Document No. 001-87292 Rev. *A ECN #4353962 Cypress Semiconductor Automotive Package Qualification Report QTP# 130503 VERSION *A April 2014 Automotive 28L SOIC (300 mils) NiPdAu (Ru), MSL3, 260C Reflow JCET-China (JT) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Lorena R. Zapanta (ILZ) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro(RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 001-87292 Rev. *A ECN #4353962 PRODUCT QUALIFICATION HISTORY QTP Number 130503 Description of Qualification Purpose Qualification of SOIC 28LD (300Mils) Package for Automotive Application Assembled at JCET , China Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date April 2013 Document No. 001-87292 Rev. *A ECN #4353962 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: SZ283 Package Outline, Type, or Name: 28L SOIC Mold Compound Name/Manufacturer: EMEG620B /Sumitomo Mold Compound Flammability Rating: UL94 V0 Mold Compound Alpha Emission Rate: 0.002 CPH/cm2 Oxygen Rating Index: >28% N/A Lead Frame Designation: Reduced Metal Pad Lead Frame Material: Copper: Samsung Techwin Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu (Roughened) Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafersaw Die Attach Supplier: Sumitomo Die Attach Material: CRM1076WD Bond Diagram Designation 001-72856 Wire Bond Method: Thermosonic Wire Material/Size: 1.0 mil / Au Thermal Resistance Theta JA C/W: N/A Package Cross Section Yes/No: Yes Assembly Process Flow: 001-67698 / M Name/Location of Assembly (prime) facility: JT-JCET China MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 001-87292 Rev. *A ECN #4353962 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Latch-up Sensitivity High Temperature Operating Life Early Failure Rate Test Condition (Temp/Bias) Result P/F AEC-Q100-002 P AEC-Q100-011 P AEC-Q100-004 AEC-Q100-008 and JESD22-A108, 150 C Dynamic Operating Condition, Vcc = 5.2V P High Temperature Operating Life Latent Failure Rate JESD22-A108, 150 C /125C Dynamic Operating Condition, Vcc = 5.75V P High Accelerated Saturation Test (HAST) JESD22-A110,130 C, 85%RH, 5.2V Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22-A103, 150 C P JESD22- A104, -65 C to 150 C Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) Mil-Std 883, Method 2011 P P Wire Bond Shear JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) AEC Q100-001 Wire Bond Pull Mil-Std 883, Method 2011 P Solderability JESD22-B102 P Electrical Distributions AEC Q100-009 P Physical Dimensions JESD22B100 and B108 P High Temperature Storage Life Test Temperature Cycle Post Temperature Cycle Wire Bond Pull Pressure Cooker Test Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P P P Document No. 001-87292 Rev. *A ECN #4353962 Reliability Test Data QTP #: 130503 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C199D (7A199NC) 4226590 611300481 JT-CHINA COMP 22 0 CY7C199D (7A199NC) 4226590 611300482 JT-CHINA COMP 22 0 CY7C199D (7A199NC) 4226590 611300483 JT-CHINA COMP 22 0 4226590 611300481 JT-CHINA COMP 5 0 4226590 611300481 JT-CHINA COMP 5 0 611300481 JT-CHINA COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BOND SHEAR CY7C199D (7A199NC) STRESS: BOND PULL CY7C199D (7A199NC) STRESS: CONSTRUCTIONAL ANALYIS CY7C199D (7A199NC) 4226590 STRESS: DYE PENETRATION TEST CY7C199D (7A199NC) 4226590 611300481 JT-CHINA COMP 15 0 CY7C199D (7A199NC) 4226590 611300482 JT-CHINA COMP 15 0 CY7C199D (7A199NC) 4226590 611300483 JT-CHINA COMP 15 0 611300481 JT-CHINA COMP 30 0 JT-CHINA COMP 3 0 JT-CHINA COMP 3 0 JT-CHINA COMP 3 0 COMP 3 0 COMP 3 0 COMP 