LINER RH1034-1.2

RH1034-1.2
Micropower Dual
Reference
DESCRIPTION
ABSOLUTE MAXIMUM RATINGS
The RH1034-1.2 is a micropower, precision 1.2V reference
combined with a 7V auxiliary reference. The 1.2V reference
is a trimmed, thin-film, band-gap, voltage reference operating on only 20μA of quiescent current. The RH1034-1.2
offers guaranteed drift, low temperature cycling hysteresis
and good long-term stability. The low dynamic impedance
makes the RH1034-1.2 easy to use from unregulated supplies. The 7V reference is a subsurface zener device for
less demanding applications.
(Note 1)
Operating Current ..................................................20mA
Forward Current (Note 2) .......................................20mA
Operating Temperature Range................ –55°C to 125°C
Storage Temperature Range................... –65°C to 150°C
Lead Temperature (Soldering, 10 sec) .................. 300°C
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
The wafer lots are processed to Linear Technology’s inhouse Class S flow to yield circuits usable in stringent
military applications.
PACKAGE INFORMATION
TOP VIEW
BOTTOM VIEW
1.2V
7V
NC
1
10
NC
NC
2
9
NC
NC
3
8
1.2V
GND
4
7
7V
NC
5
6
NC
H PACKAGE
3-LEAD TO-46 METAL CAN
W PACKAGE
10-LEAD CERPAC
BURN-IN CIRCUIT
20V
14k
19.1k
7V
1.2V
RH10341.2 BC
1
RH1034-1.2
TABLE 1: ELECTRICAL CHARACTERISTICS
SYMBOL PARAMETER
CONDITIONS
(Preirradiation)
NOTES MIN
TA = 25°C
TYP MAX
1.210
1.240
1
SUBGROUP
–55°C ≤ TA ≤ 125°C SUBMIN TYP MAX GROUP
UNITS
1.2V Reference
VZ
Reverse Breakdown Voltage IR = 100μA
ΔVZ
ΔIR
Reverse Breakdown Voltage 20μA ≤ IR ≤ 2mA
Change with Current
2mA ≤ IR ≤ 20mA
2.0
8.0
Minimum Operating Current
rz
Temperature Coefficient
IR = 100μA
Reverse Dynamic
Impedance
IR = 100μA
3
1.195
1.255
2, 3
V
1
1
4.0
15.0
2, 3
2, 3
mV
mV
20
1
30
2, 3
μA
60
1
60
2, 3
ppm/°C
1.0
1
2.0
2, 3
Ω
Low Frequency Noise
IR = 100μA, 0.1Hz ≤ f ≤ 10Hz
4
μVP-P
Long-Term Stability
IR = 100μA
20
ppm/√kHrs
7V Reference
VZ
Reverse Breakdown Voltage IR = 100μA
ΔVZ
ΔIR
Reverse Breakdown Voltage 100μA ≤ IR ≤ 1mA
Change with Current
1mA ≤ IR ≤ 20mA
6.70
7.30
1
140
250
1
1
6.60
7.40
2, 3
V
190
350
2, 3
2, 3
mV
mV
Temperature Coefficient
IR = 100μA
60
ppm/°C
Long-Term Stability
IR = 100μA
20
ppm/√kHrs
TABLE 2: ELECTRICAL CHARACTERISTICS
SYMBOL PARAMETER
(Postirradiation) TA = 25°C.
CONDTIONS
10KRAD(Si) 20KRAD(Si) 50KRAD(Si) 100KRAD(Si) 200KRAD(Si)
NOTES MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX UNITS
1.202 1.248 1.197 1.253 1.187 1.263 1.172 1.278 1.142 1.308
1.2V Reference
VZ
Reverse Breakdown
Voltage
IR = 100μA
ΔVZ
ΔIR
Reverse Breakdown
Voltage Change with
Current
20μA ≤ IR ≤ 2mA
2mA ≤ IR ≤ 20mA
rz
Reverse Dynamic
Impedance
IR = 100μA
3
V
2.8
8.8
3.2
9.7
4.0
11.2
5.0
14.5
7.5
22.5
mV
mV
1.4
1.6
2.0
2.5
3.75
Ω
6.796 7.304 6.796 7.304 6.796 7.304 6.791 7.309 6.786 7.314
V
7V Reference
VZ
Reverse Breakdown
Voltage
IR = 100μA
ΔVZ
ΔIR
Reverse Breakdown
Voltage Change with
Current
100μA ≤ IR ≤ 1mA
1mA ≤ IR ≤ 20mA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
2
150
275
150
275
150
275
150
275
150
275
mV
mV
Note 2: Forward biasing either diode will affect the operation of the other
diode.
