SiP2204 Quad Channel Monolithic Power Stage

SiP2204
www.vishay.com
Vishay Siliconix
Quad Channel Monolithic Power Stage
DESCRIPTION
FEATURES
The SiP2204 is a quad channel, fully-integrated monolithic
power stage optimized for multi-phase synchronous buck
applications. The part has very fast propagation to enable
switching frequencies of up to 10 MHz/channel and offers a
high power density design for use in applications such as
envelope tracking power supplies for RF Power amplifiers
used in next generation 4G base stations.
• QFN32 5x5 package
Packaged in QFN32 5x5, SiP2204 supports input voltages
up to 24 V and delivers 500 mA continuous current for each
channel.
• Low PWM propagation delay (typical 13 ns)
The SiP2204 incorporates four independent MOSFET gate
driver ICs that work with both 3.3 V and 5 V PWM inputs.
• Power stage input up to 24 V
• 500 mA per channel continuous current
• 2 A per channel peak current capability
• High frequency operation beyond 5 MHz
• 3.3 V / 5 V PWM logic
• Enable feature to put the output at high impedance when
disabled
• Junction temperature: -40 °C to +125 °C
APPLICATIONS
• Envelope tracking (ET) supplies for RF power amplifiers
(LDMOS, GaAs FET, GaAs HBT or GaN based)
• Synchronous buck converters
TYPICAL APPLICATION CIRCUIT
VIN12
VDRV12
VZ12
VCIN
EN
SW1
PWM1
AGND
PGND
Fig. 1 - Typical Application Circuit for SiP2204
(channel 1 shown)
S15-0515-Rev. A, 23-Mar-15
Document Number: 62619
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiP2204
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Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL PARAMETER
CONDITIONS
LIMIT
VINx
-0.3 to +26
VCIN
-0.3 to +6
Input Voltage
Control Logic Supply Voltage
Low-side Driver Supply Voltage
VDRVx
Switch Node (DC voltage)
-0.3 to +6
-0.3 to +26
SWX
Switch Node (AC voltage) (1)
High-side Regulator Output Monitor Voltage
V
29
VZX
(VINX - 6) to VINX and VZx > -0.3 V
All Logic Inputs and Outputs
(PWMX and EN)
-0.3 to VCIN + 0.3
Max. Operating Junction Temperature
TJ
150
Ambient Temperature
TA
-40 to +125
Storage Temperature
Tstg
-65 to +150
Human body model, JESD22-A114
3000
Charged device model, JESD22-C101
1000
Electrostatic Discharge Protection
UNIT
°C
V
Notes
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
(1) The specification values indicated “AC” is SW to P
X
GND, 29 V (< 50 ns), max.
RECOMMENDED OPERATING RANGE
ELECTRICAL PARAMETER
Input Voltage (VINx)
MINIMUM
TYPICAL
MAXIMUM
10
-
24
Low-side Driver Supply Voltage (VDRVx)
4.5
5
5.5
Control Logic Supply Voltage (VCIN)
4.5
5
5.5
Thermal Resistance from Junction to PCB
-
25
-
Thermal Resistance from Junction to Case
-
1
-
S15-0515-Rev. A, 23-Mar-15
UNIT
V
°C/W
Document Number: 62619
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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SiP2204
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Vishay Siliconix
PIN CONFIGURATION
VZ 12 - 25
PGND - 27
VDRV 12 - 26
PGND - 28
SW - 30
SW 1 - 29
VIN 12 - 31
VIN 12 - 32
24 - AGND
SW 2 - 1
SW 2 - 2
PGND - 3
PGND - 4
PGND - 5
PGND - 6
SW 3 - 7
SW 3 - 8
23 - VCIN
22 - PWM 1
33 - AGND
21 - PWM 2
20 - PWM 3
19 - PWM 4
18 - EN
VZ 34 - 16
PGND - 14
VDRV 34 - 15
PGND - 13
SW 4 - 12
SW 4 - 11
VIN 34 - 9
VIN 34 - 10
17 - AGND
Fig. 2 - Pin Configuration for SiP2204
PIN CONFIGURATION
PIN NUMBER
PIN NAME
1, 2
SW2
Channel 2 driver output
PIN DESCRIPTION
3 to 6,
13, 14, 27, 28
PGND
Low-side driver power return for all channels
Channel 3 driver output
7, 8
SW3
9, 10
VIN34
Power stage input voltage and high-side driver power supply for channel 3 and 4
11, 12
SW4
Channel 4 driver output
15
VDRV34
16
VZ34
18
EN
19
PWM4
Channel 4 PWM input (In phase with SW)
20
PWM3
Channel 3 PWM input (In phase with SW)
21
PWM2
Channel 2 PWM input (In phase with SW)
22
PWM1
Channel 1 PWM input (In phase with SW)
23
VCIN
Supply voltage for internal logic circuitry
17, 24, 33
AGND
Analog ground
25
VZ12
26
VDRV12
Low-side driver power supply for channel 3 and 4
High-side regulator output monitor for channel 3 and 4
Global enable pin. Active high.
