AOD2904

AOD2904
100V N-Channel MOSFET
General Description
Product Summary
VDS
• Trench Power MV MOSFET technology
• Low RDS(ON)
• Low Gate Charge
• Optimized for fast-switching applications
Applications
ID (at VGS=10V)
100V
70A
RDS(ON) (at VGS=10V)
< 10mΩ
RDS(ON) (at VGS=6V)
< 12.5mΩ
100% UIS Tested
100% Rg Tested
• Synchronous Rectification in DC/DC and AC/DC Converters
• Industrial and Motor Drive applications
TO252
DPAK
D
Top View
Bottom View
D
D
S
G
G
S
S
G
Orderable Part Number
Package Type
Form
Minimum Order Quantity
AOD2904
TO-252
Tape & Reel
2500
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
Gate-Source Voltage
VGS
TC=25°C
Continuous Drain
Current G
Pulsed Drain Current
Avalanche Current
C
Avalanche energy
VDS Spike
L=0.1mH
C
10µs
TC=25°C
Power Dissipation B
TC=100°C
Power Dissipation A
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Case
Rev.1.0: April 2015
IAS
40
A
EAS
80
mJ
VSPIKE
120
V
125
Steady-State
Steady-State
W
62.5
2.5
W
1.6
TJ, TSTG
Symbol
t ≤ 10s
A
8.5
PDSM
Junction and Storage Temperature Range
A
10.5
PD
TA=25°C
V
180
IDSM
TA=70°C
±20
53
IDM
TA=25°C
Continuous Drain
Current
Units
V
70
ID
TC=100°C
C
Maximum
100
RθJA
RθJC
-55 to 175
Typ
15
40
1.0
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°C
Max
20
50
1.2
Units
°C/W
°C/W
°C/W
Page 1 of 6
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
Conditions
Min
ID=250µA, VGS=0V
100
Zero Gate Voltage Drain Current
IGSS
VGS(th)
Gate-Body leakage current
VDS=0V, VGS=±20V
Gate Threshold Voltage
VDS=VGS, ID=250µA
2.3
TJ=125°C
VGS=6V, ID=20A
gFS
Forward Transconductance
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current G
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=50V, f=1MHz
f=1MHz
SWITCHING PARAMETERS
Qg(10V)
Total Gate Charge
Qgs
Gate Source Charge
VGS=10V, VDS=50V, ID=20A
µA
5
VGS=10V, ID=20A
VDS=5V, ID=20A
Units
1
TJ=55°C
Static Drain-Source On-Resistance
Max
V
VDS=100V, VGS=0V
IDSS
RDS(ON)
Typ
0.25
±100
nA
2.9
3.4
V
8.2
10
14.2
17.2
9.7
12.5
mΩ
1
V
70
A
62
0.7
mΩ
S
2785
pF
238
pF
12
pF
0.55
0.85
37
52
Ω
nC
11.5
nC
Qgd
Gate Drain Charge
5
nC
tD(on)
Turn-On DelayTime
13
ns
tr
Turn-On Rise Time
8.5
ns
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
VGS=10V, VDS=50V, RL=2Ω,
RGEN=3Ω
29
ns
4
ns
IF=20A, dI/dt=500A/µs
35
Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs
210
ns
nC
Body Diode Reverse Recovery Time
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R θJA t≤ 10s and the maximum allowed junction temperature of 150°C. The value in any given application
depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Single pulse width limited by junction temperature TJ(MAX)=175°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev.1.0: April 2015
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Page 2 of 6
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
10V
100
6V
VDS=5V
80
80
5V
60
ID(A)
ID (A)
60
40
40
125°C
4.5V
20
20
25°C
VGS=4V
0
0
0
1
2
3
4
2
5
3
4
5
6
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
VDS (Volts)
Figure 1: On-Region Characteristics (Note E)
14
2.4
Normalized On-Resistance
2.2
12
RDS(ON) (mΩ)
VGS=6V
10
8
VGS=10V
6
VGS=10V
ID=20A
2
1.8
1.6
1.4
VGS=6V
ID=20A
1.2
1
0.8
4
0
5
10
15
20
25
0
30
25
50
75
100
125
150
175
200
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
24
1.0E+02
ID=20A
1.0E+01
125°C
1.0E+00
125°C
16
IS (A)
RDS(ON) (mΩ)
20
12
1.0E-01
25°C
1.0E-02
8
1.0E-03
25°C
4
1.0E-04
0
1.0E-05
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Rev.1.0: April 2015
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0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
Page 3 of 6
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
3500
VDS=50V
ID=20A
Ciss
3000
Capacitance (pF)
VGS (Volts)
8
6
4
2500
2000
1500
1000
2
Coss
500
Crss
0
0
0
10
20
30
40
50
0
20
Qg (nC)
Figure 7: Gate-Charge Characteristics
60
80
100
VDS (Volts)
Figure 8: Capacitance Characteristics
500
1000.0
TJ(Max)=175°C
TC=25°C
10µs
10µs
100.0
RDS(ON)
limited
10.0
400
100µs
Power (W)
ID (Amps)
40
1ms
10ms
1.0
DC
TJ(Max)=175°C
TC=25°C
0.1
0.0
0.01
300
200
100
0.1
1
10
100
1000
VDS (Volts)
VGS> or equal to 6V
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
0
0.0001 0.001 0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toCase (Note F)
ZθJC Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJC=1.2°C/W
1
PDM
0.1
Single Pulse
Ton
T
0.01
1E-05
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Rev.1.0: April 2015
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Page 4 of 6
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
140
120
Power Dissipation (W)
IAR (A) Peak Avalanche Current
1000
TA=25°C
TA=100°C
100
TA=150°C
TA=125°C
100
80
60
40
20
0
10
1
10
100
0
1000
25
50
75
100
150
175
10000
80
TA=25°C
70
1000
60
50
Power (W)
Current rating ID(A)
125
TCASE (°C)
Figure 13: Power De-rating (Note F)
Time in avalanche, tA (µs)
Figure 12: Single Pulse Avalanche capability
(Note C)
40
30
100
10
20
10
0
0
25
50
75
100
125
150
175
1
1E-05
ZθJA Normalized Transient
Thermal Resistance
TCASE (°C)
Figure 14: Current De-rating (Note F)
0.001
0.1
10
1000
Pulse Width (s)
Figure 15: Single Pulse Power Rating Junction-toAmbient (Note H)
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=50°C/W
0.1
PDM
0.01
Single Pulse
Ton
0.001
0.0001
0.001
0.01
0.1
1
10
T
100
1000
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)
Rev.1.0: April 2015
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Page 5 of 6
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
90%
+ Vdd
VDC
-
Rg
10%
Vgs
Vgs
td(on)
tr
td(off)
ton
tf
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
EAR= 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
Ig
Rev.1.0: April 2015
Vgs
L
Isd
+ Vdd
t rr
dI/dt
I RM
Vdd
VDC
-
IF
Vds
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Page 6 of 6