ESD5V3U2U-03F Data Sheet (1.7 MB, EN)

TVS Diode
Transient Voltage Suppressor Diodes
ESD5V3U2U Series
Uni-directional Ultra Low ESD / Transient Protection Diode
ESD5V3U2U-03F
ESD5V3U2U-03LRH
Data Sheet
Revision 1.3, 2013-08-16
Final
Power Management & Multimarket
Edition 2013-08-16
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
ESD5V3U2U Series
Revision History: Rev. 1.2, 2013-08-16
Page or Item
Subjects (major changes since previous revision)
Revision 1.3, 2013-08-16
4 + 16
All marking infos for TSLP-3-7 updated
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,
CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™,
MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,
PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™,
SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
FinalData Sheet
3
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Uni-directional Ultra Low ESD / Transient Protection Diode
1
Uni-directional Ultra Low ESD / Transient Protection Diode
1.1
Features
•
•
•
•
•
ESD / Transient protection of High-Speed data lines exceeding
– IEC61000-4-2 (ESD): ± 20 kV (air / contact)
– IEC61000-4-4 (EFT): ±50 A (5/50 ns)
– IEC61000-4-5 (surge): ±3 A (8/20 μs)
Maximum working voltage: VRWM 5.3 V
Extremely low capacitance: down to 0.4 pF
Very low reverse current: IR < 1 nA typical
Pb-free package (RoHS compliant) and halogen free package
1.2
•
Application Examples
ESD / Transient protection of High Speed Interfaces:
– HDMI, USB 2.0/USB 3.0, DisplayPort, DVI
– Mobile HDMI Link, MDDI, MIPI.
– 10/100/1000 Ethernet, Firewire, S-ATA, etc.
1.3
Product Description
Pin 1
Pin 1
Pin 2
Pin 3
Pin 2
TSLP-3
Pin 3
Pin 3
Pin 1
Pin 2
TSFP-3
a) Pin configuration
b) Schematic diagram
PG- TSL(F)P-3-Dual_diode_A_com_PinConf_and_SchematicDiag.vst.vsd
Figure 1-1 Pin Configuration (a) and Schematic Diagram (b)
Table 1-1
Ordering information
Type
ESD5V3U2U-03F
Package
PG-TSFP-3-1
ESD5V3U2U-03LRH PG-TSLP-3-7
Configuration
Marking code
1)
Z1
1)
Z1
2 lines, uni-directional
2 lines, uni-directional
1) Or 1 line, bi-directional between pins 1 and 2, if pin 3 is not connected
FinalData Sheet
4
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Characteristics
2
Characteristics
Table 2-1
Maximum Rating at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
VESD
-20
–
20
kV
IPP
-3
–
3
A
Operating temperature range
TOP
-40
–
125
°C
Storage temperage
1) VESD according to IEC61000-4-2
2) IPP according to IEC61000-4-5
Tstg
-65
–
150
°C
ESD (air / contact) discharge
1)
Peak pulse current (tp = 8/20 μs)
2)
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
2.1
Electrical Characteristics at TA = 25 °C, unless otherwise specified
!"
"
!"
Figure 2-1 Definitions of electrical characteristics
FinalData Sheet
5
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Characteristics
Table 2-2
DC characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
Reverse working voltage VRWM
–
–
5.3
V
Breakdown voltage
VBR
6
–
–
V
IBR = 1 mA, from Pin
1/2 to Pin 3
Reverse current
IR
–
<1
50
nA
VR = 5.3 V, from Pin
1/2 to Pin 3
Table 2-3
RF characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Line capacitance1)
CL
Values
Min.
Typ.
Max.
–
0.4
0.6
Unit
Note /
Test Condition
pF
VR = 0 V, f = 1 MHz
from pin 1/2 to pin 3
–
0.2
0.4
pF
VR = 0 V, f = 1 MHz
from pin 1 to 2, pin 31)
not connected
1) Total capacitance line to ground
Table 2-4
ESD Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbo
l
Min.
1)
Clamping voltage
VCL
–
Values
Typ.
Max.
