MICROSEMI APTC60TAM24TPG

APTC60TAM24TPG
Triple phase leg
Super Junction MOSFET
Power Module
VDSS = 600V
RDSon = 24mΩ max @ Tj = 25°C
ID = 95A @ Tc = 25°C
Application
• Welding converters
• Switched Mode Power Supplies
• Uninterruptible Power Supplies
• Motor control
Features
•
•
•
•
•
- Ultra low RDSon
- Low Miller capacitance
- Ultra low gate charge
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- Lead frames for power connections
High level of integration
Internal thermistor for temperature monitoring
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1–6
APTC60TAM24TPG – Rev 0
August, 2009
NTC1
NTC2
Benefits
• Outstanding performance at high frequency operation
VBUS 1
VBUS 2
VBUS 3
• Direct mounting to heatsink (isolated package)
G1
G3
G5
• Low junction to case thermal resistance
S1
S3
S5
0/VBUS 2
0/VBUS 3
0/VBUS 1
• Solderable terminals both for power and signal for
S6
S4
S2
easy PCB mounting
G6
G4
G2
• Very low (12mm) profile
• Each leg can be easily paralleled to achieve a phase
U
V
W
leg of three times the current capability
• Module can be configured as a three phase bridge
• Module can be configured as a boost followed by a
full bridge
• RoHS Compliant
Absolute maximum ratings
Symbol
Parameter
Max ratings
Unit
VDSS
Drain - Source Breakdown Voltage
600
V
Tc = 25°C
95
ID
Continuous Drain Current
A
Tc = 80°C
70
IDM
Pulsed Drain current
260
VGS
Gate - Source Voltage
±20
V
RDSon
Drain - Source ON Resistance
24
mΩ
PD
Maximum Power Dissipation
Tc = 25°C
462
W
IAR
Avalanche current (repetitive and non repetitive)
15
A
EAR
Repetitive Avalanche Energy
3
mJ
EAS
Single Pulse Avalanche Energy
1900
APTC60TAM24TPG
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
IDSS
RDS(on)
VGS(th)
IGSS
Zero Gate Voltage Drain Current
Drain – Source on Resistance
Gate Threshold Voltage
Gate – Source Leakage Current
Test Conditions
Min
Typ
Tj = 25°C
Tj = 125°C
VGS = 0V,VDS = 600V
VGS = 0V,VDS = 600V
VGS = 10V, ID = 47.5A
VGS = VDS, ID = 5mA
VGS = ±20 V, VDS = 0V
2.1
3
Min
Typ
14.4
17
Max
350
600
24
3.9
200
Unit
Max
Unit
µA
mΩ
V
nA
Dynamic Characteristics
Symbol Characteristic
Ciss
Input Capacitance
Coss
Output Capacitance
Qg
Total gate Charge
Qgs
Gate – Source Charge
Qgd
Gate – Drain Charge
Td(on)
Turn-on Delay Time
Tr
Td(off)
Rise Time
Turn-off Delay Time
Tf
Fall Time
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Test Conditions
VGS = 0V ; VDS = 25V
f = 1MHz
nF
300
VGS = 10V
VBus = 300V
ID = 95A
nC
68
102
21
Inductive Switching (125°C)
VGS = 10V
VBus = 400V
ID = 95A
RG = 2.5Ω
30
ns
100
45
Inductive switching @ 25°C
VGS = 10V ; VBus = 400V
ID = 95A ; RG = 2.5Ω
Inductive switching @ 125°C
VGS = 10V ; VBus = 400V
ID = 95A ; RG = 2.5Ω
1350
µJ
1040
2200
µJ
1270
Source - Drain diode ratings and characteristics
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
Min
Tc = 25°C
Tc = 80°C
Typ
95
70
VGS = 0V, IS = - 95A
IS = - 95A
VR = 350V
diS/dt = 200A/µs
Max
Unit
A
1.2
4
V
V/ns
Tj = 25°C
600
ns
Tj = 25°C
34
µC
www.microsemi.com
August, 2009
X dv/dt numbers reflect the limitations of the circuit rather than the device itself.
