Material Declaration Datasheet (MDDS) FBGA080 (LAD080) BKK CuPd Wire.pdf

Package Chemistry Substances Analysis Table
Package Type:
Dimension:
Weight of Unit Package:
Temperature rating:
MSL:
Assembly Location:
Description
Silicon Die
Bond wire
Die Attach
Substrate
Mold compound
Solder ball
LAD 080
11 X 9 mm
235.1 mg
260°C
3
BKK
Product is RoHS Compliant
CAS Number unit weight (mg) unit weight/package (%)
Chemicals Present
#1 Silicon
7440-21-3
5.3470
2.2747
subtotal
5.3470
2.2747
#1 Copper
7440-50-8
0.2406
0.1023
#2 Palladium (Pd)
7440-05-3
0.0042
0.0018
subtotal
0.2447
0.1041
#1 Epoxy resin
Trade Secret
0.0369
0.0157
#2 Polytetrafluoroethylene
9002-84-0
0.0302
0.0128
subtotal
0.0671
0.0285
#1 Aluminum Hydroxide
21645-51-2
7.7220
3.2850
#2 Copper
7440-50-8
36.9009
15.6980
#3 Gold
7440-57-5
0.2236
0.0951
#4 Nickel
7440-02-0
2.0618
0.8771
#5 Epoxy resin
Trade Secret
16.5072
7.0223
#6 SiO2 Glass Cloth
65997-17-3
15.1470
6.4437
78.5623
33.4213
subtotal
#1 Silica (fused)
60676-86-0
71.5064
30.4196
#2 Carbon Black
1333-86-4
0.2103
0.0895
#3 Epoxy resin
Trade Secret
11.6513
4.9566
#4 Phosphoric organic catalyst
Trade Secret
0.2524
0.1074
#5 Metal Oxide
Trade Secret
0.5048
0.2147
84.1252
35.7878
subtotal
#1 Tin
7440-31-5
64.3854
27.3902
#2 Silver
7440-22-4
2.0016
0.8515
#3 Copper
7440-50-8
0.3336
0.1419
66.7207
28.3837
subtotal
235.0671
100.0000
TOTAL PACKAGE
Amount (ppm)
22,747
22,747
1,023
18
1,041
157
128
285
32,850
156,980
951
8,771
70,223
64,437
334,213
304,196
895
49,566
1,074
2,147
357,878
273,902
8,515
1,419
283,837
1,000,000
Disclaimer:
In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm.
Document No. 002-12968 Rev. **
Page 1 of 2
CYPRESS
Company Confidential
Document History Page
Document Title:
Material Declaration Datasheet (MDDS) - FBGA080 (LAD080) - BKK - CuPd Wire
Document Number: 002-12968
Rev.
**
ECN No. Orig. of Description of Change
Change
5269740 AAC
Initial Release.
Document No. 002-12968 Rev. **
Page 2 of 2
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