TLV3501-Q1 www.ti.com SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages Check for Samples: TLV3501-Q1 FEATURES 1 • • • • • • • • Qualified for Automotive Applications High Speed: 4.5 ns Rail-To-Rail I/O Supply Voltage: +2.7 V to +5.5 V Push-Pull CMOS Output Stage Shutdown (TLV3501 Only) Micro Package: SOT23-6 Low Supply Current: 3.2 mA DESCRIPTION The TLV3501 family of push-pull output comparators feature a fast 4.5-ns propagation delay and operation from +2.7 V to +5.5 V. Beyond-the-rails input common-mode range makes it an ideal choice for low-voltage applications. The rail-to-rail output directly drives either CMOS or TTL logic. Microsize packages provide options for portable and space-restricted applications. The TLV3501-Q1 is available in a SOT23-6 package. space APPLICATIONS space Automatic Test Equipment Wireless Base Stations Threshold Detector Zero-Crossing Detector Window Comparator PROPAGATION DELAY vs OVERDRIVE VOLTAGE 9 VCM = 1V VS = 5V CLOAD = 17pF 8 TLV3501-Q1 RELATED PRODUCTS FEATURES PRODUCT Precision, Ultra-Fast, Low-Power Comparator TLC3016 Differential Output Comparator TL712 High-Speed Op Amp, 16-Bit Accurate, 150 MHz OPA300 High-Speed Op Amp, Rail-to-Rail, 38 MHz OPA350 High-Speed Op Amp with Shutdown, 250 MHz OPA357 Propagation Delay (ns) • • • • • Rise 7 6 Fall 5 4 3 0 20 40 60 80 100 Overdrive Voltage (mV) 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TLV3501-Q1 SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR (2) PACKAGE MARKING TLV3501AQDBVRQ1 SOT23-6 DBV VCBQ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the device product folder at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). Supply voltage (2) TLV3501-Q1 UNIT 5.5 V (V−) − 0.3 to (V+) + 0.3 V Signal input terminal current (2) 10 mA Output short-circuit current (3) 74 mA Signal input terminal voltage Thermal impedance, junction to free air 200 °C/W Operating temperature −40 to +125 °C Storage temperature −65 to +150 °C Junction temperature 150 °C (1) (2) (3) 2 Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should be current limited to 10mA or less. Short circuit to ground, one comparator per package Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 TLV3501-Q1 www.ti.com SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 ELECTRICAL CHARACTERISTICS TA = +25°C and VS = +2.7 V to +5.5 V (unless otherwise noted). Boldface limits apply over the specified temperature range, TA = −40°C to +125°C. TLV3501-Q1 PARAMETER CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE Input offset voltage (1) VOS VCM = 0 V, IO = 0 mA ±1 vs Temperature dVOS/dT TA = −40°C to +125°C ±5 vs Power supply PSRR VS = 2.7 V to 5.5 V 100 Input hysteresis ±6.5 mV mV/°C 400 mV/V 6 mV INPUT BIAS CURRENT Input bias current (2) Input offset current (2) (3) IB VCM = VCC/2, ΔVIN= ±5.5 V ±2 ±10 pA IOS VCM = VCC/2ΔVIN= ±5.5 V ±2 ±10 pA (V+) + 0.2 V V INPUT VOLTAGE RANGE Common-mode voltage range Common-mode rejection (V–) − 0.2 V VCM CMRR VCM = −0.2 V to (V+) + 0.2V 57 VCM = −0.2 V to (V+) + 0.2V 55 70 dB dB INPUT IMPEDANCE 1013 || 2 Common-mode 13 Differential 10 Ω || pF Ω || pF || 4 SWITCHING CHARACTERISTICS Propagation delay time (2) (4) T(pd) ΔVIN = 100 mV, Overdrive = 20 mV 4.5 ΔVIN = 100 mV, Overdrive = 20 mV ΔVIN = 100 mV, Overdrive = 5 mV 7.5 ΔVIN = 100 mV, Overdrive = 20 mV Propagation delay skew (5) Maximum toggle frequency Δt(SKEW) ΔVIN = 100 mV, Overdrive = 20 mV fMAX Overdrive = 50 mV, VS = 5 V 6.4 ns 7 ns 10 ns 12 ns 0.5 ns 80 MHz Rise time (6) tR 1.5 ns Fall time (6) tF 1.5 ns OUTPUT Voltage output swing from rail VOH, VOL IOUT = ±1 mA 30 50 mV SHUTDOWN tOFF 30 ns tON 100 ns (V+) − 1.7V VH (comparator is enabled) (7) V (V+) − 0.9V VL (comparator is disabled) (7) V Input bias current of Shutdown pin 2 pA IQSD (quiescent current in shutdown) 2 mA (1) (2) (3) (4) (5) (6) (7) VOS is defined as the average of the positive and the negative switching thresholds. Not production tested. The difference between IB+ and IB−. Propagation delay cannot be accurately measured with low overdrive on automatic test equipment. This parameter is ensured by characterization at 100-mV overdrive. The difference between the propagation delay going high and the propagation delay going low. Measured between 10% of VS and 90% of VS. When the shutdown pin is within 0.9 V of the most positive supply, the part is disabled. When it is more than 1.7 V below the most positive supply, the part is enabled. