VISHAY SI6542DQ

Si6542DQ
Vishay Siliconix
Dual N- and P-Channel 20-V (D-S) MOSFET
VDS (V)
N-Channel
ID (A)
0.09 @ VGS = 10 V
2.5
0.175 @ VGS = 4.5 V
1.8
0.17 @ VGS = –10 V
1.9
0.32 @ VGS = –4.5 V
1.3
20
P-Channel
rDS(on) ()
–20
D1
S2
TSSOP-8
8
D2
7
S2
3
6
S2
4
5
G2
D1
1
S1
2
S1
G1
Si6542DQ
G2
G1
Top View
S
D2
N-Channel MOSFET
P-Channel MOSFET
Parameter
Symbol
N-Channel
P-Channel
Drain-Source Voltage
VDS
20
–20
Gate-Source Voltage
VGS
20
20
2.5
1.9
2.0
1.5
IDM
20
15
IS
1.25
–1.25
Continuous Drain Current (TJ = 150C)a
TA = 25C
TA = 70C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
TA = 25C
Maximum Power Dissipationa
TA = 70C
Operating Junction and Storage Temperature Range
ID
Unit
V
A
1.0
PD
W
0.64
TJ, Tstg
–55 to 150
C
Symbol
N- or P-Channel
Unit
RthJA
125
C/W
Parameter
Maximum Junction-to-Ambienta
Notes
a. Surface Mounted on FR4 Board, t 10 sec.
For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm
Document Number: 70171
S-00873—Rev. F, 01-May-00
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2-1
Si6542DQ
Vishay Siliconix
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Z
G
V l
D i Current
C
Zero
Gate
Voltage
Drain
On-State Drain Currenta
a
D i S
O S
R i
Drain-Source
On-State
Resistance
Forward Transconductancea
Diode Forward Voltagea
VGS(th)
IGSS
IDSS
ID(on)
rDS(on)
gfs
VSD
VDS = VGS, ID = 250 mA
N-Ch
1.0
VDS = VGS, ID = –250 mA
P-Ch
–1.0
V
VDS = 0 V, VGS = "20 V
"100
VDS = 20 V, VGS = 0 V
N-Ch
1
VDS = –20 V, VGS = 0 V
P-Ch
–1
VDS = 20 V, VGS = 0 V, TJ = 55C
N-Ch
25
VDS = –20 V, VGS = 0 V, TJ = 55C
P-Ch
VDS = 5 V, VGS = 10 V
N-Ch
14
VDS = –5 V, VGS = –10 V
P-Ch
–10
nA
A
mA
–25
A
VGS = 10 V, ID = 2.5 A
N-Ch
0.065
0.09
VGS = –10 V, ID = 1.9 A
P-Ch
0.13
0.17
VGS = 4.5 V, ID = 1.8 A
N-Ch
0.100
0.175
VGS = –4.5 V, ID = 1.3 A
P-Ch
0.26
0.32
VDS = 15 V, ID = 2.5 A
N-Ch
5
VDS = –15 V, ID = – 1.9 A
P-Ch
3
IS = 1.25 A, VGS = 0 V
N-Ch
0.8
1.2
IS = –1.25 A, VGS = 0 V
P-Ch
0.8
–1.2
N-Ch
7
10
10
W
S
V
Dynamicb
Total Gate Charge
Gate-Source Charge
Qg
Qgs
P-Ch
7
N-Ch
0.9
P-Ch
1.3
N-Ch
2.1
P-Ch
1.7
N-Ch
11
20
P-Ch
9
20
N-Channel
N
Ch
l
VDD = 10 V, RL = 10 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
N-Ch
11
20
P-Ch
12
25
P-Channel
VDD = –10
10 V
V, RL = 10 W
ID ^ –1
A,
V
1
10 V, RG = 6 W
GEN = –10
N-Ch
16
30
P-Ch
17
30
N-Ch
6
15
P-Ch
6
15
IF = 1.25 A, di/dt = 100 A/ms
N-Ch
45
70
IF = –1.25 A, di/dt = 100 A/ms
P-Ch
35
70
N-Channel
N
Ch
Channel
l
VDS = 10 V, VGS = 10 V, ID = 2.5 A
P-Channel
VDS = –10
10 V
V, VGS = –10
10 V
V, ID = –1.9
19A
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
Qgd
td(on)
tr
td(off)
tf
trr
C
nC
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
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Document Number: 70171
S-00873—Rev. F, 01-May-00
Si6542DQ
Vishay Siliconix
Output Characteristics
Transfer Characteristics
20
20
6V
25C
5V
12
TC = –55C
16
VGS = 10, 9 ,8 ,7 V
I D – Drain Current (A)
I D – Drain Current (A)
16
8
4V
4
125C
12
8
4
3V
0
0
0
1
2
3
4
5
0
2
4
On-Resistance vs. Drain Current
10
Capacitance
1000
0.30
0.25
800
VGS = 4.5 V
0.20
C – Capacitance (pF)
r DS(on) – On-Resistance ( Ω )
8
VGS – Gate-to-Source Voltage (V)
