Package Chemistry Substances Analysis Table Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball VBU 056 (Pb-free solder balls) 7 x 9 mm 94 mg 260°C 3 BKK Product is RoHS Compliant CAS Number unit weight(mg) Chemicals Present #1 Silicon 7440-21-3 6.9414 6.9414 subtotal #1 Copper 7440-50-8 0.4493 #2 Palladium 7440-05-3 0.0078 0.4570 subtotal #1 Epoxy resin Trade Secret 0.1254 #2 Polytetrafluoroethylene 9002-84-0 0.1026 0.2281 subtotal #1 Aluminium Hydroxide 21645-51-2 3.3581 #2 Copper 7440-50-8 5.4340 #3 Gold 7440-57-5 0.1171 #4 Nickel 7440-02-0 0.5398 #5 Epoxy resin Trade Secret 10.2728 #6 SiO2 Glass Cloth 65997-17-3 6.5870 subtotal 26.3088 #1 Silica (fused) 60676-86-0 45.1571 #2 Carbon Black 1333-86-4 0.1020 #3 Epoxy resin Trade Secret 5.5107 #4 Phosphoric organic catalyst Trade Secret 0.2551 51.0250 subtotal #1 Tin 7440-31-5 8.9581 #2 Silver 7440-22-4 0.2785 #3 Copper 7440-50-8 0.0464 9.2830 subtotal 94.2433 TOTAL PACKAGE unit weight/package (%) 7.3654 7.3654 0.4767 0.0082 0.4850 0.1331 0.1089 0.2420 3.5632 5.7660 0.1242 0.5727 10.9003 6.9894 27.9158 47.9155 0.1083 5.8473 0.2707 54.1418 9.5053 0.2955 0.0493 9.8500 100.0000 Amount (ppm) 73,654 73,654 4,767 82 4,767 1,331 1,089 2,420 35,632 57,660 1,242 5,727 109,003 69,894 279,158 479,155 1,083 58,473 2,707 541,418 95,053 2,955 493 98,500 999,918 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. ument No. 002-12920 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA056 (VBU056) - BKK - CuPd Wire Document Number: 002-12920 Rev. ** ECN No. Orig. of Description of Change Change 5266701 AAC Initial Release Document No. 002-12920 Rev. ** Page 2 of 2