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 3 TLV3501-Q1 SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS (continued) TA = +25°C and VS = +2.7 V to +5.5 V (unless otherwise noted). Boldface limits apply over the specified temperature range, TA = −40°C to +125°C. TLV3501-Q1 PARAMETER CONDITIONS MIN TYP MAX UNIT POWER SUPPLY Specified voltage VS +2.7 Operating voltage range Quiescent current +5.5 2.2 to 5.5 IQ VS = 5 V, VO = High 3.2 V V 5 mA TEMPERATURE RANGE Specified range –40 +125 °C Operating range –40 +125 °C Storage range –65 +150 °C Thermal resistance qJA SOT23-6 200 °C/W PIN CONFIGURATIONS SOT23-6(1) DBV PACKAGE (TOP VIEW) 4 NXA (1) 6 SHDN 2 5 OUT 3 4 V+ -IN 1 V+IN Pin 1 is determined by orienting the package marking as indicated on the diagram. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 TLV3501-Q1 www.ti.com SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 TYPICAL CHARACTERISTICS At TA = +25°C, VS = 5 V, and Input Overdrive = 100 mV (unless otherwise noted). OUTPUT RESPONSE FOR VARIOUS OVERDRIVE VOLTAGES (Falling) VIN (V) VIN (V) OUTPUT RESPONSE FOR VARIOUS OVERDRIVE VOLTAGES (Rising) 0 Input Input 0 5 VOD = 50 mV 5 4 VOD = 50 mV 4 VOUT (V) VOUT (V) VOD = 100 mV 3 VOD = 20 mV 2 VOD = 5 mV 1 VOD = 20 mV VOD = 100 mV 3 VOD = 5 mV 2 1 0 0 -1 -1 0 -10 10 20 30 40 0 -10 10 20 30 40 Time (ns) Time (ns) Figure 1. Figure 2. PROPAGATION DELAY vs TEMPERATURE (VOD = 20 mV) PROPAGATION DELAY vs TEMPERATURE (VOD = 50 mV) 5.0 5.0 Propagation Delay (ns) Propagation Delay (ns) Fall 4.5 Rise 4.0 3.5 4.5 4.0 Fall 3.5 Rise 0 25 50 75 100 3.0 -40 -25 125 0 25 50 75 100 125 Temperature (°C) Temperature (°C) Figure 3. Figure 4. PROPAGATION DELAY vs CAPACITIVE LOAD (VOD = 20 mV) PROPAGATION DELAY vs CAPACITIVE LOAD (VOD = 50 mV) 9 9 8 8 Propagation Delay (ns) Propagation Delay (ns) 3.0 -40 -25 7 6 Fall 5 Rise 7 6 5 Fall 4 4 3 3 Rise 0 20 40 60 80 100 0 20 40 60 Capacitive Load (pF) Capacitive Load (pF) Figure 5. Figure 6. 80 100 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 5 TLV3501-Q1 SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = 5 V, and Input Overdrive = 100 mV (unless otherwise noted). PROPAGATION DELAY vs SUPPLY VOLTAGE (VCM = 1 V, VOD = 20 mV) WAKE-UP DELAY vs TEMPERATURE 9 110 Wake-Up Delay (ns) Propagation Delay (ns) 8 7 6 5 90 70 Fall 4 Rise 3 3 4 5 50 75 100 125 Figure 7. Figure 8. RESPONSE TO 50-MHz SINE WAVE (VDD = 5 V, VIN = 20 mVPP) RESPONSE TO 100-MHz SINE WAVE (±2.5-V Dual Supply into 50-Ω Oscilloscope Input) 10 0 500 0 5 -500 4 2 3 VOUT (V) 1 2 1 0 0 -1 -2 0 20 40 60 80 100 0 2 4 6 8 10 12 Time (ns) Time (ns) Figure 9. Figure 10. QUIESCENT CURRENT vs SUPPLY VOLTAGE 14 16 18 20 QUIESCENT CURRENT vs TEMPERATURE 4.0 4.0 3.8 3.8 3.6 3.6 Quiescent Current (mA) Quiescent Current (mA) 25 Temperature (°C) -1 3.4 3.2 3.0 2.8 2.6 2.4 2.2 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 2.0 2 3 4 5 6 -40 -25 Supply Voltage (V) 0 25 50 75 100 125 Temperature (°C) Figure 11. 6 0 Supply Voltage (V) -10 VOUT (V) 50 -40 -25 6 VIN (mV) VIN (mV) 2 Figure 12. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 TLV3501-Q1 www.ti.com SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = 5 V, and Input Overdrive = 100 mV (unless otherwise noted). QUIESCENT CURRENT vs SHUTDOWN VOLTAGE QUIESCENT CURRENT vs FREQUENCY 3.5 25 CLOAD = 50 pF Quiescent Current (mA) Quiescent Current (mA) 3.0 2.5 2.0 5V (from off to on) 2.7 V (from off to on) 1.5 5V (from on to off) 1.0 2.7 V (from on to off) 0.5 20 CLOAD = 20 pF 15 10 CLOAD = 10 pF 5 CLOAD = 0.5 pF 0 0 0 1 2 3 4 5 0 20 40 60 Shutdown Voltage (V) Frequency (MHz) Figure 13. Figure 14. 