Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Film Top Die Die Attach Paste Bottom Die Substrate Mold compound Solder ball RSD056 (Pb-free solder balls) 7.7 x 6.2 mm x 1.0mm 85 260°C 3 BKK Product is RoHS Compliant CAS Number unit weight(mg) Chemicals Present #1 Silicon 7440-21-3 6.1137 subtotal 6.1137 #1 Copper 7440-50-8 0.5682 #2 Palladium (Pd) 7440-05-3 0.0098 subtotal 0.5780 #1 Epoxy resin (A&B) Trade secret 0.1690 #2 Phenol Resin Trade secret 0.1090 #3 Acrylic Copolymer Trade secret 0.1853 #4 SiO2 Filler Trade secret 0.0818 subtotal 0.5451 0 0038 #1 Silica Trade secret 0.0038 #2 Diluent Trade secret 0.0240 #3 Organic peroxide Trade secret 0.0010 #4 Elastomer Trade secret 0.0048 #5 Organic filler Trade secret 0.0192 #6 Acrylic resin Trade secret 0.0432 subtotal 0.0960 #1 Copper 7440-50-8 16.2730 #2 Gold 7440-57-5 0.0065 #3 Nickel 7440-02-0 0.0251 #4 Cured thermosetting resin Trade Secret 7.5710 #5 Continuous Filament Fiber Glass 65997-17-3 6.5738 subtotal 30.4494 #1 Amorphous silica(SiO2 Filler) 60676-86-0 35.2917 #2 Carbon Black 1333-86-4 0.1038 #3 Epoxy Resins Trade secret 5.7505 #4 Metal Oxides Trade secret 0.2491 #5 Phosphoric Organic Catalyst Trade secret 0.1246 subtotal 41.5197 #1 Tin 7440-31-5 5.7100 #2 Silver 7440-22-4 0.0580 #3 Copper 7440-50-8 0.0290 subtotal 5.7970 TOTAL PACKAGE 85.0989 unit weight/package (%) 7.1842 7.1842 0.6677 0.0115 0.6792 0.1986 0.1281 0.2178 0.0961 0.6405 0 0045 0.0045 0.0282 0.0011 0.0056 0.0226 0.0508 0.1128 19.1224 0.0077 0.0295 8.8968 7.7249 35.7812 41.4714 0.1220 6.7574 0.2927 0.1464 48.7899 6.7098 0.0682 0.0341 6.8121 100.0000 Amount (ppm) 71,842 71,842 6,677 115 6,792 1,986 1,281 2,178 961 6,405 45 282 11 56 226 508 1,128 191,224 77 295 88,968 77,249 357,812 414,714 1,220 67,574 2,927 1,464 487,899 67,098 682 341 68,121 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12910 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA056 (RSD056) - BKK - CuPd Wire - Dual Die Document Number: 002-12910 Rev. ** ECN No. Orig. of Description of Change Change 5265663 AAC Initial Release. Document No. 002-12910 Rev. ** Page 2 of 2