Material Declaration Datasheet (MDDS) - FBGA048 (VBN048) - BKK - Au Wire .pdf

Package Chemistry Substances Analysis Table
Package Type:
Dimension:
Weight of Unit Package:
Temperature rating:
MSL:
Assembly Location:
Description
Silicon Die
Bond wire
Die Attach
Substrate
Mold compound
Solder ball
VBN 048 (Pb-free solder balls)
10 x 6 mm
98 mg
260°C
3
BKK
Product is RoHS Compliant
Chemicals Present
CAS Number unit weight(mg) unit weight/package (%) Amount (ppm)
#1 Silicon
7440-21-3
12.4819
12.6965
126,965
subtotal
12.4819
12.6965
126,965
#1 Gold
7440-57-5
0.4472
0.4548
4,548
subtotal
0.4472
0.4548
4,548
#1 Epoxy resin
Trade Secret
0.1842
0.1874
1,874
#2 Polytetrafluoroethylene
9002-84-0
0.1507
0.1533
1,533
subtotal
0.3349
0.3407
3,407
#1 Brominated Epoxy Resins
Trade Secret
1.8200
1.8513
18,513
#2 Copper
7440-50-8
12.0960
12.3039
123,039
#3 Gold
7440-57-5
0.1876
0.1908
1,908
#4 Nickel
7440-02-0
0.8651
0.8799
8,799
#5 Epoxy resin
Trade Secret
10.3347
10.5123
105,123
#6 Silica
14808-60-7
1.5400
1.5665
15,665
#7 SiO2 Glass Cloth
65997-17-3
6.7200
6.8355
68,355
subtotal
33.5633
34.1403
341,403
#1 Silica (fused)
60676-86-0
38.5299
39.1922
391,922
#2 Carbon Black
1333-86-4
0.0871
0.0886
886
#3 Epoxy resin
Trade Secret
4.7020
4.7828
47,828
#4 Phosphoric organic catalyst
Trade Secret
0.2177
0.2214
2,214
subtotal
43.5366
44.2849
442,849
#1 Tin
7440-31-5
7.6681
7.7999
77,999
#2 Silver
7440-22-4
0.2384
0.2425
2,425
#3 Copper
7440-50-8
0.0397
0.0404
404
subtotal
7.9462
8.0828
80,828
TOTAL PACKAGE WEIGHT
98.3102
100.0000
1,000,000
Disclaimer:
In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought
to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material
concentrations less than 1 ppm.
Document No. 002-12866 Rev. **
Page 1 of 2
CYPRESS
Company Confidential
Document History Page
Document Title:
Material Declaration Datasheet (MDDS) - FBGA048 (VBN048) - BKK - Au Wire
Document Number: 002-12866
Rev.
**
ECN No. Orig. of Description of Change
Change
5260117 AAC
NEW RELEASE
Document No. 002-12866 Rev. **
Page 2 of 2
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