80 100 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 7 TLV3501-Q1 SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com APPLICATION INFORMATION The TLV3501-Q1 features high-speed response and includes 6 mV of internal hysteresis for improved noise immunity with an input common-mode range that extends 0.2 V beyond the power-supply rails. Shutdown A shutdown pin allows the device to go into idle when it is not in use. When the shutdown pin is high, the device draws about 2 mA and the output goes to high impedance. When the shutdown pin is low, the TLV3501-Q1 is active. When the TLV3501-Q1 shutdown feature is not used, connect the shutdown pin to the most negative supply, as shown in Figure 15. It takes about 100 ns to come out of shutdown mode. VS 0.1 mF 2.2 mF VIN VOUT TLV3501-Q1 VREF Figure 15. Basic Connections for the TLV3501-Q1 Operating Voltage TLV3501-Q1 comparators are specified for use on a single supply from +2.7 V to +5.5 V (or a dual supply from ±1.35 V to ±2.75 V) over a temperature range of −40°C to +125°C. The device continues to function below this range, but performance is not specified. Adding External Hysteresis The TLV3501-Q1 has a robust performance when used with a good layout. However, comparator inputs have little noise immunity within the range of specified offset voltage (±5 mV). For slow moving or noisy input signals, the comparator output may display multiple switching as input signals move through the switching threshold. In such applications, the 6 mV of internal hysteresis of the TLV3501-Q1 might not be sufficient. In cases where greater noise immunity is desired, external hysteresis may be added by connecting a small amount of feedback to the positive. Figure 16 shows a typical topology used to introduce 25 mV of additional hysteresis, for a total of 31-mV hysteresis when operating from a single 5-V supply. Total hysteresis is approximated by Equation 1: VHYST = (V + ) ´ R1 + 6mV R1 + R 2 (1) VHYST sets the value of the transition voltage required to switch the comparator output by enlarging the threshold region, thereby reducing sensitivity to noise. VS = 5 V 0.1 mF 2.2 mF VIN TLV3501-Q1 R1 = 51 W VOUT R2 = 10 kW VREF Figure 16. Adding Hysteresis to the TLV3501-Q1 8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 TLV3501-Q1 www.ti.com SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 Input Over-Voltage Protection Device inputs are protected by electrostatic discharge (ESD) diodes that conduct if the input voltages exceed the power supplies by more than approximately 300 mV. Momentary voltages greater than 300 mV beyond the power supply can be tolerated if the input current is limited to 10 mA. This limiting is easily accomplished with a small input resistor in series with the comparator, as shown in Figure 17. VS 0.1 mF 2.2 mF VIN VOUT TLV3501-Q1 VREF Figure 17. Input Current Protection for Voltages Exceeding the Supply Voltage Relaxation Oscillator The TLV3501-Q1 can easily be configured as a simple and inexpensive relaxation oscillator. In Figure 18, the R2 network sets the trip threshold at 1/3 and 2/3 of the supply. Because this is a high-speed circuit, the resistor values are rather low to minimize the effect of parasitic capacitance. The positive input alternates between 1/3 of V+ and 2/3 of V+ depending on whether the output is low or high. The time to charge (or discharge) is 0.69R1C. Therefore, the period is 1.38R1C. For 62 pF and 1 kΩ as shown in Figure 18, the output is calculated to be 10.9 MHz. An implementation of this circuit oscillated at 9.6 MHz. Parasitic capacitance and component tolerances explain the difference between theory and actual performance. VC 2/3 (V+) t 1/3 (V+) VS = 5V C 62 pF V+ 1.38R1C R1 1 kW VOUT R2 5 kW R2 5 kW t f = 10MHz V+ R2 5 kW Figure 18. Relaxation Oscillator Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 9 TLV3501-Q1 SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com High-Speed Window Comparator A window comparator circuit is used to determine when a signal is between two voltages. The TLV3501-Q1 can readily be used to create a high-speed window comparator. VHI is the upper voltage threshold, and VLO is the lower voltage threshold. When VIN is between these two thresholds, the output in Figure 19 is high. Figure 20 shows a simple means of obtaining an active low output. Note that the reference levels are