Note 3: This parameter guaranteed by “reverse breakdown voltage change
with current” test.
RH1034-1.2
TABLE 3: POST BURN-IN ENDPOINTS AND DELTA LIMITS
REQUIREMENTS TA = 25°C
ENDPOINTS LIMITS
SYMBOL PARAMETER
VZ
Reverse Breakdown Voltage
DELTA LIMITS
CONDITIONS
MIN
MAX
MIN
MAX
UNITS
IR = 100μA
1.210
1.240
–0.003
0.003
V
TABLE 4: ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
PDA Test Notes
The PDA is specified as 5% based on failures from group A, subgroup 1,
tests after cooldown as the final electrical test in accordance with method
5004 of MIL-STD-883. The verified failures of group A, subgroup 1, after
burn-in divided by the total number of devices submitted for burn-in in that
lot shall be used to determine the percent for the lot.
Linear Technology Corporation reserves the right to test to tighter limits
than those given.
SUBGROUP
Final Electrical Test Requirements (Method 5004)
1*,2,3
Group A Test Requirements (Method 5005)
1,2,3
Group B and D for Class S,
End Point Electrical Parameters (Method 5005)
1,2,3
*PDA applies to subgroup 1. See PDA Test Notes.
TOTAL DOSE BIAS CIRCUIT
20V
14k
19.1k
7V
1.2V
RH10341.2 BC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3
RH1034-1.2
TYPICAL PERFORMANCE CHARACTERISTICS
Reverse Breakdown Voltage
Change with Current (1.2V)
Reverse Breakdown Voltage (1.2V)
4.5
IR = 100μA
REVERSE BREAKDOWN VOLTAGE
CHANGE WITH CURRENT (mV)
1.270
3.5
1.260
1.250
1.240
1.230
3.0
2.5
2.0
1.5
1.0
2mA ≤ IR ≤ 20mA
15
10
5
0.5
0
1.220
1
10
100
TOTAL DOSE KRAD (Si)
0
10
100
TOTAL DOSE KRAD (Si)
1
1000
7.002
93.0
7.001
7.000
6.999
6.998
6.997
172
100μA ≤ IR ≤ 1mA
92.8
92.6
92.4
92.2
92.0
91.8
91.6
91.4
1000
1000
Reverse Breakdown Voltage
Change with Current (7V)
REVERSE BREAKDOWN VOLTAGE
CHANGE WITH CURRENT (mV)
REVERSE BREAKDOWN VOLTAGE
CHANGE WITH CURRENT (mV)
IR = 100μA
10
100
TOTAL DOSE KRAD (Si)
10
100
TOTAL DOSE KRAD (Si)
RH10341.2 G03
Reverse Breakdown Voltage
Change with Current (7V)
Reverse Breakdown Voltage (7V)
1
1
1000
RH10341.2 G02
RH10341.2 G01
REVERSE BREAKDOWN VOLTAGE (V)
20
20μA ≤ IR ≤ 2mA
4.0
REVERSE BREAKDOWN VOLTAGE
CHANGE WITH CURRENT (mV)
REVERSE BREAKDOWN VOLTAGE (V)
1.280
Reverse Breakdown Voltage
Change with Current (1.2V)
1mA ≤ IR ≤ 20mA
170
168
166
164
162
160
158
1
10
100
TOTAL DOSE KRAD (Si)
1000
RH10341.2 G05
RH10341.2 G04
1
10
100
TOTAL DOSE KRAD (Si)
1000
RH10341.2 G06
I.D. No. 66-10-103412
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Linear Technology Corporation
LT 1008 REV A • PRINTED IN USA
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