High-side regulator output monitor for channel 1 and 2
Low-side driver power supply for channel 1 and 2
29, 30
SW1
Channel 1 driver output
31, 32
VIN12
Power stage input voltage and high-side driver power supply for channel 1 and 2
S15-0515-Rev. A, 23-Mar-15
Document Number: 62619
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiP2204
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ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITION
UNLESS OTHERWISE SPECIFIED
VDRVX = VCIN = EN = 5 V, VINX = 15 V,
VINX - VZX = 5 V, no load,
PWM rise and fall time = 2 ns
TA = 25 °C for typical value
JUNCTION TEMPERATURE
-40 °C to +125 °C
unless otherwise specified
MIN.
TYP.
UNIT
MAX.
POWER SUPPLY
Power Stage Input and
High-side Driver Supply Current
Control Logic and Low-side
Driver Supply Current
IVIN
IVCIN +
IVDRV
EN = 0 V, PWMX = 0 V
-
-
1
PWMX = 0 V
-
90
130
PWMX = 3.3 V (80k pull-up on high-side gate)
-
230
330
Fsw = 4 MHz,
D = 10 %, one channel
-
14
27.5
EN = 0 V, no switching, PWM = 0
-
-
1
PWMX = 0 V (80k pull-down on low-side gate)
-
370
530
PWMX = 3.3 V
-
90
130
Fsw = 4 MHz,
D = 10 %, one channel
-
5
8
μA
mA
μA
mA
PWMx/EN LOGIC (ALSO SEE TIMING DIAGRAM BELOW FOR ILLUSTRATION)
PWMx/EN Rising Threshold
VTH_R
2.4
-
-
PWMx/EN Falling Threshold
VTH_F
-
-
0.8
PWMX Supply Current
IPWM
PWMX = 5 V
-
-
1
EN Supply Current
IEN
REN = 1 MΩ to AGND
-
-
8
PWM ON Time (1)
tPWM_ON
12
-
-
8
15
22
PWM Rising Propagation Delay
tPD_R_PWM
From PWM rises to 1.7 V to SW rises to 1.5 V; 25 °C
From PWM rises to 1.7 V to SW rises to 1.5 V
-
-
25
From PWM falls to 1.7 V to SW falls to 1.5 V; 25 °C
7
18
26
From PWM falls to 1.7 V to SW falls to 1.5 V
-
-
30
From PWM rises to 1.7 V to SW rises to 1.5 V; 25 °C
-
0.4
0.75
From PWM rises to 1.7 V to SW rises to 1.5 V
-
-
1
tPD_EN
From EN rise to VCIN to SW start switching
-
5
-
Low-side ON Resistance
RDS(on)_N
Isw = 0.1 A
-
0.35
0.56
High-side ON Resistance
RDS(on)_P
Isw = 0.1 A, VIN - VZ = 5 V
-
0.55
0.92
PWM Falling Propagation Delay
tPD_F_PWM
PWM Propagation Delay
Matching (2)
tPD_M_PWM
EN Propagation Delay
V
μA
ns
μs
OUTPUT DRIVER
Ω
Notes
(1) Guaranteed by design.
(2) Difference between the maximum and minimum PWM propagation delay among 4 channels.
