ESD5V3U1U-02LRH Data Sheet (1.6 MB, EN)

TVS Diodes
Transient Voltage Suppressor Diodes
ESD5V3U1U Series
Uni-directional Ultra-Low Capacitance ESD / Transient Protection Diode
ESD5V3U1U-02LS
ESD5V3U1U-02LRH
Data Sheet
Revision 1.0, 2011-05-27
Final
Industrial and Multi-Market
Edition 2011-05-27
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2011 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
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characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
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and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
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be endangered.
ESD5V3U1U Series
Revision History
Page or Item
Subjects (major changes since previous revision)
Revision 1.0, 2011-05-27
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™,
CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™,
EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™,
ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™,
PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SMARTi™,
SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™,
XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™,
REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership.
Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation
Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation.
FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of
Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of
INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of
Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP.
MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2010-06-09
Final Data Sheet
3
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
1.1
1.2
Uni-directional Ultra-Low Capacitance ESD / Transient Protection Diode . . . . . . . . . . . . . . . . . . 7
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
3.1
3.2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Typical Characteristics at TA=25°C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5
Ordering Information Scheme (Examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6
6.1
6.2
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PG-TSSLP-2-1 (mm)[3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PG-TSLP-2-7 (mm)[3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Final Data Sheet
4
Revision 1.0, 2011-05-27
ESD5V3U1U Series
List of Figures
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Figure 16
Figure 17
Figure 18
Figure 19
Figure 20
Figure 21
Figure 22
Pin Configuration and Schematic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions of Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Reverse current IR = f(TA) , VR = 5.3 V, from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Line capacitance CL = f(VR), f = 1MHz, from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Line capacitance CL = f(f), from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Line capacitance CL = f(TA), from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Clamping voltage VTLP = f(ITLP), from pin 1 to pin 2[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Forward clamping voltage VTLP = f(ITLP), from pin 2 to pin 1[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
IEC61000-4-2: VCL = f(t), 8 kV positive pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . 13
IEC61000-4-2: VCL = f(t), 8 kV negative pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . 13
IEC61000-4-2: VCL = f(t), 15 kV positive pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . 14
IEC61000-4-2: VCL = f(t), 15 kV negative pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . 14
Single line, uni-directional ESD / Transient protection[2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PG-TSSLP-2-1: Package overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PG-TSSLP-2-1: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PG-TSSLP-2-1: Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PG-TSSLP-2-1: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PG-TSLP-2-7: Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PG-TSLP-2-7: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PG-TSLP-2-7: Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PG-TSLP-2-7: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Final Data Sheet
5
Revision 1.0, 2011-05-27
ESD5V3U1U Series
List of Tables
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Rating at TA = 25 °C, unless otherwise specified. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Final Data Sheet
6
7
8
8
9
9
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Uni-directional Ultra-Low Capacitance ESD / Transient Protection Diode
1
Uni-directional Ultra-Low Capacitance ESD / Transient Protection
Diode
1.1
Features
•
•
•
•
•
•
ESD / Transient protection of high speed data lines exceeding
– IEC61000-4-2 (ESD): ±20 kV (air / contact)
– IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns)
– IEC61000-4-5 (surge): 3 A (8/20 μs)
Maximum working voltage: VRWM = 5.3 V
Ultra low capacitance: CL = 0.4 pF (typical)
Low clamping voltage, low dynamic resistance RDYN = 0.6 Ω (typical)
Very small form factor down to 0.62 x 0.32 x 0.31 mm3
Pb-free (RoHS compliant) and halogen free package
1.2
•
•
Application Examples
USB 2.0, Mobile HDMI Link, MDDI, MIPI, etc.
