Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball VBN 048 (SnPb solder balls) 10 x 6 mm 99 mg 260°C 3 BKK Product is NOT RoHS Compliant Chemicals Present CAS Number unit weight(mg) unit weight/package (%) Amount (ppm) #1 Silicon 7440-21-3 12.4819 12.5524 125,524 subtotal 12.4819 12.5524 125,524 #1 Gold 7440-57-5 0.4472 0.4497 4,497 subtotal 0.4472 0.4497 4,497 #1 Epoxy resin Trade Secret 0.1790 0.1800 1,800 #2 Polytetrafluoroethylene 9002-84-0 0.1465 0.1473 1,473 subtotal 0.3255 0.3273 3,273 #1 Brominated Epoxy Resins Trade Secret 1.8200 1.8303 18,303 #2 Copper 7440-50-8 12.0960 12.1644 121,644 #3 Gold 7440-57-5 0.1876 0.1887 1,887 #4 Nickel 7440-02-0 0.8651 0.8700 8,700 #5 Epoxy resin Trade Secret 10.3347 10.3931 103,931 #6 Silica 14808-60-7 1.5400 1.5487 15,487 #7 SiO2 Glass Cloth 65997-17-3 6.7200 6.7580 67,580 subtotal 33.5633 33.7530 337,530 #1 Silica (fused) 60676-86-0 38.5331 38.7508 387,508 #2 Carbon Black 1333-86-4 0.0871 0.0876 876 #3 Epoxy resin Trade Secret 4.7023 4.7289 47,289 #4 Phosphoric organic catalyst Trade Secret 0.2177 0.2189 2,189 subtotal 43.5402 43.7863 437,863 #1 Tin 7440-31-5 5.7200 5.7523 57,523 #2 Lead 7439-92-1 3.3600 3.3790 33,790 subtotal 9.0800 9.1313 91,313 TOTAL PACKAGE WEIGHT 99.4381 100.0000 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12879 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA048 (VBN048) - BKK - Au Wire - Non Pb Free Document Number: 002-12879 Rev. ** ECN No. Orig. of Description of Change Change 5261272 AAC NEW RELEASE Document No. 002-12879 Rev. ** Page 2 of 2