Package Chemistry Substances Analysis Table VBG 080 (Pb-free solder spheres) 11 x 8 x 1 mm 133 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball Chemicals Present CAS Number unit weight (mg) unit weight/package (%) Amount (ppm) #1 Silicon 7440-21-3 17.1737 12.8993 128,993 subtotal 17 1737 17.1737 12 8993 12.8993 128 993 128,993 #1 Copper 7440-50-8 0.2064 0.1551 1,551 #2 Palladium (Pd) 7440-05-3 0.0036 0.0027 27 0.2100 0.1551 1,551 subtotal #1 Epoxy resin Trade Secret 0.2178 0.1636 1,636 #2 Polytetrafluoroethylene 9002-84-0 0.1782 0.1338 1,338 0.3960 0.2974 2,974 subtotal #1 Brominated Epoxy Resins Trade Secret 2.6693 2.0050 20,050 #2 Copper 7440-50-8 5.7401 4.3115 43,115 #3 Gold 7440-57-5 0.1712 0.1286 1,286 #4 Nickel 7440-02-0 0.7895 0.5930 5,930 #5 Epoxy resin Trade Secret 15.4669 11.6173 116,173 #6 Silica 14808-60-7 2.2587 1.6965 16,965 #7 SiO2 Glass Cloth 65997-17-3 9.8560 7.4029 74,029 36.9517 27.7547 277,547 subtotal #1 Silica (fused) 60676-86-0 57.6681 43.3149 433,149 #2 Carbon Black 1333-86-4 0.1303 0.0979 979 #3 Epoxy resin Trade Secret 7.0375 5.2859 52,859 #4 Phosphoric organic catalyst Trade Secret 0.3258 0.2447 2,447 subtotal 65 1616 65.1616 48 9434 48.9434 489 434 489,434 #1 Tin 7440-31-5 12.7802 9.5993 95,993 #2 Silver 7440-22-4 0.3973 0.2984 2,984 #3 Copper 7440-50-8 0.0662 0.0497 497 13.2437 9.9475 99,475 subtotal 133.1368 100.0000 1,000,000 TOTAL PACKAGE Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought t b to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material t t ithi 20 t Th td ti l d t i l t i t ti ll dd d t d t (i iti ) t i l concentrations less than 1 ppm. Document No. 002-12970 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA080 (VBG080) - BKK - CuPd Wire Document Number: 002-12970 Rev. ** ECN No. Orig. of Description of Change Change 5269778 AAC Initial Release. Document No. 002-12970 Rev. ** Page 2 of 2