IS ≤ - 95A di/dt ≤ 200A/µs VR ≤ VDSS
Tj ≤ 150°C
2–6
APTC60TAM24TPG – Rev 0
Symbol Characteristic
IS
Continuous Source current
(Body diode)
VSD
Diode Forward Voltage
dv/dt Peak Diode Recovery X
APTC60TAM24TPG
Thermal and package characteristics
Symbol
RthJC
VISOL
TJ
TSTG
TC
Torque
Wt
Characteristic
Junction to Case Thermal Resistance
Min
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
4000
-40
-40
-40
3
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
To heatsink
M6
Typ
Max
0.27
Unit
°C/W
V
150
125
100
5
250
°C
N.m
g
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol
R25
∆R25/R25
B25/85
∆B/B
Characteristic
Resistance @ 25°C
Min
T25 = 298.15 K
TC=100°C
RT =
R25
Typ
50
5
3952
4
Max
Unit
kΩ
%
K
%
T: Thermistor temperature
⎡
⎛ 1
1 ⎞⎤ RT: Thermistor value at T
exp ⎢ B25 / 85 ⎜⎜
− ⎟⎟⎥
⎝ T25 T ⎠⎦
⎣
SP6-P Package outline (dimensions in mm)
ALL DIMENSIONS MARKED " * " ARE TOLERENCED AS :
See application note 1902 - Mounting Instructions for SP6-P (12mm) Power Modules on www.microsemi.com
www.microsemi.com
3–6
APTC60TAM24TPG – Rev 0
August, 2009
9 places (3:1)
APTC60TAM24TPG
Typical Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Thermal Impedance (°C/W)
0.3
0.9
0.25
0.7
0.2
0.5
0.15
0.3
0.1
0.1
0.05
Single Pulse
0.05
0
0.00001
0.0001
0.001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
Transfert Characteristics
Low Voltage Output Characteristics
280
720
VGS=15&10V
6.5V
560
ID, Drain Current (A)
6V
480
400
5.5V
320
240
5V
160
4.5V
80
4V
0
VDS > ID(on)xRDS(on)MAX
250µs pulse test @ < 0.5 duty cycle
240
200
160
120
80
TJ=125°C
40
TJ=25°C
0
0
5
10
15
20
25
0
Normalized to
VGS=10V @ 95A
1.25
1.2
VGS=10V
1.15
1.1
1
2
3
4
5
6
VGS, Gate to Source Voltage (V)
7
DC Drain Current vs Case Temperature
100
RDS(on) vs Drain Current
1.3
VGS=20V
1.05
1
0.95
ID, DC Drain Current (A)
0.9
80
60
40
20
0
0
40
80
120 160 200 240 280
ID, Drain Current (A)
www.microsemi.com
25
50
75
100
125
TC, Case Temperature (°C)
150
August, 2009
RDS(on) Drain to Source ON Resistance
VDS, Drain to Source Voltage (V)
4–6
APTC60TAM24TPG – Rev 0
ID, Drain Current (A)
640
1.1
1.0
0.9
0.8
25
50
75
100
125
150
ON resistance vs Temperature
3.0
2.0
1.5
1.0
0.5
0.0
25
TJ, Junction Temperature (°C)
1000
1.0
ID, Drain Current (A)
0.9
0.8
0.7
limited by RDSon
100
100 µs
0.6
1 ms
Single pulse
TJ=150°C
TC=25°C
10
10 ms
1
25
50
75
100
125
150
1
Coss
Ciss
10000
1000
Crss
10
0
1000
Gate Charge vs Gate to Source Voltage
VGS, Gate to Source Voltage (V)
Capacitance vs Drain to Source Voltage
1000000
100
100
VDS, Drain to Source Voltage (V)
TC, Case Temperature (°C)
100000
10
10
20
30
40
50
VDS, Drain to Source Voltage (V)
www.microsemi.com
12
ID=95A
TJ=25°C
10
VDS=120V
VDS=300V
8
VDS=480V
6
4
2
0
0
40
80 120 160 200 240 280 320
Gate Charge (nC)
August, 2009
VGS(TH), Threshold Voltage
(Normalized)
50
75
100
125
150
TJ, Junction Temperature (°C)
Maximum Safe Operating Area
Threshold Voltage vs Temperature
1.1
C, Capacitance (pF)
VGS=10V
ID= 95A
2.5
5–6
APTC60TAM24TPG – Rev 0
BVDSS, Drain to Source Breakdown
Voltage (Normalized)
Breakdown Voltage vs Temperature
1.2
RDS(on), Drain to Source ON resistance
(Normalized)
APTC60TAM24TPG
APTC60TAM24TPG
Delay Times vs Current
140
Rise and Fall times vs Current
70
td(off)
100
VDS=400V
RG=2.5Ω
TJ=125°C
L=100µH
80
60
40
VDS=400V
RG=2.5Ω
TJ=125°C
L=100µH
60
tr and tf (ns)
td(on)
20
50
40
30
tr
20
10
0
0
0
20 40 60 80 100 120 140 160
0
20
40
ID, Drain Current (A)
Switching Energy vs Gate Resistance
Switching Energy (mJ)
Eoff
2
1
VDS=400V
ID=95A
TJ=125°C
L=100µH
4
3
Eoff
Eon
2
1
0
0
20
40 60 80 100 120 140 160
ID, Drain Current (A)
0
Operating Frequency vs Drain Current
250
ZVS
200
ZCS
150
IDR, Reverse Drain Current (A)
300
VDS=400V
D=50%
RG=2.5Ω
TJ=125°C
TC=75°C
100
hard
switching
50
0
10
20
30 40 50 60 70
ID, Drain Current (A)
80
5
10
15
20
25
Gate Resistance (Ohms)
90
Source to Drain Diode Forward Voltage
1000
TJ=150°C
100
TJ=25°C
10
1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
VSD, Source to Drain Voltage (V)
“COOLMOS™ comprise a new family of transistors developed by Infineon Technologies AG. “COOLMOS” is a trademark of Infineon
Technologies AG”.
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103
5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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6–6
August, 2009
Switching Energy (mJ)
Eon
0
Frequency (kHz)
80 100 120 140 160
5
VDS=400V
RG=2.5Ω
TJ=125°C
L=100µH
3
60
ID, Drain Current (A)
Switching Energy vs Current
4
tf
APTC60TAM24TPG – Rev 0
td(on) and td(off) (ns)
120