INTEGRATED CIRCUITS DATA SHEET TDA1386T Noise shaping filter DAC Product specification Supersedes data of 1995 Dec 11 File under Integrated Circuits, IC01 1998 Jan 06 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T FEATURES GENERAL DESCRIPTION General The TDA1386T is a dual CMOS digital-to-analog converter with up-sampling filter and noise shaper. The combination of oversampling up to 4fs, noise shaping and continuous calibration conversion ensures that only simple 1st order analog post filtering is required. • Double-speed mode • Digital volume control • Soft mute function • 12 dB attenuation The TDA1386T supports the I2S-bus data input mode with word lengths of up to 20 bits and the LSB fixed serial data input format with word lengths of 16, 18 or 20 bits. Two cascaded IIR filters increase the sampling rate 4 times. • Low power dissipation • Digital de-emphasis. Easy application The DACs are of the continuous calibration type and incorporate a special data coding. This ensures a high signal-to-noise ratio, wide dynamic range and immunity to process variation and component ageing. • Voltage output • Only 1st-order analog post-filtering required • Operational amplifiers and digital filter integrated • 256fs system clock (fsys) • I2S-bus Two on-board operational amplifiers convert the digital-to-analog current to an output voltage. or 16, 18 or 20 bits LSB fixed serial input format • Single rail supply. High performance • Superior signal-to-noise ratio • Wide dynamic range • No zero crossing distortion • Inherently monotonic • Continuous calibration digital-to-analog conversion combined with noise shaping technique. ORDERING INFORMATION PACKAGE TYPE NUMBER TDA1386T 1998 Jan 06 NAME DESCRIPTION VERSION SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 2 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T QUICK REFERENCE DATA All power supply pins VDD and GND must be connected to the same external supply unit. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDDD digital supply voltage 4.5 5.0 5.5 V VDDA analog supply voltage 4.5 5.0 5.5 V VDDO operational amplifier supply voltage 4.5 5.0 5.5 V IDDD digital supply current VDDD = 5 V; at code 00000H − 5 8 mA IDDA analog supply current VDDA = 5 V; at code 00000H − 3 5 mA IDDO operational amplifier supply current VDDO = 5 V; at code 00000H − 2 4 mA VFS(rms) full-scale output voltage (RMS value) VDDD = VDDA = VDDO = 5 V; ROL > 5 kΩ 0.935 1.1 1.265 V RL output load resistance 5 − − kΩ at 0 dB signal level; fi = 1 kHz − −70 − dB − 0.032 − % at −60 dB signal level; fi = 1 kHz − −42 −32 dB − 0.8 2.5 % Analog signals DAC performance (THD + N)/S total harmonic distortion plus noise-to-signal ratio S/N signal-to-noise ratio no signal; A-weighted − −108 −96 dB BR input bit rate at data input fs = 44.1 kHz; normal speed − − 2.822 bits fs = 44.1 kHz; double speed − − 5.645 bits fsys clock frequency 6.4 − 18.432 MHz Tamb operating ambient temperature −40 − +85 °C 1998 Jan 06 3 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T BLOCK DIAGRAM Fig.1 Block diagram. 1998 Jan 06 4 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T PINNING SYMBOL PIN DESCRIPTION VDDA 1 analog supply voltage AGND 2 analog ground TEST1 3 test input 1; pin should be connected to DGND BCK 4 bit clock input WS 5 word select input DATA 6 data input CKSL1 7 format selection 1 CKSL2 8 format selection 2 DGND 9 digital ground VDDD 10 digital supply voltage TEST2 11 test input 2; pin should be connected to DGND SYSCLK 12 system clock 256fs APP3 13 application mode 3 input APPL 14 application mode selection input APP2 15 application mode 2 input APP1 16 application mode 1 input APP0 17 application mode 0 input VOL 18 left channel output FILTCL 19 capacitor for left channel 1st-order filter function, should be connected between pins 19 and 18 FILTCR 20 capacitor for right channel 1st-order filter function, should be connected between pins 20 and 21 VOR 21 right channel output Vref 22 internal reference voltage for output channels (0.5VDDO typ.) OGND 23 operational amplifier ground VDDO 24 operational amplifier supply voltage 1998 Jan 06 Fig.2 Pin configuration. 