S15-0515-Rev. A, 23-Mar-15
Document Number: 62619
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiP2204
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Vishay Siliconix
FUNCTIONAL BLOCK DIAGRAM
VINX
High Slide
Regular
VCIN
VZX
Control
and
BBM
EN
SWX
VDRVX
PWMX
AGND
PGND
Device includes four
equivalent blocks
Fig. 3 - Functional Block Diagram for SiP2204
ORDERING INFORMATION
PART NUMBER
PACKAGE
MARKING
(LINE 2: P/N)
SiP2204EMP-T1-GE4
QFN32 5x5
SiP2204
SiP2204DB
Reference board
P/N
FYWLL
Format:
Line 1: Dot
Line 2: Part number code
Line 2: Siliconix logo + ESD symbol
Line 3: Factory code + year code + work week code + lot code
S15-0515-Rev. A, 23-Mar-15
Document Number: 62619
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiP2204
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Vishay Siliconix
TIMING WAVEFORMS
VIN = 15 V
SWX
tR = 2 ns
VCIN = 5 V
PWM high = 3.3 V
PWM low = 0 V
tR= 2 ns
PWMX
EN
ENTDR
PWMTDR
1.7 V
10 % VIN
SWX
Fig. 4 - Timing Waveform for SiP2204
Fig. 5 - Timing Waveform for SiP2204
DETAILED OPERATIONAL DESCRIPTION
PWM Input
Ground Connections (AGND and PGND)
The PWM input receives the PWM control signal from the VR
controller IC. The PWM input is designed to be compatible
with standard controllers using two state logic (H and L) on
the PWM output. For two state logic, the PWM input
operates as follows. When PWM is driven above VTH_PWM_R
the low-side is turned OFF and the high-side is turned ON.
When PWM input is driven below VTH_PWM_F the high-side
turns OFF and the Low-side turns ON. The SiP2204
incorporates PWM voltage thresholds that is compatible
with 3.3 V and 5 V logic.
PGND (power ground) should be externally connected to
AGND (analog ground). The layout of the printed circuit board
should be such that the inductance separating the AGND and
PGND should be a minimum. Transient differences due to
inductance effects between these two pins should not
exceed 0.5 V.
Enable (EN)
In the low state, the EN pin shuts down the device. In
this state, standby current is minimized. If EN is left
unconnected, an internal pull-down resistor will pull the pin
to AGND and shuts down the device. The EN pin is a global
enable for all four channels when driven above VTH_EN_R.
Control and Drive Supply Voltage Input (VDRV, VCIN)
VCIN is the bias supply for the logic control circuitry of the IC.
VDRVx is the bias supply for the low-side gate drivers. It is
recommended to separate these pins through a resistor.
This creates a low pass filtering effect to avoid coupling of
high frequency gate drive noise into the logic circuitry.
High-Side Regulator Output Monitor (VZ)
VZ12 and VZ34 are the output monitors for the high-side
regulators. VZX is regulated to 5 V below VIN (typical).
Voltage Input (VIN)
The power input to the drain of the high-side power
MOSFET and the high-side driver supply. This pin is
connected to the high power intermediate BUS rail. An
80 kΩ resistor is connected between the high-side gate and
VIN.
Switch Node (SWX)
The switch node, SW, is the circuit power stage output. This
is the output applied to the power inductor and output filter
to deliver the output for the buck converter.
S15-0515-Rev. A, 23-Mar-15
