0.02
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 72174
S-03598—Rev. A, 31-Mar-03
1.2
1.4
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
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Si4971DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.6
50
40
ID = 250 mA
30
Power (W)
V GS(th) Variance (V)
0.4
0.2
0.0
20
- 0.2
10
- 0.4
- 50
- 25
0
25
50
75
100
125
0
10 -2
150
10 -1
TJ - Temperature (_C)
1
10
100
600
Time (sec)
Safe Operating Area, Junction-to-Ambient
100
IDM Limited
rDS(on) Limited
I D - Drain Current (A)
10
P(t) = 0.001
1
P(t) = 0.01
ID(on)
Limited
P(t) = 0.1
0.1
TA = 25_C
Single Pulse
BVDSS Limited
0.01
0.1
P(t) = 1
P(t) = 10
dc
1
10
100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 80_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
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4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72174
S-03598—Rev. A, 31-Mar-03
Si4971DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
Document Number: 72174
S-03598—Rev. A, 31-Mar-03
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
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