CYSTEKEC BTA733A3

Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2005.01.03
Page No. : 1 / 5
CYStech Electronics Corp.
General Purpose PNP Epitaxial Planar Transistor
BTA733A3
Description
• The BTA733A3 is designed for use in driver stage of AF amplifier and general purpose amplification.
• High HFE and excellent linearity
• Complementary to BTC945A3.
• Pb-free package
Symbol
Outline
BTA733A3
TO-92
B:Base
C:Collector
E:Emitter
ECB
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Base Current
Power Dissipation
Thermal Resistance, Junction to Ambient
Junction Temperature
Storage Temperature
BTA733A3
Symbol
Limits
Unit
VCBO
VCEO
VEBO
IC
IB
Pd
RθJA
Tj
Tstg
-60
-50
-5
-100
-20
625
200
150
-55~+150
V
V
V
mA
mA
mW
°C/W
°C
°C
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2005.01.03
Page No. : 2 / 5
Characteristics (Ta=25°C)
Symbol
BVCEO
ICBO
IEBO
*VCE(sat)
VBE
hFE
fT
Cob
Min.
-50
-0.58
135
100
-
Typ.
-
Max.
-0.1
-0.1
-0.3
-0.68
600
6
Unit
V
µA
µA
V
V
MHz
pF
Test Conditions
IC=-1mA
VCB=-60V
VEB=-5V
IC=-100mA, IB=-10mA
VCE=-6V, IC=-1mA
VCE=-6V, IC=-1mA
VCE=-6V, IC=-10mA
VCB=-10V, f=1MHz
*Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2%
Classification Of hFE
Rank
Range
BTA733A3
Q
135~270
P
200~400
K
300~600
CYStek Product Specification
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2005.01.03
Page No. : 3 / 5
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
1000
Saturation Voltage---(mV)
Current Gain---HFE
[email protected]=6V
100
VCE(SAT)@IC=10IB
100
10
10
0.1
1
10
100
0.1
1000
10
100
1000
Collector Current---IC(mA)
Collector Current---IC(mA)
Saturation Voltage vs Collector Current
Cutoff Frequency vs Collector Current
1
Cutoff Frequency---FT(GHZ)
10000
Saturation Voltage---(mV)
1
VBE(SAT)@IC=10IB
1000
[email protected]=12V
0.1
100
0.1
1
10
100
Collector Current---IC(mA)
1000
1
10
100
Collector Current---IC(mA)
Power Derating Curve
Power Dissipation---PD(mW)
700
600
500
400
300
200
100
0
0
50
100
150
200
Ambient Temperature --- Ta(℃ )
BTA733A3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2005.01.03
Page No. : 4 / 5
TO-92 Taping Outline
H2
H2A H2A
H2
D2
A
L
H3
H4 H
L1
H1
D1
F1F2
T2
T
T1
DIM
A
D
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
BTA733A3
P1
P
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
W1
W
D
P2
Millimeters
Min.
4.33
3.80
0.36
4.33
2.40
15.50
8.50
2.50
12.50
5.95
50.30
0.36
17.50
5.00
253
Max.
4.83
4.20
0.53
4.83
2.90
±0.3
16.50
9.50
1
1
27
21
11
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
CYStek Product Specification
Spec. No. : C306A3
Issued Date : 2003.07.14
Revised Date : 2005.01.03
Page No. : 5 / 5
CYStech Electronics Corp.
TO-92 Dimension
Marking:
α2
A
B
1
2
3
A733
α3
C
D
H
I
G
Style: Pin 1.Emitter 2.Collector 3.Base
α1
E
3-Lead TO-92 Plastic Package
CYStek Package Code: A3
F
*: Typical
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5°
*2°
*2°
Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5°
*2°
*2°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTA733A3
CYStek Product Specification