SN74GTL3004 www.ti.com .................................................................................................................................................. SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008 SELECTABLE GTL VOLTAGE REFERENCE FEATURES 1 • • • • • • VDD Range: 3.0 V to 3.6 V VTT Range: 1 V to 1.3 V Provides Selectable GTL VREF – 0.615 × VTT – 0.63 × VTT – 0.65 × VTT – 0.67 × VTT ±1% Resistor Ratio Tolerance Ambient Temperature Range: –40°C to 85°C ESD Protection Exceeds the Following Levels Tests (Tested Per JESD-22): – 2500-V Human-Body Model (A114-B, Class II) – 250-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) DCK PACKAGE (TOP VIEW) VDD 1 6 VTT GND 2 5 GTL_REF S0 3 4 S1 DESCRIPTION/ORDERING INFORMATION The SN74GTL3004 provides for a selectable GTL Voltage Reference (GTL VREF). The value of the GTL VREF can be adjusted using S0 and S1 select pins. The S0 and S1 pins contain glitch-suppression circuitry for excellent noise immunity. When left floating, the S0 and S1 control input pins have 100-kΩ pullups that set the GTL VREF default value to the 0.67 × VTT ratio (S0 = 1 and S1 =1). ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE SOT (SC70) – DCK (1) (2) Tape and reel ORDERABLE PART NUMBER SN74GTL3004DCKR TOP-SIDE MARKING 2TK Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated SN74GTL3004 SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008 .................................................................................................................................................. www.ti.com LOGIC DIAGRAM VTT R1 N1 R2 N2 R3 GTL_REF N3 R4 N4 VCC R5 100 kΩ 100 kΩ S0 Control Logic S1 FUNCTION TABLE 2 S1 S0 RATIO SET 0 0 0.615 × VTT 0 1 0.63 × VTT 1 0 0.65 × VTT 1 1 0.67 × VTT Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN74GTL3004 SN74GTL3004 www.ti.com .................................................................................................................................................. SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008 ABSOLUTE MINIMUM AND MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VDD Power supply voltage range –0.3 4.6 V VTT Termination voltage range (2) –0.3 4.6 V –0.3 VDD + 0.3 V –0.3 VDD + 0.3 VIN Control input voltage range (2) VGTL_REF Resistor output voltage range (2) UNIT V IIK Input clamp current VIN < 0 –18 mA IOK Output clamp current VO < 0 –18 mA Continuous current through VDD or GND θJA Package thermal impedance (3) Tstg Storage temperature range (1) (2) (3) DCK package –65 100 mA 259 °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) PARAMETER MIN TYP MAX UNIT VDD Power supply voltage 3 3.3 3.6 V VTT Termination voltage 1 1.1 1.3 V VIH High-level control input voltage VIL Low-level control input voltage VI Control input voltage IOUT IGTL_REF, GTL_REF output current PW Control input pulse width 110 TA Operating free-air temperature –40 (1) VDD × 0.65 V VDD × 0.35 0 0 V VDD V 10 µA ns °C 85 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow of Floating CMOS Inputs, literature number SCBA004. ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range, TA = –40°C to 85°C, VDD = 3.3 V ±10%, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS VIK Control VDD = 3.6 V, IIN = –18 mA IIN Control VDD = 3.6 V, VIN = GND IDD TYP MAX VDD = 3.6 V, VIN = GND, IO = 0 mA R End-to-end resistance GTL VREF accuracy (1) (1) MIN VDD = 3.6 V, VTT = 1.1 V, IO = 0 mA 4.25 7.12 UNIT –1.8 V 43 µA 85 µA 10.6 kΩ IO = 0 µA, See Figure 1 –1 1 IO = 10 µA, See Figure 1 –7 7 % GTL VREF accuracy is used to compare measured GTL_VREF voltage versus expected GTL_VREF voltage as determined by control inputs S0 and S1. The resistor ratio tolerance is incorporated into this parameter. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range,, TA = –40°C to 85°C, VDD = 3.3 V ±10%, GND = 0 V (unless otherwise noted) PARAMETER PSR TEST CONDITIONS Power supply rejection MIN TYP MAX –58 Pulse rejection dB 40 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN74GTL3004 UNIT ns 3 SN74GTL3004 SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008 .................................................................................................................................................. www.ti.com PARAMETER MEASUREMENT INFORMATION VCC VTT R1 N1 GTL_VREF accuracy is used to compare measured GTL_VREF voltage versus expected GTL_VREF voltage as determined by control inputs S0 and S1. R2 N2 VREF R3 S1 S0 Calculated VREF 0 0 0.615 X VTT 0 1 0.63 X VTT 1 0 0.65 X VTT 1 1 0.67 X VTT N3 R4 N4 R5 % Accuracy = (((VREF measured/VREF calculated) – 1)/100) S0 Logic S1 Figure 1. GTL_REF Accuracy 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN74GTL3004 PACKAGE OPTION ADDENDUM www.ti.com 19-Mar-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74GTL3004DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74GTL3004DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74GTL3004DCKR Package Package Pins Type Drawing SC70 DCK 6 SPQ Reel Reel Diameter Width (mm) W1 (mm) 3000 180.0 9.2 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 2.24 2.34 1.22 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74GTL3004DCKR SC70 DCK 6 3000 205.0 200.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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