VISHAY SI4410DY-T1-A-E3

Si4410DY
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
D TrenchFETr Power MOSFET
rDS(on) ()
ID (A)
0.0135 @ VGS = 10 V
10
0.020 @ VGS = 4.5 V
8
D
SO-8
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
G
Top View
S
Ordering Information: Si4410DY-REVA
Si4410DY-T1-REVA (with Tape and Reel)
Si4410DY-REVA-E3 (Lead free)
Si4410DY-T1-A-E3 (Lead free with Tape and Reel)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
ID
V
10
8
IDM
50
IS
2.3
PD
Unit
2.5
1.6
A
W
TJ, Tstg
- 55 to 150
_C
Symbol
Limit
Unit
Maximum Junction-to-Ambienta
RthJA
50
Maximum Junction-to-Foot (Drain)
RthJF
22
THERMAL RESISTANCE RATINGS
Parameter
_C/W
Notes
a. Surface Mounted on FR4 Board, t v 10 sec.
Document Number: 71726
S-40838—Rev. L, 03-May-04
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Si4410DY
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = 250 A
1.0
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Typ
Max
Unit
3.0
V
"100
nA
Static
Gate Threshold Voltage
Drain Source On-State
Drain-Source
On State Resistancea
Forward Transconductancea
rDS(on)
DS( )
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 55_C
25
VDS w 5 V, VGS = 10 V
20
A
VGS = 10 V, ID =10 A
0.011
0.0135
VGS = 4.5 V, ID = 5 A
0.015
0.020
gfs
VDS = 15 V, ID = 10 A
38
VSD
IS = 2.3 A, VGS = 0 V
0.7
1.1
Gate Charge
Qg
VDS = 15 V, VGS = 5 V, ID = 10 A
20
34
Total Gate Charge
Qgt
37
60
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Diode Forward Voltagea
A
S
V
Dynamicb
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
VDS = 15 V,
V VGS = 10 V
V, ID = 10 A
VDS = 15 V, VGS = 10 V, ID = 10 A
Rg
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
VDD = 25 V, RL = 25 ID ^ 1 A, VGEN = 10 V, RG = 6 IF = 2.3 A, di/dt = 100 A/s
nC
7.0
0.5
td(on)
tr
7
1.5
2.6
19
30
9
20
70
100
20
80
40
80
ns
Notes
a. Pulse test; pulse width v 300 s, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing. Values shown are for product revision A.
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Document Number: 71726
S-40838—Rev. L, 03-May-04
Si4410DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
50
Transfer Characteristics
50
VGS = 10 V thru 4 V
40
I D - Drain Current (A)
I D - Drain Current (A)
40
30
20
3V
10
30
20
TC = 125_C
10
25_C
- 55_C
0
0
0
2
4
6
8
10
0
1
VDS - Drain-to-Source Voltage (V)
5
Ciss
2500
C - Capacitance (pF)
rDS(on) - On-Resistance (
4
Capacitance
3000
0.025
0.020
VGS = 4.5 V
0.015
VGS = 10 V
0.010
0.005
2000
1500
1000
Coss
500
0.000
Crss
0
0
10
20
30
40
50
0
6
ID - Drain Current (A)
12
18
24
30
VDS - Drain-to-Source Voltage (V)
Gate Charge
On-Resistance vs. Junction Temperature
10
2.0
VDS = 15 V
ID = 10 A
VGS = 10 V
ID = 10 A
8
6
4
2
0
0
8
16
24
Qg - Total Gate Charge (nC)
Document Number: 71726
S-40838—Rev. L, 03-May-04
32
40
1.5
(Normalized)
rDS(on) - On-Resistance (
V GS - Gate-to-Source Voltage (V)
3
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.030
2
1.0
0.5
0.0
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
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Si4410DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
TJ = 150_C
10
TJ = 25_C
1
0.0
On-Resistance vs. Gate-to-Source Voltage
0.10
r DS(on) - On-Resistance ( )
I S - Source Current (A)
40
0.08
0.06
0.04
ID = 10 A
0.02
0.00
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
4
6
8
10
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
Threshold Voltage
0.6
2
Single Pulse Power
80
0.4
60
ID = 250 A
- 0.0
Power (W)
VGS(th) Variance (V)
0.2
- 0.2
- 0.4
- 0.6
40
20
- 0.8
- 1.0
- 50
- 25
0
25
50
75
100
125
0
0.01
150
0.10
TJ - Temperature (_C)
10.00
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
1.00
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
t1
1. Duty Cycle, D =
t2
2. Per Unit Base = RthJA = 50_C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
10
30
Square Wave Pulse Duration (sec)
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Document Number: 71726
S-40838—Rev. L, 03-May-04