19
–
Unit
Note /
Test Condition
V
ITLP = 16 A,
from Pin 1/2 to Pin 3
Forward clamping voltage1) VFC
–
28
–
V
ITLP = 30 A,
from Pin 1/2 to Pin 3
–
10
–
V
ITLP = 16 A,
from Pin 3 to Pin 1/2
–
17
–
V
ITLP = 30 A,
from Pin 3 to Pin 1/2
Dynamic resistance
1)
RDYN
–
0.6
–
V
Pin 1/2 to Pin 3
–
0.4
–
V
Pin 3 to Pin 1/2
1)Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window:
t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP charactertistics between
IPP1 = 10 A and IPP2 = 40 A.
FinalData Sheet
6
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Characteristics
Table 2-5
Surge characteristics at TA = 25 °C, unless otherwise specified
Parameter
Clamping voltage
Symbol
VCL
Values
Min.
Typ.
Max.
–
10
13
Unit
Note /
Test Condition
V
IPP = 1 A, tp=8/20 μs1)
from Pin 1/2 to Pin 3
–
12
15
V
IPP = 3A, tp =8/20 μs1)
from Pin 1/2 to Pin 3
Forward clamping voltage VFC
–
2
4
V
IPP = 1 A, tp =8/20 μs1)
from Pin 3 to Pin 1/2
–
4
6
V
IPP = 3A, tp =8/20 μs1)
from Pin 3to Pin 1/2
1) IPP according to IEC61000-4-5
FinalData Sheet
7
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Typical characteristics
3
Typical characteristics
Typical characteristics at = 25 °C, unless otherwise specified
0.6
CL [pF]
0.4
0.2
0
0
1
2
3
4
5
VR [V]
Figure 3-1 Line capacitance CL=f(VR), from pin 1/2 to 3, f = 1 MHz
0.6
0.5
0.4
0V
CL [pF]
5.3V
0.3
0.2
0.1
0
0
500
1000
1500
2000
2500
3000
f [MHz]
Figure 3-2 Line capacitance CL=f(f), from pin 1/2 to 3
FinalData Sheet
8
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Typical characteristics
0.7
0.6
CL [pF]
0.5
5.3V
0.4
0V
0.3
0.2
0.1
0
-50
-25
0
25
TA [°C]
50
75
100
Figure 3-3 Line capacitance CL=f(TA)
-6
10
-7
10
-8
IR [A]
10
10-9
-10
10
-11
10
25
50
75
100
125
150
TA [°C]
Figure 3-4 Reverse current IR=f(TA) , VR=5.3 V, from pin 1/2 to pin 3
FinalData Sheet
9
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Typical characteristics
90
80
Scope: 20 GS/s
70
VCL-max-peak = 82.2 [V]
VCL [V]
60
50
VCL-30ns-peak = 17.3 [V]
40
30
20
10
0
-10
-100
0
100
200
300
400 500
tp [ns]
600
700
800
900
Figure 3-5 IEC61000-4-2: VCL = f(t), 8 kV positive pulse from pin 1 to pin 2 (R = 330 Ω, C = 150 pF)
10
0
-10
VCL [V]
-20
VCL-max-peak = -76.1 [V]
-30
-40
VCL-30ns-peak = -8.9 [V]
-50
-60
-70
Scope: 20 GS/s
-80
-90
-100
0
100
200
300
400 500
tp [ns]
600
700
800
900
Figure 3-6 IEC61000-4-2: VCL = f(t), 8 kV negative pulse from pin 1 to pin 2 (R = 330 Ω, C = 150 pF)
FinalData Sheet
10
Revision 1.3, 2013-08-16
ESD5V3U2U Series
VCL [V]
Typical characteristics
110
100
90
80
70
60
50
40
30
20
10
0
-10
-100
Scope: 20 GS/s
VCL-max-peak = 104.8 [V]
VCL-30ns-peak = 24.1 [V]
0
100
200
300
400 500
tp [ns]
600
700
800
900
VCL [V]
Figure 3-7 IEC61000-4-2: VCL = f(t), 15 kV positive pulse from pin 1 to pin 2 (R = 330 Ω, C = 150 pF)
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-100
VCL-max-peak = -105.1 [V]
VCL-30ns-peak = -13.7 [V]
Scope: 20 GS/s
0
100
200
300
400 500
tp [ns]
600
700
800
900
Figure 3-8 IEC61000-4-2: VCL = f(t), 15 kV negative pulse from pin 1 to pin 2 (R = 330 Ω, C = 150 pF)
FinalData Sheet
11
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Typical characteristics
40
ESD5V3U2U-03LRH (Pin 1/2 to Pin 3)
RDYN
30
15
RDYN = 0.58 Ω
25
ITLP [A]
17.5
12.5