5 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T The TDA1386T supports the following data input modes: FUNCTIONAL DESCRIPTION • I2S-bus with data word length of up to 20 bits. The TDA1386T CMOS DAC incorporates an up-sampling filter, a noise shaper, continuous calibrated current sources and operational amplifiers. • LSB fixed serial format with data word length of 16, 18 or 20 bits. As this format idles on the MSB it is necessary to know how many bits are being transmitted. System clock and data input format The data input formats are illustrated in Fig.7. Left and right data-channel words are time multiplexed. The TDA1386T accommodates slave mode only consequently, in all applications, the system devices must provide the 256fs system clock. Table 1 Data input format and system clock SYSTEM CLOCK CKSL1 CKSL2 DATA INPUT FORMAT NORMAL SPEED DOUBLE SPEED 0 0 I2S-bus 256fs 128fs 0 1 LSB fixed 16 bits 256fs 128fs 1 0 LSB fixed 18 bits 256fs 128fs 1 1 LSB fixed 20 bits 256fs 128fs In the pseudo-static application mode the TDA1386T is pin compatible with the TDA1305T slave mode. The correspondence between TDA1386T pin number, TDA1386T pin name, TDA1305T pin name and a description of the effects is given in Table 2. Device operation When the APPL pin is held HIGH and APP3 is held LOW, pins APP0, APP1 and APP2 form a microcontroller interface. When the APPL pin is held LOW, pins APP0, APP1, APP2 and APP3 form pseudo-static application pins (TDA1305T pin compatible). PSEUDO-STATIC APPLICATION MODE (APPL = LOGIC 0) In this mode, the device operation is controlled by pseudo-static application pins (APP0: attenuation mode control; APP1: double-speed mode control; APP2: mute mode control and APP3: de-emphasis mode control). Table 2 Pseudo-static application mode PIN NAME PIN NUMBER TDA1305T FUNCTION LOGIC VALUE APP0 17 ATSB 0 12 dB attenuation (from full scale) activated (only if MUSB = 1) 1 full scale (only if MUSB = 1) APP1 16 DSMB APP2 15 MUSB APP3 13 DEEM1 1998 Jan 06 DESCRIPTION 0 double-speed mode 1 normal-speed mode 0 samples decrease to mute level 1 level in accordance with ATSB 0 de-emphasis OFF (44.1 kHz) 1 de-emphasis ON (44.1 kHz) 6 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T MICROCONTROLLER APPLICATION MODE (APPL = LOGIC 1, APP3 = LOGIC 0) MICROCONTROLLER WRITE OPERATION SEQUENCE In this mode, the device operation is controlled by a set of flags in an 8-bit mode control register. The 8-bit mode control register is written by a microprocessor interface (pin APPL = 1, APP0 = Data, APP1 = Clock, APP2 = RAB and APP3 = 0). • Microprocessor data is clocked into the internal shift register on the LOW-to-HIGH transition at pin APP1. The correspondence between serial to parallel conversion, mode control flags and a summary of the effect of the control flags is given in Table 3. Figures 3 and 4 illustrate the mode set timing. • If more data is clocked into the TDA1386T before the LOW-to-HIGH transition on pin APP2 then only the last 8 bits are used. • APP2 is held LOW by the microcontroller. • Data D(7 to 0) is latched into the appropriate control register on the LOW-to-HIGH transition of pin APP2 (with APP1 HIGH). • If less data is clocked into the TDA1386T unpredictable operation will result. • If the LOW-to-HIGH transition of pin APP2 occurs with APP1 LOW, the command will be disregarded. Fig.3 Microcontroller timing. 