HDMI, DisplayPort, DVI, Ethernet, Firewire, S-ATA
2
Product Description
Pin 1
Pin 1
Pin 2
TSLP-2
Pin 1 marking
(lasered)
TSSLP -2
Pin 1
Pin 2
Pin 2
a) Pin configuration
b) Schematic diagram
P G-TS (S)LP -2-S ingle Die diode P inConf and S c hematic Diag.v s t. v s d
Figure 1
Pin Configuration and Schematic Diagram
Table 1
Ordering Information
Type
Package
Configuration
ESD5V3U1U-02LS
PG-TSSLP-2-1
1 line, uni-directional
L
1 line, uni-directional
E5
ESD5V3U1U--02LRH PG-TSLP-2-7
Final Data Sheet
7
Marking code
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Characteristics
3
Characteristics
Table 2
Maximum Rating at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
VESD
–
–
20
kV
IPP
–
–
3
A
Operating temperature range
TOP
-55
–
125
°C
Storage temperature
1) VESD according to IEC61000-4-2
2) IPP according to IEC61000-4-5
Tstg
-65
–
150
°C
ESD (air / contact) discharge
1)
Peak pulse current (tp = 8/20 μs)
2)
Electrical Characteristics at TA = 25 °C, unless otherwise specified
3.1
R DYN: Dynamic resistance
IF
V BR: Breakdown voltage
V RWM: Maximum working voltage
IPP
R DYN
V CL: Clamping voltage
V FC: Forward clamping voltage
I PP: Peak pulse current
IF
VCL
VBR
VRWM
VR
VF
IRWM
VF
VFC
IR
V F: Forward voltage
I F: Forward current
RDYN
V R: Reverse voltage
I PP
I R: Reverse current
IR
Diode_Charac teris tic _Curv e_Uni-direc tional. vs d
Figure 2
Definitions of Electrical Characteristics
Table 3
DC Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Reverse working voltage VRWM
–
–
5.3
V
Pin 1 to Pin 2
Breakdown voltage
VBR
6
–
–
V
IBR = 1 mA, from Pin 1
to Pin 2
Reverse current
IR
–
<10
100
nA
VR = 5.3 V, from Pin 1
to Pin 2
Final Data Sheet
8
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Characteristics
Table 4
RF Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
1)
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
Line capacitance
CL
–
0.4
0.6
pF
VR = 0 V, f = 1 MHz
Serie inductance
LS
–
0.2
–
nH
ESD5V3U1U-02LS
–
0.4
–
nH
ESD5V3U1U-02LRH
Unit
Note /
Test Condition
1) Total capacitance line to ground
Table 5
ESD Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Clamping voltage
VCL
Forward clamping voltage VFC
Values
Min.
Typ.
Max.
–
19
–
V
IPP = 16 A,
from Pin 1 to Pin 2
–
28
–
V
IPP = 30 A,
from Pin 1 to Pin 2
–
10
–
V
IPP = 16 A,
from Pin 2 to Pin 1
–
17
–
V
IPP = 30 A,
from Pin 2 to Pin 1
Dynamic resistance
1)
RDYN
–
0.6
–
V
Pin 1 to Pin 2
–
0.5
–
V
Pin 2 to Pin 1
1)Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window:
t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP charactertistics between
IPP1 = 10 A and IPP2 = 40 A.
Final Data Sheet
9
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Characteristics
Typical Characteristics at TA=25°C, unless otherwise specified
3.2
10
-6
10-7
IR [A]
10-8
10
-9
10
-10
10
-11
10-12
25
50
75
100
125
150
TA [°C]
Figure 3
Reverse current IR = f(TA) , VR = 5.3 V, from pin 1 to pin 2
0.8
CL [pF]
0.6
0.4
0.2
0
Figure 4
0
0.5
1
1.5
2
2.5
VR [V]
3
3.5
4
4.5
5
Line capacitance CL = f(VR), f = 1MHz, from pin 1 to pin 2
Final Data Sheet
10
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Characteristics
0.7
0.6
CL [pF]
0.5
0.4
0V
5.3V
0.3
0.2
0.1
0
0
500
1000
1500
2000
2500
3000
f [MHz]
Figure 5
Line capacitance CL = f(f), from pin 1 to pin 2
0.7
0.6
CL [pF]
0.5
5.3V
0.4
0V
0.3
0.2
0.1
0
Figure 6
-25
0
25
TA [°C]
50
75
Line capacitance CL = f(TA), from pin 1 to pin 2
Final Data Sheet
11
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Characteristics
20
10
10
5
0
0
5
10
15
30
35
40
0
20
ESD5V3U1U-02xx
RDYN
30
ITLP [A]
20
25
VTLP [V]
Clamping voltage VTLP = f(ITLP), from pin 1 to pin 2[1]
40
Figure 8
15
RDYN=0.6Ω
15
RDYN=0.5Ω
20
10
10
5
0
0
0
5
10
15
20
25
VTLP [V]
30
35
40
Equivalent VIEC [kV]
ITLP [A]
30
Figure 7
20
ESD5V3U1U-02xx
RDYN
Equivalent VIEC [kV]
40
Forward clamping voltage VTLP = f(ITLP), from pin 2 to pin 1[1]
Final Data Sheet
12
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Characteristics
90
80
70
VCL [V]
60
VCL-max-peak = 82.2 [V]
50
VCL-30ns-peak = 17.3 [V]
40
30
20
10
0
-10
-100
Figure 9
0
100
200
300
400 500
tp [ns]
600
700
800
900
700
800
900
IEC61000-4-2: VCL = f(t), 8 kV positive pulse from pin 1 to pin 2
10
0
-10
VCL [V]
-20
-30
VCL-max-peak = -76.1 [V]
-40