3 0 STRESS: ELECTRICAL DISTRIBUTION CY7C199D (7A199NC) 4226590 STRESS: ESD-CHARGE DEVICE MODEL, 250V CY7C199D (7A199NC) 4142187 611202758 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY7C199D (7A199NC) 4142187 611202758 STRESS: ESD-CHARGE DEVICE MODEL, 750V CY7C199D (7A199NC) 4142187 611202758 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (500V) CY7C199D (7A199NC) 4142187 611202758 JT-CHINA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (1000V) CY7C199D (7A199NC) 4142187 611202758 JT-CHINA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (1500V) CY7C199D (7A199NC) 4142187 611202758 JT-CHINA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 001-87292 Rev. *A ECN #4353962 Reliability Test Data QTP #: 130503 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (2000V) CY7C199D (7A199NC) 4142187 611202758 JT-CHINA COMP 3 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 5.2V, Vcc Core CY7C199D (7A199NC) 4226590 611302812 JT-CHINA 48 800 0 CY7C199D (7A199NC) 4226590 611302813 JT-CHINA 48 800 0 CY7C199D (7A199NC) 4226590 611302814 JT-CHINA 48 800 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 5.75V, Vcc Core CY7C199D (7A199NC) 4226590 611300481 JT-CHINA 408 77 0 CY7C199D (7A199NC) 4226590 611300482 JT-CHINA 408 73 0 JT-CHINA COMP 6 0 STRESS: STATIC LATCH-UP TESTING, 125C, +/-140ma CY7C199D (7A199NC) 4142187 611202758 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.2V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C199D (7A199NC) 4226590 611300481 JT-CHINA 96 76 0 CY7C199D (7A199NC) 4226590 611300482 JT-CHINA 96 77 0 CY7C199D (7A199NC) 4226590 611300483 JT-CHINA 96 77 0 611300481 JT-CHINA 1000 77 0 STRESS: HIGH TEMP STORAGE CY7C199D (7A199NC) 4226590 STRESS: PHYSICAL DIMENSION CY7C199D (7A199NC) 4226590 611300481 JT-CHINA COMP 10 0 CY7C199D (7A199NC) 4226590 611300482 JT-CHINA COMP 10 0 CY7C199D (7A199NC) 4226590 611300483 JT-CHINA COMP 10 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 001-87292 Rev. *A ECN #4353962 Reliability Test Data QTP #: 130503 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY7C199D (7A199NC) 4226590 611300481 JT-CHINA 96 77 0 CY7C199D (7A199NC) 4226590 611300481 JT-CHINA 168 77 0 CY7C199D (7A199NC) 4226590 611300482 JT-CHINA 96 77 0 CY7C199D (7A199NC) 4226590 611300482 JT-CHINA 168 77 0 CY7C199D (7A199NC) 4226590 611300483 JT-CHINA 96 77 0 CY7C199D (7A199NC) 4226590 611300483 JT-CHINA 168 77 0 CY7C199D (7A199NC) 4226590 611302812 JT-CHINA COMP 15 0 CY7C199D (7A199NC) 4226590 611302813 JT-CHINA COMP 15 0 CY7C199D (7A199NC) 4226590 611302814 JT-CHINA COMP 15 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C199D (7A199NC) 4226590 611300481 JT-CHINA 500 77 0 CY7C199D (7A199NC) 4226590 611300481 JT-CHINA 1000 77 0 CY7C199D (7A199NC) 4226590 611300482 JT-CHINA 500 77 0 CY7C199D (7A199NC) 4226590 611300482 JT-CHINA 1000 77 0 CY7C199D (7A199NC) 4226590 611300483 JT-CHINA 500 77 0 CY7C199D (7A199NC) 4226590 611300483 JT-CHINA 1000 77 0 611300481 JT-CHINA COMP 5 0 STRESS: POST TCT BOND PULL CY7C199D (7A199NC) 4226590 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No. 001-87292 Rev. *A ECN #: 4353962 Document History Page Document Title: QTP 130503: AUTOMOTIVE 28LD SOIC (3000 MILS) NIPDAU (Roughened), MSL3, 260C REFLOW JCET-CHINA (JT) QUALIFICATION REPORT Document Number: 001-87292 Rev. ECN No. ** 3979128 *A 4353962 Orig. of Change ILZ ILZ Description of Change Initial Spec Release Sunset spec review Updated front page to reflect new qual report template per Spec 001-57716 Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8