40L – QFN Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 Package Weight – Site 5 LY/LT 99.0002 mg B1: 86.1100 mg B2: 85.1867 mg 95.8501 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 4 6x6 mm 95.0139 mg 159.9339 mg Package Weight – Site 6 B1 : 89.3205 mg B2 : 89.9930 mg SUMMARY The 40L – QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1 – Amkor Technology Seoul Korea Package Qualification Report # 031803 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LY40Amkor Seoul As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 1 of 18 40L – QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ag Sn Resin Ag Metal oxide Amine Gamma Butyrolactone Si Au Epoxy Resin SiO2 Phenol Resin 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Proprietary 7440-22-4 Proprietary Proprietary 96-48-0 51.9088 1.2402 0.0216 0.0593 0.6902 1.8500 0.1600 0.5201 0.0200 0.0200 0.0200 % weight of substance per Homogenous material 96.2700% 2.3000% 0.0400% 0.1100% 1.2800% 100.0000% 21.6200% 70.2800% 2.7000% 2.7000% 2.7000% 7440-21-3 7440-57-5 Proprietary 60676-86-0 Proprietary 2.5100 1.3000 3.8680 32.4912 2.3208 100.0000% 100.0000% 10.0000% 84.0000% 6.0000% CAS Number Package Weight (mg): Weight by mg 99.0002 % weight of Substance per package PPM 524,331 12,527 218 599 6,971 18,687 1,616 5,253 202 202 202 52.4331% 1.2527% 0.0218% 0.0599% 0.6971% 1.8687% 0.1616% 0.5253% 0.0202% 0.0202% 0.0202% 25,354 13,131 39,071 328,194 23,442 2.5354% 1.3131% 3.9071% 32.8194% 2.3442% % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 2 of 18 40L – QFN Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Shanghai (ASE) Package Qualification Report #084006 (See Note 1) I. A. DECLARATION OF PACKAGED UNITS BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT40ASE China As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 3 of 18 40L – QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Leadframe External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorus Zinc Silver Pb Nickel Palladium Gold Acrylic resin Polybutadiene derivative Butadiene copolymer Epoxy resin Silver Acrylate Peroxide Additive Si Au Pd Phenol Resin Epoxy Resin Carbon Black Silica Fused CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7439-92-1 7440-02-0 7440-05-3 7440-57-5 Proprietary proprietary proprietary proprietary 7440-22-4 proprietary proprietary proprietary 7440-21-3 7440-57-5 7440-05-3 Proprietary proprietary 1333-86-4 60676-86-0 Package Weight (mg): 36.7079 0.8775 0.0114 0.0572 0.0076 0.0038 0.4578 0.0191 0.0114 0.0504 0.0315 96.2200% 2.3000% 0.0300% 0.1500% 0.0200% 0.0100% 1.2000% 0.0500% 0.0300% 8.0000% 5.0000% 386,343 9,235 120 602 80 40 4,818 201 120 530 332 % weight of substance per package 38.6343% 0.9235% 0.0120% 0.0602% 0.0080% 0.0040% 0.4818% 0.0201% 0.0120% 0.0530% 0.0332% 0.0063 1.0000% 66 0.0066% 0.0158 0.4851 0.0315 0.0032 0.0063 4.7800 0.4950 0.0050 2.5475 4.0760 0.2548 44.0718 2.5000% 77.0000% 5.0000% 0.5000% 1.0000% 100.0000% 99.0000% 1.0000% 5.0000% 8.0000% 0.5000% 86.5000% 166 5,106 332 33 66 50,308 5,210 53 26,812 42,899 2,681 463,846 0.0166% 0.5106% 0.0332% 0.0033% 0.0066% 5.0308% 0.5210% 0.0053% 2.6812% 4.2899% 0.2681% 46.3846% % Total: 100.0000 Weight by mg 95.0139 % weight of substance per Homogeneous material PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 4 of 18 40L – QFN Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 5 of 18 40L – QFN Pb-Free Package ASSEMBLY Site 3: Cypress Manufacturing Limited (CML) Package Qualification Report # 093405, 120206 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT40CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 6 of 18 40L – QFN Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING GOLD WIRE Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Carbocyclic Acrylate Bismaleimide Resin Additive Acrylate ester Silicon Gold Palladium SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Crystalline Silica CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 --------------------------------------------------------------------7440-21-3 7440-57-5 7440-05-3 60676-86-0 ----------------------------------1333-86-4 14808-60-7 Package Weight (mg): Weight by mg 28.7749 0.7090 0.0207 0.0354 0.4440 0.0080 0.0080 0.2590 0.0700 0.0070 0.0070 0.0070 4.7700 1.7127 0.0173 41.1321 1.4778 1.9704 1.9704 0.2463 2.4630 86.1100 % weight of substance per Homogeneo us material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 74.0000% 20.0000% 2.0000% 2.0000% 2.0000% 100.0000% 99.0000% 1.0000% 83.5000% 3.0000% 4.0000% 4.0000% 0.5000% 5.0000% PPM % weight of substance per package 334,165 8,233 240 412 5,156 93 93 3,008 813 81 81 81 55,394 19,890 201 477,669 17,162 22,882 22,882 2,860 28,603 % Total: 33.4165 0.8233 0.0240 0.0412 0.5156 0.0093 0.0093 0.3008 0.0813 0.0081 0.0081 0.0081 5.5394 