20
10
15
7.5
10
5
5
2.5
0
0
-5
-2.5
-10
-5
-15
-7.5
-20
-10
-25
RDYN = 0.41 Ω
Equivalent VIEC 61000-4-2 [kV]
35
20
-12.5
-30
-15
-35
-17.5
-40
-20
-40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 35 40
VTLP [V]
Figure 3-9 Clamping voltage (TLP): ITLP = f(VTLP) according ANSI/ESD STM5.5.1- Electrostatic Dischange
Sensitivity Testing using Transmission Line Pulse (TLP) Model. TLP conditions: Z0 = 50 Ω,
tp = 100 ns, tr = 0.6 ns, ITLP and VTLP averaging window: t1 = 30 ns to t2 = 60 ns, extraction of
dynamic resistance using squares fit to ELP charactersistic between ITLP1 = 10 A and
ITLP2 = 30 A. Please refer to Application Note AN210 [1]
FinalData Sheet
12
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Application Information
4
Application Information
Application_ESD5V3U2U_2 lines uni-directional.vsd
Figure 4-1 2 lines, uni-directional TVS protection
Application_ESD5V3U2U_1 line bi-directional.vsd
Figure 4-2 1 line, bi-directional TVS protection
FinalData Sheet
13
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Ordering information scheme (examples)
5
ESD
Ordering information scheme (examples)
0P1
RF
- XX YY
Package
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
For Radio Frequency Applications
Line Capacitance CL in pF: (i.e.: 0P1 = 0.1pF)
ESD 5V3 U n U - XX YY
Package or Application
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
S = SOT363
U = SC74
XX = Application family:
LC = Low Clamp
HDMI
Uni- / Bi-directional or Rail to Rail protection
Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines)
Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF)
Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V)
Figure 5-1 Ordering Information Scheme
FinalData Sheet
14
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Package Information
6
Package Information
6.1
PG-TSFP-3-1
0.2 ±0.05
0.55 ±0.04
1
1.2 ±0.05
0.2 ±0.05
3
2
0.2 ±0.05
0.8 ±0.05
1.2 ±0.05
0.15 ±0.05
0.4 ±0.05
0.4 ±0.05
TSFP-3-1, -2-PO V06
Figure 6-1 PG-TSFP-3-1: Package Overview
1.05
0.45
0.4
0.4
0.4
TSFP-3-1, -2-FP V06
Figure 6-2 PG-TSFP-3-1: Footprint
4
0.2
Pin 1
1.5
8
1.2
0.3
0.7
1.35
Figure 6-3 PG-TSFP-3-1: Packing
Figure 6-4 PG-TSFP-3-1: Marking (example)
FinalData Sheet
15
Revision 1.3, 2013-08-16
ESD5V3U2U Series
Package Information
PG-TSLP-3-7
Bottom view
0.39 +0.01
-0.03
0.25 ±0.035
1)
Top view
0.6 ±0.05
3
2
1 ±0.05
0.65 ±0.05
1)
1
1)
0.05 MAX.
0.5 ±0.035
0.35 ±0.05
Pin 1
marking
2 x 0.15 ±0.035
2 x 0.25 ±0.035
6.2
1)
1) Dimension applies to plated terminal
TSLP-3-7-PO V02
R0.1
0.2
0.225
0.2
0.225
0.315
0.35
1
0.3
0.945
0.35
0.45
0.355
0.6
0.275
Figure 6-5 PG-TSLP-3-7: Package Overview
0.17
0.15
Copper
Solder mask
Stencil apertures
Figure 6-6 PG-TSLP-3-7: Footprint
0.5
Pin 1
marking
8
1.16
4
0.76
TSLP-3-7-TP V03
Figure 6-7 PG-TSLP-3-7: Packing
Type code
Pin 1 marking
Laser marking
TSLP-3-7-MK V02
Figure 6-8 PG-TSLP-3-7: Marking (example)
FinalData Sheet
16
Revision 1.3, 2013-08-16
ESD5V3U2U Series
References
References
[1]
Infineon Technologie AG - Application Note AN210: Effective ESD Protection Design at System Level
Using VF-TLP Characterization Methodology
FinalData Sheet
17
Revision 1.3, 2013-08-16
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
Similar pages