1998 Jan 06 7 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T MICROCONTROLLER WRITE OPERATION SEQUENCE; It should be noted that APP1 must stay HIGH between APP2 pulses. A minimum pause of 22 µs is necessary between any two step-up or step-down commands. REPEAT MODE The same command can be repeated several times (e.g. for fade function) by applying APP2 pulses as shown in Fig.4. Fig.4 Microcontroller timing; repeat mode. Table 3 Microcontroller mode control register BIT POSITION FUNCTION DESCRIPTION ACTIVE LEVEL D7 ATSB 12 dB attenuation (from full scale) LOW D6 DSMB double speed LOW D5 MUSB mute LOW D4 DEEM de-emphasis HIGH D3 FS full scale HIGH D2 INCR increment HIGH D1 DECR decrement HIGH D0 − 1998 Jan 06 reserved 8 − Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T Volume control VOLUME CONTROL IN PSEUDO-STATIC APPLICATION MODE A digital level control is incorporated on the TDA1386T which performs the function of soft mute and attenuation (pseudo-static application mode) or soft mute, attenuation, fade, increment and decrement (microcontroller application mode). The volume control of both channels can be varied in small step changes, determined by the value of the internal fade counter according to: In the pseudo-static application mode (APPL = logic 0) the digital audio output level is controlled by APP0 (attenuation) and APP2 (mute) so only the final volume levels full scale, 12 dB (attenuate) and mute (−infin dB) can be selected. The mute function has priority over the attenuation function. Accordingly, if MUSB is LOW, the state of ATSB has no effect. An example of volume control in this application mode is illustrated in Fig.5. Audio level = counter × maximum level/120. Where the counter is a 7-bit binary number between 0 and 120. The time taken for mute to vary from 120 to 0 is 120/fs. For example, when fs = 44.1 kHz, the time taken is approximately 3 ms. Fig.5 Volume control; pseudo-static application mode. 1998 Jan 06 9 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T To control the fade counter in a continuous way, the INCREMENT and DECREMENT commands are available (fade control registers D1 and D2). They will increment and decrement the counter by 1 for each register write operation. When issuing more than 1 step-up or step-down command in sequence, the write repeat mode may be used (see microprocessor application mode). An example of volume control in this application mode is illustrated in Fig.6. VOLUME CONTROL IN MICROCONTROLLER APPLICATION MODE In the microcontroller application mode (APPL = logic 1, APP3 = logic 0) the audio output level is controlled by volume control bits ATSB, MUSB, FS, INCR and DECR. Mute is activated by sending the MUSB command to the mode control register via the microcontroller interface. The audio output level will be reduced to zero in a maximum 120 steps (depending on the current position of the fade counter) and taking a maximum of 3 ms. Mute, attenuation and full scale are synchronized to prevent operation in the middle of a word. • The counter is preset to 120 by the full scale command. • The counter is preset to 30 by the attenuate command when its value is more then 30. If the value of the counter is less than 30 dB the ATSB command has no effect. • The counter is preset to 0 by the mute command MUSB. • Attenuation (−12 dB) is activated by sending the ATSB command to the fade control register (D7). • Attenuation and mute are cancelled by sending the full scale command to the fade control register (D3). (1) INCR and DECR in repeat mode. Fig.6 Volume control; microcontroller application mode. 1998 Jan 06 10 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T There are two recommended application situations within the microcontroller mode: Double-speed mode The double-speed mode is controlled by the DSMB bit at register D6 (microcontroller application mode) or by activating the APP1 pin (pseudo static application mode). When the control bit is active LOW the device operates in the double-speed mode. • The customer wants to use the microcontroller interface without the volume setting facility. In this event the operation is as follows: – Mute ON; by sending the MUSB command – Mute OFF; by sending the FS command Oversampling filter and noise shaper – Attenuation ON; by sending the ATSB command The digital filter is a four times oversampling filter. It consists of two sections which each increase the sample rate by 2. The noise-shaper operates on 4fs and reduces the in-band noise density. – Attenuation OFF; by sending the FS command. It is possible to switch from ‘Attenuation