PTAC260302FC V1 Data Sheet, Rev. 03

PTAC260302FC
Confidential, Limited Internal Distribution
Thermally-Enhanced High Power RF LDMOS FET
30 W, 28 V, 2620 – 2690 MHz
Description
The PTAC260302FC is a 30-watt LDMOS FET intended for use in
multi-standard cellular power amplifier applications in the 2620 to
2690 MHz frequency band. This device integrates a 10-W (main)
and a 20-W (peak) transistor, making it ideal for asymmetric Doherty
amplifier designs. Features include input matching, high gain and
thermally-enhanced package with earless flange. Manufactured with
Infineon's advanced LDMOS process, this device provides excellent
thermal performance and superior reliability.
Features
Single-carrier WCDMA Drive-up
VDD = 28 V, IDQ = 85 mA,
ƒ = 2620, 2655, 2690 MHz,
3GPP WCDMA signal, 10 dB PAR,
3.84 MHz bandwidth
2620 MHz
2655 MHz
2690 MHz
-20
50
-30
40
-40
30
Efficiency
ACP Up
ACP Low
-50
-60
20
c260302f c_gr1
28
30
32
34
36
38
40
42
•
Asymmetric design
•
Broadband internal matching
•
Typical CW performance, 2690 MHz, 28 V
(Doherty configuration, combined output)
- Output power @ P3dB = 30 W
- Efficiency = 54%
- Gain = 13 dB
•
Typical single-carrier WCDMA performance,
2690 MHz, 28 V, 10 dB PAR
- Output power = 37.5 dBm avg
- Gain = 15.5 dB
- Efficiency = 45%
•
Capable of handling 10:1 VSWR @ 32 V, 30 W
(CW) output power
•
Integrated ESD protection
•
Pb-free and RoHS compliant
60
Drain Efficiency(%)
ACP Up and ACP Low (dBc)
-10
PTAC260302FC
Package H-37248H-4
10
44
Average Output Power (dBm)
RF Characteristics
Single-carrier WCDMA Measurements (tested in Infineon Doherty test fixture)
VDD = 28 V, IDQ = 85 mA, VGS1 = 1.1 V, POUT = 5.6 W avg, ƒ = 2690 MHz,
3GPP WCDMA signal, 3.84 MHz channel bandwidth, 10 dB peak/average @ 0.01% CCDF
Characteristic
Symbol
Min
Typ
Max
Unit
Linear Gain
Gps
14.5
15.5
—
dB
Drain Efficiency
ηD
42
45
—
%
ACPR
—
–27
–25
dBc
Adjacent Channel Power Ratio
All published data at TCASE = 25°C unless otherwise indicated
ESD: Electrostatic discharge sensitive device—observe handling precautions!
Data Sheet – DRAFT ONLY
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Rev. 03, 2013-03-07
PTAC260302FC
Confidential, Limited Internal Distribution
DC Characteristics (each side)
Characteristic
Conditions
Symbol
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
VGS = 0 V, IDS = 10 mA
V(BR)DSS
65
—
—
V
Drain Leakage Current
VDS = 28 V, VGS = 0 V
IDSS
—
—
1
µA
VDS = 63 V, VGS = 0 V
IDSS
—
—
10
µA
On-State Resistance
(main)
VGS = 10 V, VDS = 0.1 V
RDS(on)
—
0.8
—
Ω
(peak)
VGS = 10 V, VDS = 0.1 V
RDS(on)
—
0.6
—
Ω
VDS = 28 V, IDQ = 0.085 A
VGS
2
2.7
3.5
V
VDS = 28 V, IDQ = 0 A
VGS
0.4
1.1
1.8
V
VGS = 10 V, VDS = 0 V
IGSS
—
—
1
µA
Operating Gate Voltage (main)
(peak)
Gate Leakage Current
Maximum Ratings
Parameter
Symbol
Value
Unit
Drain-Source Voltage
