Package Chemistry Substances Analysis Table Package Type: Dimension: W i ht off Unit U it Package: P k Weight Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball LAE 064 (SnPb solder balls) 9 x 9 mm 196 mg 260°C 3 BKK Product is NOT RoHS Compliant Chemicals Present #1 Silicon subtotal #1 Copper subtotal #1 Epoxy resin #2 Polytetrafluoroethylene subtotal #1 Brominated Epoxy Resins #2 Copper #3 Gold #4 Nickel #5 Epoxy resin E i #6 Silica #7 SiO2 Glass Cloth subtotal #1 Silica (fused) #2 Carbon Black #3 Epoxy resin #4 Phosphoric organic catalyst subtotal #1 Tin #2 Lead subtotal CAS Number unit weight(mg) 7440-21-3 4.1388 4.1388 7440-50-8 0.4569 0.4569 Trade Secret 0.1022 9002-84-0 0.0836 0.1857 Trade Secret 3.6855 7440-50-8 7.0544 7440-57-5 0.0418 7440-02-0 0.2277 Trade Secrett 15.4525 T d S 15 4525 14808-60-7 3.1185 65997-17-3 13.6080 43.1884 60676-86-0 77.1396 1333-86-4 0.1743 Trade Secret 9.4137 Trade Secret 0.4358 87.1634 7440-31-5 38.3983 7439-92-1 22.5514 60.9497 TOTAL PACKAGE 196.0830 unit weight/package (%) Amount (ppm) 2.1108 21,108 , 2.1108 21,108 0.2330 2,330 0.2330 2,330 0.0521 521 0.0426 426 0.0947 947 1.8796 18,796 3.5977 35,977 0.0213 213 0.1161 1,161 7.8806 78,806 7 8806 78 806 1.5904 15,904 6.9399 69,399 22.0256 220,256 39.3403 393,403 0.0889 889 4.8009 48,009 0.2223 2,223 44.4523 444,523 19.5827 195,827 , 11.5009 115,009 31.0836 310,836 100.0000 1,000,000 In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12943 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA064 (LAE064) - BKK - Cu Wire - Non Pb Free Document Number: 002-12943 Rev. ** ECN No. Orig. of Description of Change Change 5268323 AAC Initial Release. Document No. 002-12943 Rev. ** Page 2 of 2