Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball VDD 064 (Pb-free solder balls) 8 x 9.2 mm 110 mg 260°C 3 BKK Product is RoHS Compliant Chemicals Present CAS Number unit weight(mg) unit weight/package (%) Amount (ppm) #1 Silicon 7440-21-3 19.0255 17.3294 173,294 subtotal 19.0255 17.3294 173,294 #1 Gold 7440-57-5 0.6378 0.5809 5,809 subtotal 0.6378 0.5809 5,809 #1 Epoxy resin Trade Secret 0.2162 0.1969 1,969 #2 Polytetrafluoroethylene 9002-84-0 0.1769 0.1611 1,611 subtotal 0.3930 0.3580 3,580 #1 Brominated Epoxy Resins Trade Secret 2.2325 2.0335 20,335 #2 Copper 7440-50-8 8.9224 8.1270 81,270 #3 Gold 7440-57-5 0.0516 0.0470 470 #4 Nickel 7440-02-0 0.2810 0.2560 2,560 #5 Epoxy resin Trade Secret 11.0950 10.1059 101,059 #6 Silica 14808-60-7 1.8891 1.7207 17,207 #7 SiO2 Glass Cloth 65997-17-3 8.2432 7.5083 75,083 subtotal 32.7148 29.7983 297,983 #1 Silica (fused) 60676-86-0 44.5869 40.6119 406,119 #2 Carbon Black 1333-86-4 0.1008 0.0918 918 #3 Epoxy resin Trade Secret 5.4411 4.9560 49,560 #4 Phosphoric organic catalyst Trade Secret 0.2519 0.2294 2,294 subtotal 50.3807 45.8892 458,892 #1 Tin 7440-31-5 6.5198 5.9385 59,385 #2 Silver 7440-22-4 0.0796 0.0725 725 #3 Copper 7440-50-8 0.0332 0.0302 302 #4 Nickel 7440-02-0 0.0033 0.0030 30 subtotal 6.6359 6.0443 60,443 TOTAL PACKAGE 109.7877 100.0000 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12954 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA064 (VDD064) - BKK - Au Wire Document Number: 002-12954 Rev. ** ECN No. Orig. of Description of Change Change 5268642 AAC Initial Release. Document No. 002-12954 Rev. ** Page 2 of 2