VDSS
65
V
Gate-Source Voltage
VGS
–6 to +10
V
Junction Temperature
TJ
200
°C
TSTG
–65 to +150
°C
Storage Temperature Range
Thermal Resistance
(main)
(TCASE 70°C, 30 W CW)
RqJC
1.5
°C/W
(peak)
(TCASE 70°C, 30 W CW)
RqJC
1.7
°C/W
Ordering Information
Type and Version
Order Code
Package and Description
Shipping
PTAC 260302FC V1
PTAC260302FCV1XWSA1
H-37248H-4, Ceramic open-cavity, earless
Tray
PTAC 260302FC V1 R250
PTAC260302FCV1R250XTMA1
H-37248H-4, Ceramic open-cavity, earless
Tape & Reel
Data Sheet – DRAFT ONLY
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Rev. 03, 2013-03-07
PTAC260302FC
Confidential, Limited Internal Distribution
Pinout Diagram (top view)
S
Main
D1
D2
G1
G2
Pin
D1
D2
G1
G2
S (flange)
H-34284H-4_sl_do_pd_10-10-2012
Peak
Description
Drain device 1 (peak)
Drain device 2 (main)
Gate device 1 (peak)
Gate device 2 (main)
Source
Lead connections for PTAC260302FC
Single-carrier WCDMA Broadband
Single-carrier WCDMA Broadband
VDD = 28 V, IDQ = 85 mA, POUT = 37.5 dBm,
3GPP WCDMA signal, 10 dB PAR
VDD = 28 V, IDQ = 85 mA, POUT = 37.5 dBm,
3GPP WCDMA signal, 10 dB PAR
Efficiency
Gain (dB)
17
16
-5
-5
46
-10
-10
45
44
Gain
15
43
14
42
13
41
12
2580
ACP Up (dBc)
18
47
Drain Efficiency (%)
19
2660
2700
40
2740
Data Sheet – DRAFT ONLY
-20
-25
-25
-30
-30
ACP Up
-40
2580
Frequency (MHz)
-15
-20
-35
c260302f c_gr5
2620
Return Loss
-15
Return Loss (dB)
Typical Performance (data taken in a production test fixture)
-35
-40
2740
c260302f c_gr6
2620
2660
2700
Frequency (MHz)
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Rev. 03, 2013-03-07
PTAC260302FC
Confidential, Limited Internal Distribution
Single-carrier WCDMA Drive-up
VDD = 28 V, IDQ = 85 mA, ƒ = 2655 MHz,
3GPP WCDMA signal,
10 dB PAR, 3.84 MHz bandwidth
60
40
Efficiency
16
20
Gain
12
0
8
-20
PAR @ 0.01% CCDF
4
-40
0
c260302f c_gr2
28
32
36
40
-60
60
20
16
20
Gain
12
0
8
-20
PAR @ 0.01% CCDF
4
-40
0
c260302f c_gr3
28
44
36
40
Single-carrier WCDMA Drive-up
CW Performance
VDD = 28 V, IDQ = 85 mA, ƒ = 2690 MHz,
3GPP WCDMA signal,
10 dB PAR, 3.84 MHz bandwidth
VDD = 28 V, IDQ = 85 mA,
ƒ = 2620, 2655, 2690 MHz
24
60
Efficiency
18
17
20
Gain
12
0
8
-20
Gain (dB)
16
4
50
Gain
16
45
15
40
14
35
13
PAR @ 0.01% CCDF
11
c260302f c_gr4
32
36
40
-60
25
20
10
44
c260302f c_gr7
30
Average Output Power (dBm)
Data Sheet – DRAFT ONLY
30
2620 MHz
2655 MHz
2690 MHz
12
-40
28
55
40
Efficiency
0
-60
44
19
60
Efficency (%)
Peak/Average Ratio (dB), Gaun (dB)
32
Average Output Power (dBm)
Average Output Power (dBm)
20
40
Efficiency
32
34
36
38
40
42
Efficiency (%)
20
24
Efficency (%)
24
Peak/Average Ratio (dB), Gaun (dB)
Single-carrier WCDMA Drive-up
VDD = 28 V, IDQ = 85 mA, ƒ = 2620 MHz,
3GPP WCDMA signal,
10 dB PAR, 3.84 MHz bandwidth
Efficency (%)
Peak/Average Ratio (dB), Gaun (dB)
Typical Performance (cont.)
