VISHAY SI7948DP

Si7948DP
Vishay Siliconix
New Product
Dual N-Channel 60-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
60
rDS(on) (W)
ID (A)
0.075 @ VGS = 10 V
4.6
0.100 @ VGS = 4.5 V
4.0
TrenchFET Power MOSFET
New Low Thermal Resistance PowerPAK
Dual MOSFET for Space Savings
APPLICATIONS
Automotive
- ABS
- Coil Driver
- Load Switch
PowerPAK SO-8
D1
S1
6.15 mm
1
Package
D2
5.15 mm
G1
2
S2
3
G2
4
G1
D1
8
G2
D1
7
D2
6
D2
5
S1
Bottom View
S2
N-Channel MOSFET
N-Channel MOSFET
Ordering Information: Si7948DP-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
60
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150C)a
TA = 25C
TA = 70C
Pulsed Drain Current
ID
Continuous Source Current (Diode
Conduction)a
Single Avalanche Current
IS
L = 0.1 mH
Single Avalanche Energy
TA = 25C
Maximum Power Dissipationa
TA = 70C
Operating Junction and Storage Temperature Range
3.0
3.6
2.4
15
A
2.7
1.2
IAS
15
EAS
11
PD
V
4.6
IDM
mJ
3.3
1.4
2.1
0.9
TJ, Tstg
Unit
-55 to 150
W
C
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Case (Drain)
Symbol
t v 10 sec
Steady State
Steady State
RthJA
RthJC
Typical
Maximum
29
38
60
85
4.0
5.2
Unit
C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 72403
S-31867—Rev. A, 15-Sep-03
www.vishay.com
1
Si7948DP
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = 250 mA
1
IGSS
Typ
Max
Unit
3
V
VDS = 0 V, VGS = "20 V
"100
nA
VDS = 60 V, VGS = 0 V
1
VDS = 60 V, VGS = 0 V, TJ = 55C
5
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
15
VDS w 5 V, VGS = 10 V
rDS(on)
mA
A
VGS = 10 V, ID = 4.6 A
0.060
0.075
VGS = 4.5 V, ID = 4.0 A
0.080
0.100
gfs
VDS = 15 V, ID = 4.6 A
6
VSD
IS = 2.7 A, VGS = 0 V
0.8
1.2
12
20
W
S
V
Dynamicb
Total Gate Charge
Qg
VDS = 30 V, VGS = 10 V, ID = 15 A
nC
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
3.5
Gate Resostamce
Rg
1.5
td(on)
7
20
tr
8
25
15
40
7
20
30
60
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
VDD = 30 V, RL = 2 W
ID ^ 15 A, VGEN = 10 V, RG = 2.5 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
2
IF = 2.7 A, di/dt = 100 A/ms
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
15
15
VGS = 10 thru 4 V
12
I D - Drain Current (A)
I D - Drain Current (A)
12
9
6
3V
3
9
6
TC = 125C
3
25C
-55C
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VGS - Gate-to-Source Voltage (V)
Document Number: 72403
S-31867—Rev. A, 15-Sep-03
Si7948DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
800
700
0.10
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
0.12
VGS = 4.5 V
0.08
VGS = 10 V
0.06
0.04
Ciss
600
500
400
300
Coss
200
0.02
Crss
100
0.00
0
0
3
6
9
12
15
0
4
ID - Drain Current (A)
12
16
20
VDS - Drain-to-Source Voltage (V)
Gate Charge
On-Resistance vs. Junction Temperature
20
2.2
VDS = 30 V
ID = 15 A
r DS(on) - On-Resistance ( W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
8
16
12
8
4
VGS = 10 V
ID = 10 A
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0
0
4
8
12
16
20
0.6
-50
24
-25
0
Qg - Total Gate Charge (nC)
25
50
75
100
125
150
TJ - Junction Temperature (C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.200
40
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
0.175
TJ = 150C
10
TJ = 25C
0.150
0.125
ID = 4.6 A
0.100
0.075
0.050
0.025
1
0.0
0.000
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 72403
S-31867—Rev. A, 15-Sep-03
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
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Si7948DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.6
100
0.4
80
ID = 250 mA
TA = 25C
Single Pulse
-0.0
Power (W)
V GS(th) Variance (V)
0.2
-0.2
-0.4
60
40
-0.6
20
-0.8
-1.0
-50
-25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
10
1
Time (sec)
TJ - Temperature (C)
100
Safe Operating Area, Junction-to-Case
IDM Limited
10 ms
I D - Drain Current (A)
10
rDS(on)
Limited
100 ms
1 ms
1
10 ms
0.1
ID(on)
Limited
10 s
BVDSS Limited
0.01
0.1
100 ms
1s
TA = 25C
Single Pulse
1
10
dc, 100 S
100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 60C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 - 4
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4
10 - 3
10 - 2
10 - 1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72403
S-31867—Rev. A, 15-Sep-03
Si7948DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 - 4
10 - 3
10 - 2
10 - 1
1
10
100
Square Wave Pulse Duration (sec)
Document Number: 72403
S-31867—Rev. A, 15-Sep-03
www.vishay.com
5