ON’ to ‘Mute ON’ but not vice-versa. • Incorporating the volume control feature operates as follows: DAC and operational amplifiers – Mute ON; by sending the MUSB command the microcontroller has to store the previous volume setting. In this noise shaping DAC a special data code and bidirectional current sources are used in order to achieve true low-noise performance. The special data code guarantees that only small values of current flow to the output during small signal passages while larger positive or negative values are generated using the bidirectional current sources. The noise shaping DAC uses the continuous calibration conversion technique. The DAC currents are repeatedly generated from one single reference current. – Mute OFF; by sending succeeding INCR commands until the previous volume is reached. – Attenuation ON; by sending succeeding DECR commands until a relative downstep of −12 dB is reached. The microcontroller has to store the previous volume. – Attenuation OFF; by sending the succeeding INCR commands until the previous volume is reached. The operational amplifiers and the internal conversion resistors RCONV1 and RCONV2 convert the DAC current to an output voltage available at VOL and VOR. Connecting an external capacitor between FILTCL and VOL, FILTCR and VOR respectively provides the required first-order post filtering. – Volume UP; by sending successive INCR commands. – Volume DOWN; by sending successive DECR commands. De-emphasis A digital de-emphasis is implemented in the TDA1386T. By selecting the DEEM bit at register D4 (microcontroller application mode) or activating the APP0 pin (pseudo-static application mode), de-emphasis can be applied by means of an IIR filter. De-emphasis is synchronized to prevent operation in the middle of a word. 1998 Jan 06 11 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX UNIT VDDD digital supply voltage note 1 − 7.0 V VDDA analog supply voltage note 1 − 7.0 V VDDO operational amplifiers supply voltage note 1 − 7.0 V Txtal maximum crystal temperature − +150 °C Tstg storage temperature −65 +125 °C Tamb operating ambient temperature −40 +85 °C Ves electrostatic handling note 2 −2000 +2000 V note 3 −200 +200 V Notes 1. All VDD and GND connections must be made to the same power supply. 2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor. 3. Equivalent to discharging a 200 pF capacitor via a 2.5 µH series inductor. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air QUALITY SPECIFICATION In accordance with “UZW-BO/FQ-0601”. 1998 Jan 06 12 VALUE UNIT 69 K/W Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T DC CHARACTERISTICS VDDD = VDDA = VDDO = 5 V; Tamb = 5 °C; all voltages referenced to ground (pins 2, 9 and 23); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX UNIT VDDD digital supply voltage (pin 10) note 1 4.5 5.0 5.5 V VDDA analog supply voltage (pin 1) note 1 4.5 5.0 5.5 V VDDO operational amplifier supply voltage (pin 24) note 1 4.5 5.0 5.5 V IDDD digital supply current fsys = 11.28 MHz − 5 8 mA IDDA analog supply current at digital silence − 3 6 mA IDDO operational amplifier supply current no operational amplifier load resistor − 2 4 mA Ptot total power dissipation fsys = 11.28 MHz; digital silence; no operational amplifier load resistor − 50 90 mW VIH HIGH level digital input voltage (pins 3 to 8 and 11 to 17) 0.7VDDD − VDDD + 0.5 V VIL LOW level digital input voltage (pins 3 to 8 and 11 to 17) −0.5 − 0.3VDDD V Rpd internal pull-down resistor to VSSD (pins 3 and 11) 17 − 134 kΩ ILI input leakage current − − 10 µA CI input capacitance Vref reference voltage (pin 22) RCONV current-to-voltage conversion resistor VFS(rms) full scale output voltage (RMS value) RL output load resistance with respect to OGND RL > 5 kΩ; note 2 − − 10 pF 0.45VDDO 0.5VDDO 0.55VDDO V 2.4 3.0 3.6 kΩ 0.935 1.1 1.265 V 5 − − kΩ Notes 1. All power supply pins (VDD and GND) must be connected to the same external power supply unit. 2. RL is the AC impedance of the external circuitry connected to the audio outputs of the application circuit. 