44
15
46
Output Power (dBm)
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Rev. 03, 2013-03-07
PTAC260302FC
Confidential, Limited Internal Distribution
Typical Performance (cont.)
CW Performance
at selected VDD
CW Performance
at selected VDD
IDQ = 85 mA, ƒ = 2620 MHz
IDQ = 85 mA, ƒ = 2655 MHz
16
18
55
17
50
Gain
15
45
14
40
13
35
VDD = 24 V
VDD = 28 V
VDD = 32 V
12
11
10
c260302f c_gr8
30
32
34
36
38
40
42
44
50
Gain
15
45
14
40
13
35
12
25
11
20
10
VDD = 24 V
VDD = 28 V
VDD = 32 V
25
30
32
34
36
38
40
42
44
CW Performance
at selected VDD
Small Signal CW
Gain & Input Return Loss
IDQ = 85 mA, ƒ = 2690 MHz
VDD = 28 V, IDQ = 85 mA
65
60
Efficiency
17
17.5
0
15.0
-2
55
15
45
14
40
13
35
VDD = 24 V
VDD = 28 V
VDD = 32 V
12
11
10
32
34
36
38
40
42
44
-6
10.0
-8
7.5
25
2.5
20
0.0
1950
46
-10
-12
-14
IRL
-16
3150
c260302f c_gr11
2150
2350
2550
2750
2950
Frequency (MHz)
Output Power (dBm)
Data Sheet – DRAFT ONLY
-4
Gain
5.0
30
c260302f c_gr10
30
12.5
Gain (dB)
50
Efficiency (%)
Gain
16
20
46
Output Power (dBm)
19
Gain (dB)
30
c260302f c_gr9
Output Power (dBm)
18
55
16
30
46
60
Efficiency
Input Return Loss (dB)
Gain (dB)
17
60
65
Efficiency (%)
Efficiency
19
Gain (dB)
18
65
Efficiency (%)
19
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Rev. 03, 2013-03-07
PTAC260302FC
Confidential, Limited Internal Distribution
Load Pull Performance
Z Source
Z Load
D
S
G
G
D
Main Side – Pulsed CW signal: 16 µsec, 10% duty cycle; 28 V, 85 mA
P1dB
Max Output Power
Freq
[MHz]
Zs Ω
Zl Ω
Gain
[dB]
POUT
dBm
Max PAE
POUT [W]
Zl Ω
PAE %
Gain [dB]
POUT
[dBm]
POUT [W]
PAE %
2620
26 – j22
10.9 – j9.7
19.7
42.36
17.2
61.0
5.9 – j7.0
21.6
40.70
11.7
66.4
2655
33 – j32
12.7 – j9.6
20.0
42.45
17.6
59.8
7.1 – j8.1
21.4
41.36
13.7
65.9
2690
55 – j34
15.2 – j11.4
19.3
42.86
19.3
55.1
6.8 – j9.0
21.2
41.33
13.6
64.4
Peak Side – Pulsed CW signal: 16 µsec, 10% duty cycle; 28 V, 115 mA
P1dB
Max Output Power
Freq
[MHz]
Zs Ω
Zl Ω
Gain
[dB]
POUT
dBm
Max PAE
POUT [W]
PAE %
Zl Ω
Gain [dB]
POUT
[dBm]
POUT [W]
PAE %
2620
36 - j41
11.5 - j14.9
19.6
43.11
20.5
58.8
6.4 - j13.4
20.9
41.92
15.6
63.9
2655
42 - j31
11.9 - j12.7
20
43.09
20.4
61.1
7.0 - j13.9
20.8
42.07
16.1
63.2
2690
55 - j33
12.9 - j15.0
19.5
42.87
19.4
57.2
7.8 - j15.1
20.5
42.16
16.4
61.8
Reference Circuit
DUT
PTAC2603022FC
Test Fixture Part No.
