Package Chemistry Substances Analysis Table TLC 056 (Pb-free solder balls) 7 x9x 1.2 mm 124 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball CAS Number unit weight(mg) Chemicals Present #1 Silicon 7440-21-3 12.8781 subtotal 12.8781 #1 Gold 7440-57-5 1.2512 subtotal 1.2512 #1 Epoxy resin Trade Secret 0.1446 #2 Polytetrafluoroethylene 9002-84-0 0.1183 subtotal 0.2630 #1 Copper 7440-50-8 6.3222 #2 Gold 7440-57-5 0.0044 #3 Nickel 7440-02-0 0.0242 Trade Secret 9.7942 #4 Epoxy p y resin #5 Aluminum Hydroxide 21645-51-2 3.7674 #6 SiO2 Glass Cloth 65997-17-3 7.3899 27.3023 subtotal #1 Silica (fused) 60676-86-0 61.9045 #2 Carbon Black 1333-86-4 0.1821 #3 Epoxy resin Trade Secret 10.0868 #4 Phosphoric organic catalyst Trade Secret 0.2185 #5 Metal Oxides Trade Secret 0.4370 72.8288 subtotal #1 Tin 7440-31-5 9.0757 #2 Silver 7440-22-4 0.0921 #3 Copper 7440-50-8 0.0461 9.2139 subtotal 123.7373 TOTAL PACKAGE unit weight/package (%) 10.4076 10.4076 1.0112 1.0112 0.1169 0.0956 0.2125 5.1094 0.0035 0.0196 7.9153 3.0447 5.9723 22.0647 50.0290 0.1471 8.1518 0.1766 0.3531 58.8576 7.3346 0.0745 0.0372 7.4463 100.0000 Amount (ppm) 104,076 104,076 10,112 10,112 1,169 956 2,125 51,094 35 196 79,153 , 30,447 59,723 220,647 500,290 1,471 81,518 1,766 3,531 588,576 73,346 745 372 74,463 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12919 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA056 (TLC056) - BKK - Au wire Document Number: 002-12919 Rev. ** ECN No. Orig. of Description of Change Change 5266688 AAC Initial Release. Document No. 002-12919 Rev. ** Page 2 of 2