1998 Jan 06 13 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T AC CHARACTERISTICS (ANALOG) VDDD = VDDA = VDDO = 5 V; Tamb = 25 °C; all voltages referenced to ground (pins 2, 9 and 23); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX UNIT DACs fripple = 1 kHz; Vripple(p-p) = 100 mV; C22 = 10 µF − 40 − dB − − 0.5 dB −110 −85 dB −70 − dB SVRR supply voltage ripple rejection pins 9 and 16 ∆Vo(DAC) unbalance between the 2 DAC maximum volume voltage outputs (pins 18 and 21) αDAC crosstalk between the 2 DAC one output digital silence − voltage outputs (pins 18 and 21) the other maximum volume (THD + N)/S total harmonic distortion plus noise as a function of signal S/N signal-to-noise ratio at 0 dB signal; fi = 1 kHz − 0.032 − % at −60 dB signal; fi = 1 kHz − − −42 −32 dB − 0.8 2.5 % − −108 −96 dB − 85 − dB fi = 20 Hz to 17 kHz; A-weighted; no signal Operational amplifiers Gv open-loop voltage gain PSRR power supply rejection ratio fripple = 3 kHz; Vripple(p-p) = 100 mV; A-weighted − 90 − dB (THD + N)/S total harmonic distortion plus noise as a function of signal RL > 5 kΩ; Vo = 2.8 V (p-p); fi = 1 kHz − −100 − dB fug unity gain frequency open loop − 4.5 − MHz Zo AC output impedance RL > 5 kΩ − 1.5 150 Ω 1998 Jan 06 14 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T AC CHARACTERISTICS (DIGITAL) VDDD = VDDA = VDDO = 4.5 to 5.5 V; Tamb = −40 to +85 °C; all voltages referenced to ground (pins 2, 9 and 23); unless otherwise specified. SYMBOL tW PARAMETER clock cycle CONDITIONS MIN. TYP. MAX UNIT fsys = 256fs; normal speed 81.3 88.6 156 ns fsys = 128fs; double speed 81.3 88.6 156 ns tCWL fsys LOW level pulse width 22 − − ns tCWH fsys HIGH level pulse width 22 − − ns 25 44.1 48 kHz Serial input data timing (see Fig.8) fs word selection input audio sample frequency normal speed double speed 50 88.2 96 kHz fBCK clock input frequency (data input rate) fsys = 256fs; normal speed − − 64fs kHz fsys = 128fs; double speed; − note 1 − 48fs kHz tr rise time − − 20 ns tf fall time − − 20 ns tHB bit clock HIGH time 55 − − ns tLB bit clock LOW time 55 − − ns tSU;DAT data set-up time 20 − − ns tHD;DAT data hold time 10 − − ns tSU;WS word select set-up time 20 − − ns tHD;WS word select hold time 10 − − ns Microcontroller interface timing (see Fig.9) tL input LOW time 2 − − µs tH Input HIGH time 2 − − µs tSU;DC set-up time DATA to CLOCK 1 − − µs tHD;CD hold time CLOCK to DATA 1 − − µs tSU;CR set-up time CLOCK to RAB 1 − − µs Note 1. A clock frequency of up to 96fs is possible in the event that a rising edge of BCK occurs while SYSCLK is LOW. 1998 Jan 06 15 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... Philips Semiconductors Noise shaping filter DAC 1998 Jan 06 16 Product specification TDA1386T Fig.7 Data input formats. Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T Fig.8 Timing of input signals. Fig.9 Microcontroller timing. 1998 Jan 06 17 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T TEST AND APPLICATION INFORMATION Filter characteristics Table 4 Table 5 Digital filter specification, fs = 44.1 kHz BAND ATTENUATION 0 to 19 kHz <0.001 dB 19 to 20 kHz <0.03 dB 24 kHz >25 dB 25 to 35 kHz >40 dB 35 to 64 kHz >50 dB 64 to 68 kHz >31 dB 68 kHz >35 dB 69 to 88 kHz >40 dB Digital filter phase distortion, fs = 44.1 kHz BAND PHASE DISTORTION 0 to 16 kHz <±1 deg 1998 Jan 06 18 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T PACKAGE OUTLINE SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD 1998 Jan 06 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 19 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1998 Jan 06 20 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Jan 06 21 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T NOTES 1998 Jan 06 22 Philips Semiconductors Product specification Noise shaping filter DAC TDA1386T NOTES 1998 Jan 06 23 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1998 SCA57 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547027/1200/03/pp24 Date of release: 1998 Jan 06 Document order number: 9397 750 03169