Cypress Semiconductor Package Qualification Report QTP# 042905 VERSION 2.0 March 2005 48-Ball Very Thin Fine Pitch Ball Grid Array (VFBGA) (6 x 8 x 1.0mm) SnAgCu, MSL3, 260C Reflow (AEC-Q100 Automotive) ASE-Taiwan (G) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodger Principal Reliability Engineer (408) 943-2722 Sabbas Daniel Quality Engineering Director (408) 943-2685 Anca Voicu Product Engineering Manager (408) 943-2753 Cypress Semiconductor Assembly: ASE-Taiwan (G) Package: 48-ball VFBGA, SnAgCu, MSL3, 260C Reflow, AEC-Q100 Automotive 042905 Version. 2.0 Page 2 of 5 March 2005 PACKAGE QUALIFICATION HISTORY Qual Report 042905 Description of Qualification Purpose 48-Ball VFBGA (6 x 8 x 1.0) Packages, SnAgCu, MSL3, 260C Reflow, AEC-Q100 Automotive assembled in ASE-Taiwan using CY62137CV30LL Date Comp Feb 05 Cypress Semiconductor Assembly: ASE-Taiwan (G) Package: 48-ball VFBGA, SnAgCu, MSL3, 260C Reflow, AEC-Q100 Automotive MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: BZ48 48-ball VFBGA (6 x 8 x 1.0mm) Shinetsu KMC211AA-EC V-O per UL94 Oxygen Rating Index: >28% Substrate Material: BT Resin Lead Finish, Composition / Thickness: SnAgCu Die Backside Preparation Method/Metallization: N/A Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik 2025D Die Attach Material: 100A Die Attach Method: Silver Epoxy Bond Diagram Designation: 10-05976 Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0 mil Thermal Resistance Theta JA °C/W: 57 °C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 49-00111 Name/Location of Assembly (prime) facility: ASE-Taiwan (G) ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Fault Coverage: 100% 042905 Version. 2.0 Page 3 of 5 March 2005 Cypress Semiconductor Assembly: ASE-Taiwan (G) Package: 48-ball VFBGA, SnAgCu, MSL3, 260C Reflow, AEC-Q100 Automotive 042905 Version. 2.0 Page 4 of 5 March 2005 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Ball Shear Cypress Spec 24-00018 P Bond Pull Cypress Spec 24-00002 P External Visual Cypress Spec 25-00038 P High Temp Storage 150 C, no bias P Physical Dimensions Cypress Spec. 25-00031 P High Accelerated Saturation 130°C, 3.6V, 85%RH Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C P Pressure Cooker 121C, 100%RH Precondition: JESD22 Moisture Sensitivity MSL3 P 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C Solderability Cypress Spec. 25-00018 P Temperature Cycle JEDEC22, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C P Cypress Semiconductor Assembly: ASE-Taiwan (G) Package: 48-ball VFBGA, SnAgCu, MSL3, 260C Reflow, AEC-Q100 Automotive 042905 Version. 2.0 Page 5 of 5 March 2005 Reliability Test Data QTP #: 042905 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej 4419854 610440463 TAIWN-G COMP 10 0 4419854 610440463 TAIWN-G COMP 5 0 4419854 610440463 TAIWN-G COMP 297 0 STRESS: BALL SHEAR CY62137CV30LL (7C62137C) STRESS: BOND PULL CY62137CV30LL (7C62137C) STRESS: EXTERNAL VISUAL CY62137CV30LL (7C62137C) STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.6V), PRE COND 192 HR 30C/60%RH, MSL3 CY62137CV30LL (7C62137C) 4419854 610440463 TAIWN-G 96 85 0 CY62137CV30LL (7C62137C) 4419854 610440463 TAIWN-G 128 85 0 610440463 TAIWN-G 1000 49 0 610440463 TAIWN-G COMP 10 0 STRESS: HIGH TEMPERATURE STORAGE, no bias CY62137CV30LL (7C62137C) 4419854 STRESS: PHYSICAL DIMENSIONS CY62137CV30LL (7C62137C) 4419854 STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192 HR 30C/60%RH, MSL3 CY62137CV30LL (7C62137C) 4419854 610440463 TAIWN-G 96 78 0 CY62137CV30LL (7C62137C) 4419854 610440463 TAIWN-G 168 78 0 4419854 610440463 TAIWN-G COMP 10 0 STRESS: SOLDERABILITY CY62137CV30LL (7C62137C) STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY62137CV30LL (7C62137C) 4419854 610440463 TAIWN-G 500 50 0 CY62137CV30LL (7C62137C) 4419854 610440463 TAIWN-G 1000 43 0 Failure Mechanism