Document Number: 62619
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiP2204
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Vishay Siliconix
ELECTRICAL CHARACTERISTICS (VOUT = 2 V, VCIN = VDRVx = 5 V, L = 4.7 μH, unless otherwise noted)
100
100
90
90
80
Efficiency (%)
Efficiency (%)
80
70
60
50
70
60
50
40
40
30
30
20
20
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0
2
0.2
0.4
0.6
0.8
IOUT (A)
Fig. 6 - Efficiency vs. IOUT
VIN = 8 V, fSW = 1 MHz
1
1.2
IOUT (A)
1.4
1.6
1.8
2
Fig. 9 - Efficiency vs. IOUT
VIN = 10 V, fSW = 5 MHz
100
100
90
90
80
Efficiency (%)
Efficiency (%)
80
70
60
50
70
60
50
40
40
30
30
20
0
20
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0.2
0.4
0.6
2
1
1.2
1.4
1.6
1.8
2
1.6
1.8
2
IOUT (A)
IOUT (A)
Fig. 7 - Efficiency vs. IOUT
VIN = 8 V, fSW = 5 MHz
Fig. 10 - Efficiency vs. IOUT
VIN = 12 V, fSW = 1 MHz
100
100
90
90
80
80
Efficiency (%)
Efficiency (%)
0.8
70
60
50
70
60
50
40
40
30
30
20
20
0
0.2
0.4
0.6
0.8
1
1.2
1.4
IOUT (A)
Fig. 8 - Efficiency vs. IOUT
VIN = 10 V, fSW = 1 MHz
S15-0515-Rev. A, 23-Mar-15
1.6
1.8
2
0
0.2
0.4
0.6
0.8
1
1.2
IOUT (A)
1.4
Fig. 11 - Efficiency vs. IOUT
VIN = 12 V, fSW = 5 MHz
Document Number: 62619
7
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SiP2204
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100
100
90
90
80
80
Efficiency (%)
Efficiency (%)
ELECTRICAL CHARACTERISTICS (VOUT = 2 V, VCIN = VDRVx = 5 V, L = 4.7 μH, unless otherwise noted)
70
60
70
60
50
50
40
40
30
30
20
20
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0
2
0.2
0.4
0.6
0.8
IOUT (A)
1.4
1.6
1.8
2
1.6
1.8
2
Fig. 14 - Efficiency vs. IOUT
VIN = 18 V, fSW = 1 MHz
Fig. 12 - Efficiency vs. IOUT
VIN = 15 V, fSW = 1 MHz
100
100
90
90
80
80
Efficiency (%)
Efficiency (%)
1
1.2
IOUT (A)
70
60
50
70
60
50
40
40
30
30
20
20
0
0.2
0.4
0.6
0.8
1
1.2
1.4
IOUT (A)
Fig. 13 - Efficiency vs. IOUT
VIN = 15 V, fSW = 5 MHz
S15-0515-Rev. A, 23-Mar-15
1.6
1.8
2
0
0.2
0.4
0.6
0.8
1
1.2
IOUT (A)
1.4
Fig. 15 - Efficiency vs. IOUT
VIN = 18 V, fSW = 5 MHz
Document Number: 62619
8
For technical questions, contact: [email protected]
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SiP2204
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ELECTRICAL CHARACTERISTICS
(VIN = 15 V, VOUT = 2 V, VCIN = VDRVx = 5 V, IOUT = 0.5 A, fSW = 5 MHz, L = 4.7 μH, unless otherwise noted)
CH1
CH3
Fig. 16 - Output Switching Waveform
CH1 (YLLW) = SW1 (5 V/div.), Time = 10 ns/div.
CH2
Fig. 19 - Output Switching Waveform
CH3 (YLLW) = SW3 (5 V/div.), Time = 10 ns/div.
CH4
Fig. 17 - Output Switching Waveform
CH2 (YLLW) = SW2 (5 V/div.), Time = 10 ns/div.
Fig. 20 - Output Switching Waveform
CH4 (YLLW) = SW4 (5 V/div.), Time = 10 ns/div.
PWMX
PWMX
CH
1, 2, 3, 4
CH
1, 2, 3, 4
Fig. 18 - Propagation Delay - Rising (all channels)
CH1 = (VLT) = SW1 (5 V/div.), CH2 = (RED) = SW2 (5 V/div.),
CH3 = (BLU) = SW3 (5 V/div.), CH4 = (GRN) = SW4 (5 V/div.),
PWMX (YLLW) = 2 V/div., Time = 5 ns/div.
S15-0515-Rev. A, 23-Mar-15
Fig. 21 - Propagation Delay - Falling (all channels)
CH1 = (VLT) = SW1 (5 V/div.), CH2 = (RED) = SW2 (5 V/div.),
CH3 = (BLU) = SW3 (5 V/div.), CH4 = (GRN) = SW4 (5 V/div.),
PWMX (YLLW) = 2 V/div., Time = 5 ns/div.