LTA/PTAC260302FC
PCB
Rogers 4350, 0.762 mm [.030"] thick, 2 oz. copper, εr = 3.66
Find Gerber files for this test fixture on the Infineon Web site at (http://www.infineon.com/rfpower)
Data Sheet – DRAFT ONLY
6 of 9
Rev. 03, 2013-03-07
PTAC260302FC
Confidential, Limited Internal Distribution
Reference Circuit (cont.)
R04350, 030
R04350 030
(61)
(105)
VGSpeak
VDD
C105
C101
C201
PTAC260302FC
R101
C102
C103
C208
R104
C104
RF_IN
C203
C205
C202
R103
S1
RF_OUT
C206
R102
C106
VGSmain
VDD
C204
C207
PTAC260302F_OUT_03_D
PTAC260302F_IN_03_D
c260302f c_cd_3-7- 13
Reference circuit assembly diagram (not to scale)
Component Information
Component
Description
Suggested Manufacturer
P/N
C101, C103
Capacitor, 10 µF, 50 V
Panasonic Electronic Components
EEV-HD1H100P
C102, C104, C105, C106
Chip capacitor, 18 pF
ATC
ATC100A180JW150XB
R101
Resistor, 50 Ohm
Anaren
C16A50Z4
R102
Resistor, 20 Ohm
Panasonic Electronic Components
ERJ-8GEYJ200V
R103, R104
Resistor, 10 Ohm
Panasonic Electronic Components
ERJ-3GEYJ100V
S1
Hybrid coupler
Anaren
X3C25P1_05S
C201, C202
Chip capacitor, 18 pF
ATC
ATC100A180JW150XB
C203, C207
Capacitor, 10 µF
Taiyo Yuden
UMK325C7106MM-T
C204, C205
Chip capacitor, 18 pF
ATC
ATC100A180JW150XB
C206, C208
Capacitor, 220 µF, 35 V
Panasonic Electronic Components
EEE-FP1V221AP
Input
Output
Data Sheet – DRAFT ONLY
7 of 9
Rev. 03, 2013-03-07
PTAC260302FC
Confidential, Limited Internal Distribution
Package Outline Specifications
Package H-37248H-4
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;“
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*
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6
Diagram Notes—unless otherwise specified:
1. Interpret dimensions and tolerances per ASME Y14.5M-1994.
2. Primary dimensions are mm. Alternate dimensions are inches.
3. All tolerances ± 0.127 [.005] unless specified otherwise.
4. Pins: D1, D2 – drains; G1, G2 – gates; S – source.
5. Lead thickness: 0.10 + 0.051/-0.025 mm [.004 +0.002/-0.001 inch].
6. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch].
(Find the latest and most complete information about products and packaging at the Infineon Internet page
(http://www.infineon.com/rfpower)
Data Sheet – DRAFT ONLY
8 of 9
Rev. 03, 2013-03-07
PTAC260302FC V1
Confidential, Limited Internal Distribution
Revision History:
Previous Version:
Page
all
3–7
2013-03-07
2012-11-28, Advance Specification
Subjects (major changes since last revision)
Product released to production. All information updated.
Performance graphs, load pull and circuit information added.
Data Sheet
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Edition 2013-03-07
Published by
Infineon Technologies AG
85579 Neubiberg, Germany
© 2012 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.
With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the
application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com/rfpower).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question,
please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device
or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be
implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
Data Sheet – DRAFT ONLY
9 of 9
Rev. 03, 2013-03-07