1.9890 0.0201 47.7669 1.7162 2.2882 2.2882 0.2860 2.8603 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 7 of 18 40L – QFN Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING COPPER WIRE Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Carbocyclic Acrylate Bismaleimide Resin Additive Acrylate ester Silicon Copper SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Crystalline Silica CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 --------------------------------------------------------------------7440-21-3 7440-50-8 60676-86-0 ---------------------------------------------------1333-86-4 14808-60-7 Package Weight (mg): Weight by mg 28.7749 0.7090 0.0207 0.0354 0.4440 0.0080 0.0080 0.2590 0.0700 0.0070 0.0070 0.0070 4.7700 0.8067 41.1321 1.4778 1.9704 1.9704 0.2463 2.4630 % weight of substance per Homogeneo us material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 74.0000% 20.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 83.5000% 3.0000% 4.0000% 4.0000% 0.5000% 5.0000% 85.1867 PPM % weight of substance per package 337,786 8,323 243 416 5,212 94 94 3,040 822 82 82 82 55,995 9,470 482,847 17,348 23,130 23,130 2,891 28,913 33.7786% 0.8323% 0.0243% 0.0416% 0.5212% 0.0094% 0.0094% 0.3040% 0.0822% 0.0082% 0.0082% 0.0082% 5.5995% 0.9470% 48.2847% 1.7348% 2.3130% 2.3130% 0.2891% 2.8913% % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 8 of 18 40L – QFN Pb-Free Package ASSEMBLY Site 4: CARSEM Malaysia Package Qualification Report # 082607 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT40CARSEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 9 of 18 40L – QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Carbocyclic Acrylate Bismaleimide Resin Additive Acrylate ester Silicon Gold Silica Fused Phenol Resin Epoxy Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 --------------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 ----------------------------------1333-86-4 Weight by (mg) 98.7210 2.3071 0.0202 0.1315 1.1818 0.1028 0.0155 0.4047 0.1140 0.0171 0.0171 0.0171 2.1700 0.0300 51.2445 1.6407 1.6407 0.1641 % weight of substance per Homogeneous material 97.5600% 2.2800% 0.0200% 0.1300% 90.9100% 7.9100% 1.1900% 71.0000% 20.0000% 3.0000% 3.0000% 3.0000% 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% Package Weight (mg): 159.9339 617237 14425 127 822 7389 643 97 2530 713 107 107 107 13568 188 320398 10258 10258 1026 % weight of substance per package 61.7237 1.4425 0.0127 0.0822 0.7389 0.0643 0.0097 0.2530 0.0713 0.0107 0.0107 0.0107 1.3568 0.0188 32.0398 1.0258 1.0258 0.1026 % Total: 100.0000 PPM II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 10 of 18 40L – QFN Pb-Free Package ASSEMBLY Site 5: Amkor Technology Philippines (P3) Package Qualification Report # 101902 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT40Amkor Philippines (P3) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 11 of 18 40L – QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Lead Frame Purpose of Use Base material Lead Finish Die Attach External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold-Silver Ag Proprietary Bismaleimide Methacrylate Ester Proprietary Polymer Silicon Gold Palladium Solid Epoxy Resin Phenol Resin Carbon Black Metal Hydroxide SiO2 SiO2 CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 ---------------------------------------------------7440-21-3 7440-57-5 7440-05-3 ----------------------------------1333-86-4 -----------------60676-86-0 14808-60-7 Package Weight (mg): 47.2876 1.1405 0.0388 0.0631 0.8100 0.0199 0.0001 % weight of substance per Homogeneous material 97.4400% 2.3500% 0.0800% 0.1300% 97.5900% 2.4000% 0.0100% 494744 11932 406 660 8475 208 1 % weight of substance per package 49.4744 1.1932 0.0406 0.0660 0.8475 0.0208 0.0001 0.9103 0.0342 91.9500% 3.4500% 9524 357 0.9524 0.0357 0.0342 0.0114 4.9900 0.9900 0.0100 0.7800 0.7800 0.2000 2.7500 32.7700 1.9600 3.4500% 1.1500% 100.0000% 99.0000% 1.0000% 1.9878% 1.9878% 0.5097% 7.0082% 83.5117% 4.9949% 357 119 52208 10358 105 8161 8161 2092 28772 342854 20506 0.0357 0.0119 5.2208 1.0358 0.0105 0.8161 0.8161 0.2092 2.8772 34.2854 2.0506 Weight by (mg) 95.8501 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 12 of 18 40L – QFN Pb-Free Package ASSEMBLY Site 6: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 111812, 114904 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT40ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 13 of 18 40L – QFN Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold Wire Material Lead Frame Purpose of Use Base material Lead Finish Die Attach External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Zinc Phosphorus Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Gold Ion Impurities Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 ------------------------------------------------------------------------------------------------------7440-21-3 7440-57-5 --------------------------------------------------------------------1333-86-4 60676-86-0 Package Weight (mg): 38.4340 0.9470 0.0592 0.0197 0.5100 0.0238 0.0065 0.9170 0.0983 0.1212 % weight of substance per Homogeneous material 97.4000% 2.4000% 0.1500% 0.0500% 94.4400% 4.4100% 1.2000% 70.0000% 7.5000% 9.2500% 430,295 10,603 663 221 5,710 267 73 10,266 1,100 1,357 % weight of substance per package 43.0295 1.0603 0.0663 0.0221 0.5710 0.0267 0.0073 1.0266 0.1100 0.1357 0.0459 3.5000% 513 0.0513 0.0983 0.0131 0.0164 4.6000 0.4000 0.0000 1.9355 1.2903 2.8387 0.2151 36.7305 7.5000% 1.0000% 1.2500% 100.0000% 99.9900% 0.0100% 4.5000% 3.0000% 6.6000% 0.5000% 85.4000% 1,100 147 183 51,500 4,478 0 21,669 14,446 31,781 2,408 411,223 0.1100 0.0147 0.0183 5.1500 0.4478 0.0000 2.1669 1.4446 3.1781 0.2408 41.1223 % Total: 100.0000 Weight by (mg) 89.3205 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 14 of 18 40L – QFN Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Lead Frame Purpose of Use Base material Lead Finish Die Attach External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Zinc Phosphorus Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Copper Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 ------------------------------------------------------------------------------------------------------7440-21-3 7440-50-8 ---------------------------------------------------1333-86-4 60676-86-0 Package Weight (mg): 48.7473 1.2275 0.0802 0.0451 0.6466 0.0302 0.0082 0.3780 0.0405 0.0500 % weight of substance per Homogeneous material 97.3000 2.4500 0.1600 0.0900 94.3880 4.4120 1.2000 70.0000 7.5000 9.2500 541,679 13,639 891 501 7,185 336 91 4,200 450 555 % weight of substance per package 54.1679 1.3639 0.0891 0.0501 0.7185 0.0336 0.0091 0.4200 0.0450 0.0555 0.0189 3.5000 210 0.0210 0.0405 0.0054 0.0068 4.6280 0.1900 1.5233 1.0155 2.2341 0.1693 28.9079 7.5000 1.0000 1.2500 100.0000 100.0000 4.5000 3.0000 6.6000 0.5000 85.4000 450 60 75 51,426 2,112 16,926 11,284 24,825 1,881 321,224 0.0450 0.0060 0.0075 5.1426 0.2112 1.6926 1.1284 2.4825 0.1881 32.1224 % Total: 100.0000 Weight by (mg) 89.9933 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 15 of 18 40L – QFN Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box Desiccant Bubble Pack Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBDE PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-SBAG-R CoA-PROB-R CoA-ABOX-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 16 of 18 40L – QFN Pb-Free Package Document History Page Document Title: Document Number: Rev. 40L - QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-05380 ** *A ECN No. Orig. of Change 402942 YXP 569106 EBZ *B 2597930 HLR *C *D 2665168 DPT 2791503 HLR *E 2847146 HLR *F *G 2978241 EBZ/ DPTTMP 3101054 VFR *H 3261110 VFR *I 3455306 HLR *J 3465207 VFR *K 3578203 UDR *L 4032211 YUM Description of Change New specification. Added Amkor Korea as assembly site 2 Added 100mg as Package weight for Site 2. Updated Cypress Logo. Added the % weight for homogenous materials on Assembly Site 1. Completed the RoHS substance on Declaration of packaging materials for Assembly site 1. Add ASE Shanghai for additional site of 40QFN (LT40A). Deleted Assembly site 2 to create new spec for QFN 40 – Stacked Die. Added Assembly Site 3 for LT40. Referenced QTP No. 093405. Transferred Silver and Lead substances from external plating to base material on Assembly Site 2. Add Assembly site 4 Carsem Malaysia – CA additional site of 40QFN (LT40A). Add Assembly site 5 – Amkor Philippines (MB), reference QTP # 101902 Added Assembly site 6 – ASE Taiwan (G). Reference QTP # 111812 Updated the material composition table on Assembly Sites 1 to 6 to reflect 4 decimal places on values. Removed tube material on declaration of packaging table Added Assembly site 7 – ASE Taiwan (G) Copper wire qual. Reference QTP # 114904. Added B2 for Assembly Site 3 – Autoline (CML-RA) Copper wire qualification. Reference QTP # 120206. Added assembly site name in the Assembly heading in site 1, 2, 3, 4, 5 and 6 Changed assembly code to assembly site name site 1, 2, 3, 4, 5, and 6. Consolidate material composition of assembly site 6 and 7 in one assembly site (ASET). Removed assembly site 7. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 17 of 18 40L – QFN Pb-Free Package Document History Page Document Title: Document Number: Rev. *M *N 40L - QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-05380 ECN No. Orig. of Change 4106051 YUM 4605602 HLR Description of Change Corrected the numbering value in each assembly site. Sunset Due – No Change Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05380 Rev. *N Page 18 of 18