Pb Free Product BLM7002 N-Channel Enhancement Mode Power MOSFET GENERAL FEATURES ● VDS = 60V,ID = 0.115A RDS(ON) < 3Ω @ VGS=5V RDS(ON) < 2Ω @ VGS=10V Schematic diagram ● Lead free product is acquired ● Surface Mount Package Application ●Direct Logic-Level Interface: TTL/CMOS ●Drivers: Relays, Solenoids, Lamps, Hammers,Display, Marking and pin Assignment Memories, Transistors, etc. ●Battery Operated Systems ●Solid-State Relays SOT-23 top view Package Marking And Ordering Information Device Marking Device Device Package Reel Size Tape width Quantity 7002 BLM7002 SOT-23 Ø180mm 8 mm 3000 units Absolute Maximum Ratings (TA=25℃ ℃unless otherwise noted) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS ID Drain Current-Continuous@ Current-Pulsed (Note 1) IDM Maximum Power Dissipation PD Operating Junction and Storage Temperature Range TJ,TSTG Limit Unit 60 V ±20 V 0.115 A 0.8 A 0.2 W -55 To 150 ℃ 625 ℃/W Thermal Characteristic Thermal Resistance,Junction-to-Ambient (Note 2) Page1 www.belling.com.cn RθJA V2.0 Pb Free Product BLM7002 Electrical Characteristics (TA=25℃unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit Off Characteristics Drain-Source Breakdown Voltage BVDSS VGS=0V ID=250µA 60 68 - V Zero Gate Voltage Drain Current IDSS VDS=60V,VGS=0V - - 1 µA Gate-Body Leakage Current IGSS VGS=±20V,VDS=0V - - ±100 nA Gate Threshold Voltage VGS(th) VDS=VGS,ID=250µA 1 1.7 2.5 V Drain-Source On-State Resistance RDS(ON) VGS=5V, ID=0.05A - 1.3 3 Ω VGS=10V, ID=0.5A - 1.1 2 Ω VDS=10V,ID=0.2A 0.08 - - S - 20 50 PF - 10 20 PF On Characteristics (Note 3) Forward Transconductance gFS Dynamic Characteristics (Note4) Input Capacitance Clss Output Capacitance Coss Reverse Transfer Capacitance Crss - 3.6 5 PF Turn-on Delay Time td(on) - 10 - nS Turn-on Rise Time tr VDD=30V,ID=0.2A - 50 - nS td(off) VGS=10V,RGEN=10Ω - 17 - nS - 10 - nS - 1.7 3 nC - - 1.2 V - - 0.115 A VDS=30V,VGS=0V, F=1.0MHz Switching Characteristics (Note 4) Turn-Off Delay Time Turn-Off Fall Time tf Total Gate Charge Qg VDS=10V,ID=0.115A, VGS=4.5V Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) VSD Diode Forward Current (Note 2) IS VGS=0V,IS=0.115A Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2%. 4. Guaranteed by design, not subject to production Page2 www.belling.com.cn V2.0 Pb Free Product BLM7002 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS Vdd Vgs Rgen td(on) Rl Vin D ton tr td(off) 90% Vout VOUT G toff tf 90% INVERTED 10% 10% 90% S VIN 50% 50% 10% PULSE WIDTH Figure 2:Switching Waveforms ID- Drain Current (A) ID- Drain Current (A) Figure 1:Switching Test Circuit Vds Drain-Source Voltage (V) Vgs Gate-Source Voltage (V) Figure 4 Transfer Characteristics Rdson On-Resistance(Ω) Rdson On-Resistance(Ω) Figure 3 Output CHARACTERISTICS ID- Drain Current (A) Vgs Gate-Source Voltage (V) Figure 5 Drain-Source On-Resistance Page3 www.belling.com.cn Figure 6 Rdson vs Vgs V2.0 Pb Free Product Vgs Gate-Source Voltage (V) Is- Reverse Drain Current (mA) BLM7002 Qg Gate Charge (nC) Vsd Source-Drain Voltage (V) Figure 8 Source-DrainDiode Forward ID- Drain Current (A) Normalized On-Resistance Figure 7 Gate Charge TJ-Junction Temperature(℃) Figure 10 Safe Operation Area C Capacitance (pF) Figure 9 Drain-Source On-Resistance Vds Drain-Source Voltage (V) Vds Drain-Source Voltage (V) Figure 11 Capacitance vs Vds Page4 www.belling.com.cn V2.0 Pb Free Product r(t),Normalized Effective Transient Thermal Impedance BLM7002 Square Wave Pluse Duration(sec) Figure 12 Normalized Maximum Transient Thermal Impedance Page5 www.belling.com.cn V2.0 Pb Free Product BLM7002 SOT-23 PACKAGE INFORMATION Dimensions in Millimeters (UNIT:mm) Symbol A A1 A2 b c D E E1 e e1 L L1 θ Dimensions in Millimeters MIN. MAX. 0.900 1.150 0.000 0.100 0.900 1.050 0.300 0.500 0.080 0.150 2.800 3.000 1.200 1.400 2.250 2.550 0.950TYP 1.800 2.000 0.550REF 0.300 0.500 0° 8° NOTES 1. All dimensions are in millimeters. 2. Tolerance ±0.10mm (4 mil) unless otherwise specified 3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils. 4. Dimension L is measured in gauge plane. 5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. Page6 www.belling.com.cn V2.0