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Pb Free Product
BLM3404
N-Channel Enhancement Mode Power MOSFET
Description
D
The BLM3404 uses advanced trench technology to provide
excellent RDS(ON) and low gate charge.This device is suitable
G
for use as a load switch and PWM applications.
S
Genera Features
● VDS = 30V,ID = 5.8A
Schematic diagram
RDS(ON) < 31mΩ @ VGS=10V
RDS(ON) < 43mΩ @ VGS=4.5V
● High Power and current handing capability
● Lead free product is acquired
● Surface mount package
Marking and pin assignment
Application
●Load switch
●PWM application
SOT-23 top view
Package Marking and Ordering Information
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
3404
BLM3404
SOT-23
Ø180mm
8 mm
3000 units
Absolute Maximum Ratings (TA=25℃unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
±20
V
Drain Current-Continuous
ID
5.8
A
Drain Current-Pulsed (Note 1)
IDM
20
A
Maximum Power Dissipation
PD
1.4
W
TJ,TSTG
-55 To 150
℃
RθJA
89
℃/W
Operating Junction and Storage Temperature Range
Thermal Characteristic
Thermal Resistance,Junction-to-Ambient (Note 2)
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
30
33
-
V
Zero Gate Voltage Drain Current
IDSS
VDS=30V,VGS=0V
-
-
1
μA
Off Characteristics
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BLM3404
Parameter
Symbol
Condition
Min
Typ
Max
Unit
IGSS
VGS=±20V,VDS=0V
-
-
±100
nA
Gate Threshold Voltage
VGS(th)
VDS=VGS,ID=250μA
1.2
1.6
2.4
V
Drain-Source On-State Resistance
RDS(ON)
VGS=10V, ID=5A
-
25.5
31
mΩ
VGS=4.5V, ID=4A
-
34
43
mΩ
VDS=5V,ID=5A
-
15
-
S
-
255
-
PF
-
45
-
PF
-
35
-
PF
-
4.5
-
nS
Gate-Body Leakage Current
On Characteristics (Note 3)
Forward Transconductance
gFS
Dynamic Characteristics (Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS=15V,VGS=0V,
F=1.0MHz
Switching Characteristics (Note 4)
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
VDD=15V, RL=3Ω
-
2.5
-
nS
td(off)
VGS=10V,RGEN=3Ω
-
14.5
-
nS
-
3.5
-
nS
-
5.2
-
nC
-
0.85
-
nC
-
1.3
-
nC
-
-
1.2
V
-
-
5
A
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS=15V,ID=5A,
VGS=10V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
VSD
Diode Forward Current (Note 2)
IS
VGS=0V,IS=5A
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
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BLM3404
Typical Electrical and Thermal Characteristics
Vdd
Vgs
Rgen
td(on)
Rl
Vin
D
ton
tr
td(off)
Vout
90%
VOUT
G
toff
tf
90%
INVERTED
10%
10%
90%
S
VIN
50%
50%
10%
PULSE WIDTH
Figure 2:Switching Waveforms
ID- Drain Current (A)
ID- Drain Current (A)
Figure 1:Switching Test Circuit
Vgs Gate-Source Voltage (V)
Vds Drain-Source Voltage (V)
Figure 4 Transfer Characteristics
Normalized On-Resistance
Rdson On-Resistance(mΩ)
Figure 3 Output Characteristics
TJ-Junction Temperature(℃)
ID- Drain Current (A)
Figure 5 Drain-Source On-Resistance
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Figure 6 Drain-Source On-Resistance
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Rdson On-Resistance(mΩ)
C Capacitance (pF)
BLM3404
TJ-Junction Temperature(℃)
Vgs Gate-Source Voltage (V)
Figure 8 Drain-Source On-Resistance
Vgs Gate-Source Voltage (V)
Is- Reverse Drain Current (A)
Figure7 Rdson vs Vgs
Vds Drain-Source Voltage (V)
Qg Gate Charge (nC)
Figure 10 Source- Drain Diode Forward
ID- Drain Current (A)
C Capacitance (pF)
Figure 9 Gate Charge
Vds Drain-Source Voltage (V)
Figure 11 Capacitance vs Vds
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Vds Drain-Source Voltage (V)
Figure 12
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Safe Operation Area
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Pb Free Product
r(t),Normalized Effective
Transient Thermal Impedance
BLM3404
Square Wave Pluse Duration(sec)
Figure 13 Normalized Maximum Transient Thermal Impedance
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BLM3404
SOT-23 Package Information
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
Dimensions in Millimeters
MIN.
MAX.
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950TYP
1.800
2.000
0.550REF
0.300
0.500
0°
8°
Notes
1. All dimensions are in millimeters.
2. Tolerance ±0.10mm (4 mil) unless otherwise specified
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
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