STPS2L30A ® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 2A VRRM 30 V Tj (max) 150 °C VF (max) 0.375 V FEATURES AND BENEFITS n n n n LOW COST DEVICE WITH LOW DROP FORWARD VOLTAGE FOR LESS POWER DISSIPATION. OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH LEADS TO THE HIGHEST YIELD IN THE APPLICATIONS. HIGH POWER SURFACE MOUNT MINIATURE PACKAGE. AVALANCHE CAPABILITY SPECIFIED SMA JEDEC DO-214AC DESCRIPTION Single Schottky rectifier suited to Switched Mode Power Supplies and high frequency DC to DC converters, freewheel diode and integrated circuit latch up protection. Packaged in SMA, this device is especially intended for use in parallel with MOSFETs in synchronous rectification. ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) RMS forward current 10 A IF(AV) Average forward current TL = 120°C δ = 0.5 2 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A IRRM Repetitive peak reverse current tp = 2 µs F = 1kHz square 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 1 A PARM Repetitive peak avalanche power tp = 1µs 1500 W - 65 to + 150 °C 150 °C Tstg Tj Storage temperature range Maximum operating junction temperature * Tj = 25°C dV/dt Critical rate of rise of reverse voltage 10000 dPtot 1 thermal runaway condition for a diode on its own heatsink * : < dTj Rth( j − a ) July 2003 - Ed: 3A V/µs 1/5 STPS2L30A THERMAL RESISTANCES Symbol Parameter Rth (j-l) Junction to lead Value Unit 30 °C/W STATIC ELECTRICAL CHARACTERISTICS Symbol Parameters Tests Conditions IR * Reverse leakage current Tj = 25°C Min. Typ. VR = VRRM Tj = 100°C VF * Forward voltage drop Tj = 25°C Unit 200 µA 15 mA 0.45 V 6 IF = 2 A Tj = 125°C Tj = 25°C Max. 0.325 0.375 IF = 4 A 0.53 Tj = 125°C 0.43 0.51 * tp = 380 µs, δ < 2% Pulse test : To evaluate the conduction losses use the following equation : P = 0.24 x IF(AV) + 0.068 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. 1.2 1.0 0.8 PF(av)(W) δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 δ=1 0.6 0.4 T 0.2 tp δ=tp/T IF(av) (A) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2/5 Fig. 2: Average forward current versus ambient temperature (δ=0.5). 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 IF(av)(A) Rth(j-a)=Rth(j-l) Rth(j-a)=120°C/W T δ=tp/T 0 Tamb(°C) tp 25 50 75 100 125 150 STPS2L30A Fig. 3: Normalized avalanche power derating versus pulse duration. Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 PARM(tp) PARM(25°C) 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 1 0 10 100 1000 Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 0 1.0 8 0.8 0.6 Ta=25°C 4 50 75 100 125 Ta=50°C 0.4 Ta=100°C 0.2 Zth(j-a)/Rth(j-a) δ = 0.5 T δ = 0.2 2 IM δ = 0.1 t δ=0.5 t(s) 0 1E-3 1E-2 1E-1 1E+0 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). 150 Fig. 6: Relative variation of thermal impedance junction to ambient versus pulse duration. 10 6 25 0.0 1E-2 1E-1 δ=tp/T tp(s) Single pulse 1E+0 1E+1 tp 1E+2 5E+2 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) IR(mA) 500 1E+2 F=1MHz Tj=25°C Tj=150°C 1E+1 Tj=125°C 1E+0 Tj=100°C 100 1E-1 Tj=25°C 1E-2 VR(V) VR(V) 1E-3 0 5 10 15 20 25 30 10 1 2 5 10 20 30 3/5 STPS2L30A Fig. 9-1: Forward voltage drop versus forward current (maximum values, high level). 10.00 Fig. 9-2: Forward voltage drop versus forward current (typical values, low level). IFM(A) 10.00 IFM(A) Tj=125°C Tj=150°C Typical values Tj=150°C 1.00 Tj=125°C Tj=25°C Tj=25°C 1.00 0.10 Tj=100°C VFM(V) VFM(V) 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Fig. 9-3: Forward voltage drop versus forward current (maximum values, low level). 0.10 0.0 0.2 0.3 0.4 0.5 0.6 0.7 Fig. 10: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm). Rth(j-a) (°C/W) IFM(A) 3.0 Typical values Tj=150°C 2.5 140 Tj=25°C Tj=125°C 2.0 0.1 120 100 Tj=100°C 1.5 80 60 1.0 0.5 VFM(V) 0.0 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 4/5 40 20 0 S(Cu) (cm²) 0 1 2 3 4 5 STPS2L30A PACKAGE MECHANICAL DATA SMA DIMENSIONS E1 REF. D Millimeters Inches Min. Max. Min. Max. A1 1.90 2.70 0.075 0.106 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 E A1 A2 C L b FOOT PRINT DIMENSIONS (in millimeters) 1.65 1.45 n n 2.40 1.45 Ordering type Marking Package Weight Base qty Delivery mode STPS2L30A G30 SMA 0.068g 5000 Tape & reel BAND INDICATES CATHODE EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. 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