Material Declaration Datasheet (MDDS) FBGA048 (VBK048) BKK CuPd Non Pb Free.pdf

Package Chemistry Substances Analysis Table
Package Type:
Dimension:
Weight of Unit Package:
Temperature rating:
MSL:
Assembly Location:
Description
Silicon Die
Bond wire
Die Attach
Substrate
Mold compound
Solder ball
VBK 048 (SnPb solder balls)
8.15 x 6.15 x 1 mm
85mg
260°C
3
BKK
Product is NOT RoHS Compliant
Chemicals Present
#1 Silicon
subtotal
#1 Copper
#2 Palladium
subtotal
#1 Epoxy resin
#2 Polytetrafluoroethylene
subtotal
#1 Brominated Epoxy Resins
#2 Copper
#3 Gold
#4 Nickel
#5 Epoxy resin
#6 Silica
#7 SiO2 Glass Cloth
subtotal
#1 Silica (fused)
#2 Carbon Black
#3 Epoxy resin
#4 Phosphoric organic catalyst
subtotal
#1 Tin
#2 Lead
subtotal
CAS Number unit weight(mg)
7440-21-3
9.6568
9.6568
7440-50-8
0.2521
7440-05-3
0.0044
0.2565
Trade Secret
0.1521
9002-84-0
0.1244
0.2765
Trade Secret
1.5204
7440-50-8
10.9131
7440-57-5
0.0522
7440-02-0
0.2409
Trade Secret
9.0503
14808-60-7
1.2865
65997-17-3
5.6137
28.6771
60676-86-0
32.7392
1333-86-4
0.0740
Trade Secret
3.9953
Trade Secret
0.1850
36.9935
7440-31-5
5.7164
7439-92-1
3.3573
9.0737
TOTAL PACKAGE
84.9340
unit weight/package (%)
11.3698
11.3698
0.2968
0.0051
0.3020
0.1790
0.1465
0.3255
1.7901
12.8489
0.0615
0.2836
10.6557
1.5147
6.6095
33.7639
38.5467
0.0871
4.7040
0.2178
43.5556
6.7304
3.9528
10.6832
100.0000
Amount (ppm)
113,698
113,698
2,968
51
3,020
1,790
1,465
3,255
17,901
128,489
615
2,836
106,557
15,147
66,095
337,639
385,467
871
47,040
2,178
435,556
67,304
39,528
106,832
1,000,000
Disclaimer:
In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought to be
accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations
less than 1 ppm.
Document No. 002-12863 Rev. **
Page 1 of 2
CYPRESS
Company Confidential
Document History Page
Document Title:
Material Declaration Datasheet (MDDS) - FBGA048 (VBK048) - BKK - CuPd - Non Pb Free
Document Number: 002-12863
Rev.
**
ECN No. Orig. of Description of Change
Change
5260107 AAC
NEW RELEASE
Document No. 002-12863 Rev. **
Page 2 of 2
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