Document Number: 62619
9
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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-
JUMPER
2
1
1uF
2
50
R12
J14 JUMPER
C25
50
R11
10k
R8
10k
R7
DNP
Y
Vcc
Y
Y
Vcc
NC7SZ125
DNP
R17 DNP
Vee
A
OE
U4
R16
Vee
A
OE
Vcc
U3 NC7SZ125
R15
Vee
A
OE
U2 NC7SZ125
R13
0
C34
1uF
Vcin
1
2
JUMPER
J18
1uF
GND
TP4
17
18
19
20
21
22
23
24
Vin
GND
J5
DNP
C29
AGND
EN
PWM4
PWM3
PWM2
PWM1
CIN
AGND
C1
R1
C10
1uF
R4
TBA
2.2uF
2.2uF
TBA
C18
TP13
C17
GND
2.2uF
TBA
C21
10uF
C8 2.2uF
C7
TBA
Vo1
TP7
10uF
SiP2204
16
J17
1
J13 JUMPER
1uF
50
R10
10k
R6
R14 DNP
Y
Vcc
14
+
+
J16
2
Vee
A
Vcc
U1 NC7SZ125
OE
C13
15
JUMPER
C24
1
1uF
J12 JUMPER
C23
50
R9
10k
R5
Vcin
1uF
C9
C2
C14
13
-
-
+
JUMPER
J15
2
Vcc
TP2
TP3
DNP
C28
GND
12
PWM4
-
1
1uF
J11 JUMPER
C22
IC1
Vin
GND
VZ34
11
PWM3
PWM2
PWM1
+
2
1
1
TP8
VDVR34
Vcin
2
VZ12
PGND
1
VDVR12
SW4
1
1
1
SW4
2
PGND
PGND
1
SW1
1
25
SW1
Vo4
TP14
1
0.68uH
L4
10
9
8
7
6
5
4
3
2
1
32
Vin
C30
GND
TP16
Vin
10nF
Vin
TP5
10uF
C32
TBA
TP15
C11
1
0.68uH
L3
GND
TP6
C19
10uF
0.68uH
L2
C20 TBA
R3 TBA
TBA
R2
10nF
31
C26
C12
10nF
Vo4
J4
VIN34
VIN34
SW3
SW3
PGND
PGND
PGND
PGND
SW2
SW2
VIN12
VIN12
0.68uH
L1
Vo1
J1
1
10nF
10uF
C31
2.2uF
C5
2.2uF
C3
Vin
C27
1
1
Vcin
26
PGND
1
27
10uF
C33
2.2uF
C6
2.2uF
C4
Vin
J9
GND
J10
10uF
C16
10uF
C15
Vo2
TP10
GND
TP9
1
28
1
29
GND
J6
Vo2
J2
GND
TP11
1
S15-0515-Rev. A, 23-Mar-15
30
Vo3
TP12
1
J8
J7
Vo3
J3
GND
SiP2204
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DEMO BOARD SCHEMATIC
Fig. 22 - Reference Board Schematic for SiP2204
Document Number: 62619
10
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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BILL OF MATERIALS
ITEM
QTY.
REFERENCE
COMPONENT VALUE
PCB FOOTPRINT
1
8
C1, C2, C3, C4, C5, C6, C7, C8
2.2 μF, 6.3 V
0805
2
4
C9, C10, C13, C34
1 μF, 6.3 V
0402
3
4
C11, C12, C26, C27
10 nF, 25 V
0805
4
4
C14, C15, C16, C17
10 μF, 6.3 V
1206
5
4
C18, C19, C20, C21
DNP
0603
6
4
C22, C23, C24, C25
1 μF, 10 V
0603
7
2
C28, C29
DNP
0603
8
4
C30, C31, C32, C33
10 μF, 25 V
1210
9
1
IC1
SiP2204
QFN5x5-32
10
1
J1
Vo1
Banana
11
1
J2
Vo2
Banana
12
1
J3
Vo3
Banana
13
1
J4
Vo4
Banana
14
5
J5, J6, J7, J8, J10
GND
Banana
15
1
J9
VIN
Banana
16
8
J11, J12, J13, J14, J15, J16, J17, J18
JUMPER
Jumper2
17
4
L1, L2, L3, L4
4.7 μH
IHLP2525A
18
4
PWM1, PWM2, PWM3, PWM4
SMA connect
SMA
19
4
R1, R2, R3, R4
DNP
R0805-Vishay
20
4
R5, R6, R7, R8
10K
R0805-Vishay
21
4
R9, R10, R11, R12
50
R1206-Vishay
22
1
R13
0
R0805-Vishay
23
4
R14, R15, R16, R17
DNP
R0603-Vishay
24
1
TP2
Vcin
TP30
25
1
TP3
VCC
TP30
26
7
TP4, TP6, TP8, TP9, TP11, TP13, TP16
GND
TP30
27
2
TP5, TP15
VIN
TP30
28
1
TP7
Vo1
TP30
29
1
TP10
Vo2
TP30
30
1
TP12
Vo3
TP30
31
1
TP14
Vo4
TP30
32
4
U1, U2, U3, U4
NC7SZ125
SOT23-5
S15-0515-Rev. A, 23-Mar-15
Document Number: 62619
11
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiP2204
www.vishay.com
Vishay Siliconix
PCB LAYOUT OF REFERENCE BOARD
Fig. 23 - Top Layer
Fig. 25 - Inner 2
Fig. 24 - Inner 1
Fig. 26 - Bottom
S15-0515-Rev. A, 23-Mar-15
Document Number: 62619
12
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiP2204
www.vishay.com
Vishay Siliconix
RECOMMANDED PADS FOR QFN32 5 x 5
5.3
3.2
32 x 0.63
3.2
32 x 0.28
5.3
0.5 pitch
Dimension are in millimeters
S15-0515-Rev. A, 23-Mar-15
Document Number: 62619
13
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiP2204
www.vishay.com
Vishay Siliconix
PACKAGE DRAWING
D2
A
D
Pin 1 location
indentifier (5)
B
32 31 30 29 28 27 26 25
K
Pin 1 location
indentifier (5)
25 26 27 28 29 30 31 32
0.1 C
L
1
24
24
1
2
23
23
2
3
22
22
3
4
21
21
4
5
20
20
5
E
6
19
19
6
7
18
18
7
8
17
17
8
9 10 11 12 13 14 15 16
Terminal Tip (4)
0.1 C
16 15 14 13 12 11 10
e
9
E2
b
0.1 M C A B
Bottom view
Top view
0.1 C
C
A
0.1 C
Seating plane
Side view
DIM.