connected differently between Figure 19 and Figure 20. The operating voltage range of either circuit is 2.7 V to 5.5 V. space VLO VHI TLV3501-Q1a TLV3501-Q1a VIN VIN VOUT VOUT SN74AHC00 SN74LVC1G02 TLV3501-Q1b TLV3501-Q1b VHI VLO V V VOUT VOUT VIN VIN VHI VHI VLO VLO Time Time Figure 19. Window Comparator: Active High 10 Figure 20. Window Comparator: Active Low Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 TLV3501-Q1 www.ti.com SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 PCB Layout For any high-speed comparator or amplifier, proper design and printed circuit board (PCB) layout are necessary for optimal performance. Excess stray capacitance on the active input, or improper grounding, can limit the maximum performance of high-speed circuitry. Minimizing resistance from the signal source to the comparator input is necessary in order to minimize the propagation delay of the complete circuit. The source resistance along with input and stray capacitance creates an RC filter that delays voltage transitions at the input, and reduces the amplitude of high-frequency signals. The input capacitance of the TLV350x along with stray capacitance from an input pin to ground results in several picofarads of capacitance. The location and type of capacitors used for power-supply bypassing are critical to high-speed comparators. The suggested 2.2-mF tantalum capacitor do not need to be as close to the device as the 0.1-mF capacitor, and may be shared with other devices. The 2.2-mF capacitor buffers the power-supply line against ripple, and the 0.1-mF capacitor provides a charge for the comparator during high-frequency switching. In a high-speed circuit, fast rising and falling switching transients create voltage differences across lines that would be at the same potential at DC. To reduce this effect, a ground plane is often used to reduce difference in voltage potential within the circuit board. A ground plane has the advantage of minimizing the effect of stray capacitances on the circuit board by providing a more desirable path for the current to flow. With a signal trace over a ground plane, at high-frequency the return current (in the ground plane) tends to flow right under the signal trace. Breaks in the ground plane (as simple as through-hole leads and vias) increase the inductance of the plane, making it less effective at higher frequencies. Breaks in the ground plane for necessary vias should be spaced randomly. Figure 21 shows an evaluation layout for the TLV3501-Q1 SOT23-6 package. Both are shown with SMA connectors bringing signals on and off the board. RT1 and RT2 are termination resistors for +VIN and −VIN, respectively. C1 and C2 are power-supply bypass capacitors. Place the 0.1-mF capacitor closest to the comparator. The ground plane is not shown, but the pads that the resistors and capacitors connect to are shown. Figure 22 shows a schematic of this circuit. -VIN +VS SD -VIN C1 100 nF RT2 50 W VOUT RT2 TLV3501-Q1 C2 2.2 mF VOUT +VIN RT1 RT1 50 W DUT C1 C2 GND +VS Shutdown +VIN Figure 22. Schematic for Figure 21 Figure 21. TLV3501DBV (SOT23) Sample Layout Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 11 TLV3501-Q1 SBOS533A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (September, 2010) to Revision A • 12 Page Added new feature bullet regarding automotive application qualification ............................................................................. 1 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLV3501-Q1 PACKAGE OPTION ADDENDUM www.ti.com 9-Sep-2011 PACKAGING INFORMATION Orderable Device TLV3501AQDBVRQ1 Status (1) ACTIVE Package Type Package Drawing SOT-23 DBV Pins Package Qty 6 3000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 1-Dec-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLV3501AQDBVRQ1 Package Package Pins Type Drawing SPQ SOT-23 3000 DBV 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 3.2 B0 (mm) K0 (mm) P1 (mm) 3.1 1.39 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 1-Dec-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV3501AQDBVRQ1 SOT-23 DBV 6 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated