Package Chemistry Substances Analysis Table VBH 084 (Pb-free solder balls) 11.6 x 8.0 mm 141.7 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball CAS Number unit weight(mg) Chemicals Present #1 Silicon 7440-21-3 20.3772 subtotal 20 3772 20.3772 #1 Copper 7440-50-8 0.3441 #2 Palladium (Pd) 7440-05-3 0.0060 0.3500 subtotal #1 Epoxy resin Trade Secret 0.2321 #2 Polytetrafluoroethylene 9002-84-0 0.1899 subtotal 0.4220 #1 Aluminium Hydroxide 21645-51-2 2.8149 #2 Copper 7440-50-8 8.9801 #3 Gold 7440-57-5 0.1934 #4 Nickel 7440-02-0 0.8920 #5 Epoxy resin Trade Secret 15.9649 #7 SiO2 Glass Cloth 65997-17-3 10.3936 39.2389 subtotal #1 Silica (fused) 60676-86-0 55.2850 #2 Carbon Black 1333-86-4 0.1626 #3 Epoxy resin Trade Secret 9.0082 #4 Phosphoric organic catalyst Trade Secret 0.1951 #5 Metal Oxides Trade Secret 0.3902 subtotal 65 0412 65.0412 #1 Tin 7440-31-5 13.4192 #2 Silver 7440-22-4 0.4172 #3 Copper 7440-50-8 0.0695 13.9059 subtotal TOTAL PACKAGE WEIGHT 139.3352 unit weight/package (%) Amount (ppm) 14.6246 146,246 14 6246 14.6246 146 246 146,246 0.2469 2,469 0.0043 43 0.2512 2,512 0.1666 1,666 0.1363 1,363 0.3028 3,028 2.0203 20,203 6.4449 64,449 0.1388 1,388 0.6402 6,402 11.4579 114,579 7.4594 74,594 28.1615 281,615 39.6777 396,777 0.1167 1,167 6.4651 64,651 0.1400 1,400 0.2801 2,801 46 6796 46.6796 466 796 466,796 9.6309 96,309 0.2994 2,994 0.0499 499 9.9802 99,802 100.0000 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be accurate to within 20 percent The report does not include materials not intentionally added to our products (impurities) or thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12975 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA084 (VBH084) - BKK - CuPd Wire Document Number: 002-12975 Rev. ** ECN No. Orig. of Description of Change Change 5269929 AAC Initial Release. Document No. 002-12975 Rev. ** Page 2 of 2