A1 A3
MILLIMETERS
INCHES
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.75
0.85
0.95
0.029
0.033
0.037
A1
0.00
-
0.05
0.000
-
0.002
A3
b
0.20 ref.
0.18
D
D2
0.25
0.008 ref.
0.30
0.007
5.00 BSC
3.00
3.10
0.010
0.012
0.197 BSC
3.20
0.118
0.122
e
0.50 BSC
0.020 BSC
E
5.00 BSC
0.197 BSC
0.126
E2
3.00
3.10
3.20
0.118
0.122
0.126
K
0.20
-
-
0.008
-
-
L
0.30
0.40
0.50
0.012
0.016
0.020
N (3)
32
32
Nd (3)
8
8
Ne (3)
8
8
Notes
(1) Use millimeters as the primary measurement
(2) Dimensioning and tolerances conform to ASME Y14.5M. - 1994
(3) N is the number of terminals,
Nd is the number of terminals in X-direction and
Ne is the number of terminals in Y-direction.
(4) Dimension b applies to plated terminal and is measured between 0.15 mm and 0.30 mm from terminal tip
(5) The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other feature of package body
(6) Package warpage max. 0.05 mm
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?62619.
S15-0515-Rev. A, 23-Mar-15
Document Number: 62619
14
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
QFN32 5 x 5 Case Outline
D2
A
D
Pin 1 location
indentifier (5)
B
32 31 30 29 28 27 26 25
K
Pin 1 location
indentifier (5)
25 26 27 28 29 30 31 32
0.1 C
L
1
24
24
1
2
23
23
2
3
22
22
3
4
21
21
4
5
20
20
5
E
6
19
19
6
7
18
18
7
8
17
17
8
9 10 11 12 13 14 15 16
Terminal Tip (4)
0.1 C
16 15 14 13 12 11 10
e
9
E2
b
0.1 M C A B
Bottom view
Top view
0.1 C
C
A
0.1 C
Seating plane
Side view
DIM.
A1 A3
MILLIMETERS
INCHES
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.75
0.85
0.95
0.029
0.033
0.037
A1
0.00
-
0.05
0.000
-
0.002
0.30
0.007
A3
b
0.20 ref.
0.18
D
D2
0.25
0.008 ref.
5.00 BSC
3.00
3.10
0.010
0.012
0.197 BSC
3.20
0.118
0.122
e
0.50 BSC
0.020 BSC
E
5.00 BSC
0.197 BSC
0.126
E2
3.00
3.10
3.20
0.118
0.122
0.126
K
0.20
-
-
0.008
-
-
L
0.30
0.40
0.50
0.012
0.016
0.020
N (3)
32
32
Nd (3)
8
8
Ne (3)
8
8
Notes
(1) Use millimeters as the primary measurement
(2) Dimensioning and tolerances conform to ASME Y14.5M. - 1994
(3) N is the number of terminals,
Nd is the number of terminals in X-direction and
Ne is the number of terminals in Y-direction.
(4) Dimension b applies to plated terminal and is measured between 0.15 mm and 0.30 mm from terminal tip
(5) The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other feature of package body
(6) Package warpage max. 0.05 mm
S14-2079-Rev. A, 20-Oct-14
DWG: 6027
Document Number: 67244
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 20-Oct-14
PAD Pattern
www.vishay.com
Vishay Siliconix
Recommended Land Pattern QFN32 5 x 5
5.3
3.2
32 x 0.63
3.2
32 x 0.28
5.3
0.5 x pitch
Dimensions are in millimeters
Revision: 02-Oct-14
Document Number: 63414
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000