UNITPOWER US2419

US2419
P-Ch 20V Fast Switching MOSFETs
General Description
Product Summery
The US2419 is the highest performance trench
N-ch MOSFETs with extreme high cell density ,
which provide excellent RDSON and gate charge
for most of the small power switching and load
switch applications.
The US2419 meet the RoHS and Green Product
requirement with full function reliability approved.
BVDSS
RDS(ON)
ID
-20V
205mΩ
-2.3A
Applications
z High Frequency Point-of-Load Synchronous s
Small power switching for MB/NB/UMPC/VGA
z Networking DC-DC Power System
z Load Switch
Features
z Advanced high cell density Trench technology
SOT23 Pin Configuration
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@TC=25℃
ID@TC=100℃
IDM
Rating
Units
Drain-Source Voltage
-20
V
Gate-Source Voltage
±8
V
1
-2.3
A
1
-1.8
A
-5
A
Continuous Drain Current, -VGS @ -4.5V
Continuous Drain Current, -VGS @ -4.5V
Pulsed Drain Current
2
3
PD@TC=25℃
Total Power Dissipation
1.56
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
RθJA
Thermal Resistance Junction-ambient
RθJC
1
Thermal Resistance Junction-Case
1
1
Typ.
Max.
Unit
---
125
℃/W
---
80
℃/W
US2419
P-Ch 20V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
Static Drain-Source On-Resistance2
VGS(th)
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
VGS=0V , ID=-250uA
-20
---
---
V
Reference to 25℃ , ID=-1mA
---
-0.011
---
V/℃
VGS=-4.5V , ID=-2A
---
170
205
VGS=-2.5V , ID=-1.5A
---
235
280
315
380
-0.3
-0.5
-1
V
---
2.02
---
mV/℃
VDS=-16V , VGS=0V , TJ=25℃
---
---
-1
VDS=-16V , VGS=0V , TJ=55℃
---
---
-5
VGS=-1.8V , ID=-1A
VGS=VDS , ID =-250uA
mΩ
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±8V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=-5V , ID=-2A
---
3.4
---
S
Qg
Total Gate Charge (-4.5V)
---
4.6
---
Qgs
Gate-Source Charge
---
0.27
---
Qgd
Gate-Drain Charge
---
2.34
---
Td(on)
VDS=-20V , VGS=-4.5V , ID=-2A
nC
---
11.6
---
Rise Time
VDD=-12V , VGS=-4.5V , RG=3.3Ω
---
6.2
---
Turn-Off Delay Time
ID=-1A
---
31.8
---
Fall Time
---
2.8
---
Ciss
Input Capacitance
---
194
---
Coss
Output Capacitance
---
35.5
---
Crss
Reverse Transfer Capacitance
---
28.2
---
Min.
Typ.
Max.
Unit
---
---
-2.3
A
---
---
-5
A
---
---
-1
V
Tr
Td(off)
Tf
Turn-On Delay Time
uA
VDS=-15V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
IS
ISM
VSD
Parameter
Conditions
1,4
Continuous Source Current
2,4
Pulsed Source Current
2
Diode Forward Voltage
VG=VD=0V , Force Current
VGS=0V , IS=-1A , TJ=25℃
Note :
2
1.The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
2
US2419
P-Ch 20V Fast Switching MOSFETs
Typical Characteristics
360
4
ID=-2A
320
VGS=-5V
3
280
RDSON (mΩ)
-ID Drain Current (A)
VGS=-4.5V
VGS=-3V
240
2
VGS=-2.5V
200
1
160
VGS=-1.8V
120
0
0
0.5
1
1.5
2
2
-VDS , Drain-to-Source Voltage (V)
Fig.1 Typical Output Characteristics
4
6
-VGS (V)
8
10
Fig.2 On-Resistance vs. Gate-Source
4
4.5
-VGS Gate to Source Voltage (V)
-IS Source Current(A)
VDS=-20V
3
2
TJ=150℃
TJ=25℃
ID=-2A
3
1.5
1
0
0.00
0
0.30
0.60
0.90
1.20
0
-VSD , Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics Of Reverse
2
3
QG , Total Gate Charge (nC)
4
5
Fig.4 Gate-Charge Characteristics
1.8
Normalized On Resistance
1.8
1.4
1.4
Normalized VGS(th)
1
1.0
1
0.6
0.6
0.2
0.2
-50
0
50
100
150
-50
TJ ,Junction Temperature (℃ )
0
50
100
TJ , Junction Temperature (℃)
Fig.5 Normalized VGS(th) vs. TJ
Fig.6 Normalized RDSON vs. TJ
3
150
US2419
P-Ch 20V Fast Switching MOSFETs
1000
10.00
10us
100us
Ciss
-ID (A)
1.00
100
10ms
100ms
0.10
Coss
DC
Crss
TC=25℃
Single Pulse
10
0.01
1
5
9
13
17
21
0.1
1
-VDS , Drain to Source Voltage (V)
10
100
-VDS (V)
Fig.8 Safe Operating Area
Fig.7 Capacitance
1
Normalized Thermal Response (RθJC)
Capacitance (pF)
F=1.0MHz
DUTY=0.5
0.2
0.1
0.1
0.05
0.01
0.01
PDM
TON
D = TON/T
SINGLE PULSE
0.001
0.0001
0.001
T
TJpeak = TC + PDM x RθJC
0.01
0.1
1
10
100
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
Fig.11 Gate Charge Waveform
4
1000