VDS – Drain-to-Source Voltage (V)
0.15
0.10
VGS = 10 V
600
Ciss
400
Coss
200
0.05
Crss
0
0
0
2
4
6
8
0
10
4
ID – Drain Current (A)
2.0
VGS = 10 V
ID = 2.5 A
6
4
2
0
0
1
2
3
4
5
6
Qg – Total Gate Charge (nC)
Document Number: 70171
S-00873—Rev. F, 01-May-00
12
16
20
On-Resistance vs. Junction Temperature
VGS = 10 V
ID = 2.5 A
r DS(on) – On-Resistance ( Ω )
(Normalized)
8
8
VDS – Drain-to-Source Voltage (V)
Gate Charge
10
V GS – Gate-to-Source Voltage (V)
6
7
8
1.5
1.0
0.5
0
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (C)
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Si6542DQ
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.40
20
0.35
r DS(on) – On-Resistance ( Ω )
TJ = 150C
I S – Source Current (A)
10
TJ = 25C
0.30
ID = 2.5 A
0.25
0.20
0.15
0.10
0.05
0.00
1.0
0.4
0.6
0.8
1.0
1.2
1.4
0
1.6
VSD – Source-to-Drain Voltage (V)
2
4
6
8
10
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
1.0
120
100
V GS(th) Variance (V)
0.5
80
Power (W)
ID = 250 µA
0.0
60
40
–0.5
20
–1.0
–50
0
–25
0
25
50
75
100
125
150
0.001
0.010
TJ – Temperature (C)
0.100
1.000
10.000
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 125C/W
0.02
3. TJM – TA = PDMZthJA(t)
Single Pulse
0.01
10–4
10–3
10–2
4. Surface Mounted
10–1
1
10
30
Square Wave Pulse Duration (sec)
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Document Number: 70171
S-00873—Rev. F, 01-May-00
Si6542DQ
Vishay Siliconix
Output Characteristics
Transfer Characteristics
15
15
VGS = 10, 9 V
12
12
8V
I D – Drain Current (A)
I D – Drain Current (A)
TC = –55C
7V
6V
9
5V
6
4V
3
125C
25C
9
6
3
3V
0
0
0
1
2
3
4
5
0
2
4
8
10
VGS – Gate-to-Source Voltage (V)
VDS – Drain-to-Source Voltage (V)
Capacitance
On-Resistance vs. Drain Current
0.5
1000
0.4
800
VGS = 4.5 V
C – Capacitance (pF)
r DS(on) – On-Resistance ( Ω )
6
0.3
0.2
VGS = 10 V
0.1
Ciss
600
400
Coss
200
Crss
0
0
0
2
4
6
8
10
0
4
ID – Drain Current (A)
r DS(on) – On-Resistance ( Ω )
(Normalized)
V GS – Gate-to-Source Voltage (V)
2.0
VGS = 10 V
ID = 1.9 A
8
6
4
2
0
0
2
4
6
Qg – Total Gate Charge (nC)
Document Number: 70171
S-00873—Rev. F, 01-May-00
12
16
20
VDS – Drain-to-Source Voltage (V)
Gate Charge
10
8
8
1.5
On-Resistance vs. Junction Temperature
VGS = 10 V
ID = 1.9 A
1.0
0.5
0
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (C)
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2-5
Si6542DQ
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.7
20
0.6
r DS(on) – On-Resistance ( Ω )
I S – Source Current (A)
TJ = 150C
10
TJ = 25C
0.5
0.4
ID = 1.9 A
0.3
0.2
0.1
0
0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
VSD – Source-to-Drain Voltage (V)
2
4
6
8
10
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
1.0
120
ID = 250 µA
100
80
Power (W)
V GS(th) Variance (V)
0.5
0.0
60
40
–0.5
20
–1.0
–50
–25
0
25
50
75
100
125
0
150
0.001
0.010
TJ – Temperature (C)
0.100
1.000
10.000
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 125C/W
0.02
3. TJM – TA = PDMZthJA(t)
Single Pulse
0.01
10–4
10–3
10–2
4. Surface Mounted
10–1
1
10
30
Square Wave Pulse Duration (sec)
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2-6
Document Number: 70171
S-00873—Rev. F, 01-May-00