NEC UPG2030TK

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2030TK
L, S-BAND SPDT SWITCH
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DESCRIPTION
The μPG2030TK is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were developed
for mobile phone and other L, S-band applications.
This device can operate 2 control switching by control voltage 2.7 to 5.3 V, at frequencies from 0.5 to 2.5 GHz,
having the low insertion loss and high isolation.
This device is housed in a 6-pin lead-less minimold package and is suitable for high-density surface mounting.
FEATURES
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• Switch control voltage
: Vcont (H) = 2.7 to 5.3 V (2.8 V TYP.)
: Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
• Low insertion loss
: LINS1 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont = 2.8 V/0 V
: LINS2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont = 2.8 V/0 V
: LINS3 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont = 2.8 V/0 V
• High isolation
: ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, Vcont = 2.8 V/0 V
: ISL2 = 24 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont = 2.8 V/0 V
• High power
: Pin (0.1 dB) = +27.0 dBm TYP. @ f = 2.0 GHz, Vcont = 2.8 V/0 V
: Pin (1 dB) = +30.0 dBm TYP. @ f = 2.0 GHz, Vcont = 2.8 V/0 V (Reference value)
• High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm)
APPLICATIONS
• PCS, W-LAN, WLL and BluetoothTM etc.
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ORDERING INFORMATION
Part Number
Order Number
μPG2030TK-E2
μPG2030TK-E2-A
Package
Marking
6-pin lead-less minimold
G3R
(1511 PKG) (Pb-free)
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPG2030TK
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may
easily produce potentials of several kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD precautions must be employed at all times.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10409EJ03V0DS (3rd edition)
Date Published August 2009 NS
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2003, 2009
μPG2030TK
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PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
2
3
G3R
1
(Top View)
(Bottom View)
OUTPUT1
6
1
5
GND
2
Vcont1
6
6
1
INPUT
5
5
2
Vcont2
4
OUTPUT2
4
3
4
3
Pin No.
Pin Name
1
OUTPUT1
2
GND
3
OUTPUT2
4
Vcont2
5
INPUT
6
Vcont1
TRUTH TABLE
Vcont1
Vcont2
INPUT−OUTPUT1
INPUT−OUTPUT2
Low
High
ON
OFF
High
Low
OFF
ON
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
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Switch Control Voltage
Symbol
Ratings
Vcont
6.0
Unit
Note
V
Input Power
Pin
+33
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V
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RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
<R>
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
2.7
2.8
5.3
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
0.2
V
2
Data Sheet PG10409EJ03V0DS
μPG2030TK
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
LINS1
f = 0.5 to 1.0 GHz
−
0.25
0.45
dB
Insertion Loss 2
LINS2
f = 1.0 to 2.0 GHz
−
0.30
0.50
dB
Insertion Loss 3
LINS3
f = 2.0 to 2.5 GHz
−
0.35
0.55
dB
Isolation 1
ISL1
f = 0.5 to 2.0 GHz
23
27
−
dB
Isolation 2
ISL2
f = 2.0 to 2.5 GHz
20
24
−
dB
Input Return Loss
RLin
f = 0.5 to 2.5 GHz
15
20
−
dB
Output Return Loss
RLout
f = 0.5 to 2.5 GHz
15
20
−
dB
Pin (0.1 dB) f = 2.0 GHz
+25.5
+27.0
−
dBm
f = 2.5 GHz
+25.5
+27.0
−
dBm
−
4
20
μA
−
50
500
ns
0.1 dB Gain Compression
Input Power
Note
Switch Control Current
Icont
Switch Control Speed
tSW
No signal
Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear
range.
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
1 dB Gain Compression
Pin (1 dB)
Input Power
Test Conditions
f = 2.0 GHz
MIN.
TYP.
MAX.
Unit
−
+30.0
−
dBm
Note
Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC cut capacitors.
The value of DC cut capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system. The range of
recommended DC cut capacitor value is less than 100 pF.
Data Sheet PG10409EJ03V0DS
3
μPG2030TK
EVALUATION CIRCUIT (Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF)
Vcont1
INPUT
Vcont2
56 pF
1 000 pF
1 000 pF
6
5
4
1
2
3
56 pF
OUTPUT1
56 pF
OUTPUT2
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PG10409EJ03V0DS
μPG2030TK
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Vcont2
6pin L2MM SPDT SW
Vc1
OUTPUT2
C2
C
2
C
4
OUT 1
INPUT
G3R
C1
C3
C1
C1
IN
C
1
C
5
C2
OUT 2
OUTPUT1
Vc2
Vcont1
USING THE NEC EVALUATION BOARD
Symbol
C1, C2, C3
C4, C5
Values
56 pF
1 000 pF
Data Sheet PG10409EJ03V0DS
5
μPG2030TK
TYPICAL CHARACTERISTICS
(TA = +25°C, Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF, unless otherwise specified)
INPUT–OUTPUT2
INSERSION LOSS vs. FREQUENCY
0.5
0.4
0.4
0.3
0.3
Insersion Loss LINS (dB)
0.5
0.2
0.1
0
–0.1
–0.2
–0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.4
–0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
–0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
Frequency f (GHz)
INPUT–OUTPUT1
ISOLATION vs. FREQUENCY
INPUT–OUTPUT2
ISOLATION vs. FREQUENCY
50
40
40
30
30
Isolation ISL (dB)
50
20
10
0
–10
–20
20
10
0
–10
–20
–30
–30
–40
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
Frequency f (GHz)
INPUT–OUTPUT1
INPUT RETURN LOSS vs. FREQUENCY
INPUT–OUTPUT2
INPUT RETURN LOSS vs. FREQUENCY
50
50
40
40
Input Return Loss RLin (dB)
Input Return Loss RLin (dB)
Isolation ISL (dB)
Insersion Loss LINS (dB)
INPUT–OUTPUT1
INSERSION LOSS vs. FREQUENCY
30
20
10
0
–10
–20
–30
30
20
10
0
–10
–20
–30
–40
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PG10409EJ03V0DS
μPG2030TK
INPUT–OUTPUT2
OUTPUT RETURN LOSS vs. FREQUENCY
50
50
40
40
Output Return Loss RLout (dB)
Output Return Loss RLout (dB)
INPUT–OUTPUT1
OUTPUT RETURN LOSS vs. FREQUENCY
30
20
10
0
–10
–20
–30
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
30
20
10
0
–10
–20
–30
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
Frequency f (GHz)
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
40
40
f = 1.0 GHz
f = 2.5 GHz
35
Output Power Pout (dBm)
Output Power Pout (dBm)
35
30
25
20
15
10
5
0
10
30
25
20
15
10
5
15
20
25
30
35
40
0
10
Input Power Pin (dBm)
15
20
25
30
35
40
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
Data Sheet PG10409EJ03V0DS
7
μPG2030TK
PACKAGE DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm)
(Bottom View)
0.16±0.05
0.48±0.05 0.48±0.05
1.5±0.1
(Top View)
1.1±0.1
*1
0.2±0.1
a
0.9±0.1
b
1.3±0.05
c
*2
0.11+0.1
–0.05
0.55±0.03
<R>
*1
*2
*2
Remark Dimension is bigger than dimension (dimension = a + b + c).
8
Data Sheet PG10409EJ03V0DS
μPG2030TK
<R>
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10409EJ03V0DS
9
μPG2030TK
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
• The information in this document is current as of August, 2009. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products
and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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appear in this document.
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• Descriptions of circuits, software and other related information in this document are provided for illustrative
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(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E0904E
10
Data Sheet PG10409EJ03V0DS
μPG2030TK
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.