-50
VCL-30ns-peak = -8.9 [V]
-60
-70
-80
-90
-100
Figure 10
0
100
200
300
400 500
tp [ns]
600
IEC61000-4-2: VCL = f(t), 8 kV negative pulse from pin 1 to pin 2
Final Data Sheet
13
Revision 1.0, 2011-05-27
ESD5V3U1U Series
VCL [V]
Characteristics
VCL [V]
Figure 11
Figure 12
110
100
90
80
70
60
50
40
30
20
10
0
-10
-100
VCL-max-peak = 104.8 [V]
VCL-30ns-peak = 24.1 [V]
0
100
200
300
400 500
tp [ns]
600
700
800
900
700
800
900
IEC61000-4-2: VCL = f(t), 15 kV positive pulse from pin 1 to pin 2
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-100
VCL-max-peak = -105.1 [V]
VCL-30ns-peak = -13.7 [V]
0
100
200
300
400 500
tp [ns]
600
IEC61000-4-2: VCL = f(t), 15 kV negative pulse from pin 1 to pin 2
Final Data Sheet
14
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Application Information
4
Application Information
Application_ESD5V3U1U-02xxx.vsd
Figure 13
Single line, uni-directional ESD / Transient protection[2]
Final Data Sheet
15
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Ordering Information Scheme (Examples)
5
ESD
Ordering Information Scheme (Examples)
0P1
RF
- XX YY
Package
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
For Radio Frequency Applications
Line Capacitance CL in pF: (i.e.: 0P1 = 0.1pF)
ESD 5V3 U n U - XX YY
Package or Application
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
S = SOT363
U = SC74
XX = Application family:
LC = Low Clamp
HDMI
Uni- / Bi-directional or Rail to Rail protection
Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines)
Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF)
Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V)
Figure 14
Ordering information scheme
Final Data Sheet
16
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Package Information
6
Package Information
6.1
PG-TSSLP-2-1 (mm)[3]
Top view
Bottom view
0.31 +0.01
-0.02
0.62 ±0.035
2
1
0.2 ±0.025 1)
0.355 ±0.025
0.32 ±0.035
0.26 ±0.025 1)
Cathode
marking
1) Dimension applies to plated terminal
TSSLP-2-1,-2-PO V05
PG-TSSLP-2-1: Package overview
0.19
0.24
Solder mask
0.19
0.57
0.62
Copper
0.19
0.27
0.14
0.32
0.24
Figure 15
Stencil apertures
TSSLP-2-1,-2-FP V02
Figure 16
PG-TSSLP-2-1: Footprint
0.35
Cathode
marking
Figure 17
PG-TSSLP-2-1: Packing
Figure 18
PG-TSSLP-2-1: Marking (example)
Final Data Sheet
8
0.73
4
0.43
TSSLP-2-1,-2-TP V03
17
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Package Information
6.2
PG-TSLP-2-7 (mm)[3]
Top view
Bottom view
0.39 +0.01
-0.03
0.6 ±0.05
0.05 MAX.
1±0.05
0.65 ±0.05
2
0.25 ±0.035 1)
1
0.5 ±0.035 1)
Cathode
marking
1) Dimension applies to plated terminal
TSLP 2 7 PO V02
0.45
Copper
Solder mask
0.375
0.35
0.275
1
0.925
0.3
0.6
0.275
PG-TSLP-2-7: Package Overview
0.35
Figure 19
Stencil apertures
TSLP-2-7-FP V01
Figure 20
PG-TSLP-2-7: Footprint
0.5
1.16
Orientation
marking
Figure 21
PG-TSLP-2-7: Packing
Figure 22
PG-TSLP-2-7: Marking (example)
Final Data Sheet
8
4
0.76
TSLP-2-7-TP V03
18
Revision 1.0, 2011-05-27
ESD5V3U1U Series
Terminology
Terminology
CL
Line capacitance
DVI
Digital Visual Interface
EFT
Electrical Fast Transient
ESD
Electrostatic Discharge
HDMI
High Definition Multimedia Interface
IEC
International Electrotechnical Commission
IPP
Peak pulse current
IR
Reverse current
IRWM
Maximum Reverse working Current
LS
Serial inductance
MDDI
Mobile Display Digital Interface
MIPI
Mobile Industrial Processor Interface
RoHS
Restriction of Hazardous Substances Directive
S-ATA
Serial Advanced Technology Attachment
TA
Ambient temperature
TOP
Operation temperature
tp
Pulse duration
Tstg
Storage temperature
USB
Universal Serial Bus
VBR
Breakdown Voltage
VCL
Reverse clamping voltage
VESD
Electrostatic discharge voltage
VFC
Forward Clamping Voltage
VR
Reverse voltage
VRWM
Maximum Reverse Working Voltage
Final Data Sheet
19
Revision 1.0, 2011-05-27
ESD5V3U1U Series
References
References
[1]
Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP
[2]
Infineon AG - Application Note AN140: ESD Protection for Digital High-Speed Interfaces (HDMI, FireWire,
...) using ESD5V3U1U)
[3]
Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Package
Final Data Sheet
20
Revision 1.0, 2011-05-27
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
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