Advance Technical Information IXFK100N65X2 IXFX100N65X2 X2-Class HiPerFETTM Power MOSFET VDSS ID25 = = 650V 100A 30m RDS(on) N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode TO-264P (IXFK) Symbol Test Conditions Maximum Ratings VDSS VDGR TJ = 25C to 150C TJ = 25C to 150C, RGS = 1M 650 650 V V VGSS VGSM Continuous Transient 30 40 V V ID25 IDM TC = 25C TC = 25C, Pulse Width Limited by TJM 100 200 A A IA EAS TC = 25C TC = 25C 10 3.5 A J PD TC = 25C 1040 W dv/dt IS IDM, VDD VDSS, TJ 150°C 50 V/ns -55 ... +150 150 -55 ... +150 C C C 300 260 °C °C 1.13/10 Nm/lb.in 20..120 /4.5..27 N/lb 10 6 g g TJ TJM Tstg TL TSOLD Maximum Lead Temperature for Soldering Plastic Body for 10s Md Mounting Torque (TO-264) FC Mounting Force (PLUS247) Weight TO-264P PLUS247 G D Tab S PLUS247 (IXFX) G D Tab S G = Gate S = Source D = Drain Tab = Drain Features International Standard Packages Low QG Avalanche Rated Low Package Inductance Advantages Symbol Test Conditions (TJ = 25C Unless Otherwise Specified) Characteristic Values Min. Typ. Max. BVDSS VGS = 0V, ID = 1mA 650 VGS(th) VDS = VGS, ID = 4mA 2.7 IGSS VGS = 30V, VDS = 0V IDSS VDS = VDSS, VGS= 0V RDS(on) VGS = 10V, ID = 0.5 • ID25, Note 1 V 5.5 V 100 nA High Power Density Easy to Mount Space Savings Applications Switch-Mode and Resonant-Mode Power Supplies DC-DC Converters PFC Circuits AC and DC Motor Drives Robotics and Servo Controls TJ = 125C © 2015 IXYS CORPORATION, All Rights Reserved 50 A 5 mA 30 m DS100684(8/15) IXFK100N65X2 IXFX100N65X2 Symbol Test Conditions (TJ = 25C Unless Otherwise Specified) Characteristic Values Min. Typ. Max. gfs VDS = 10V, ID = 0.5 • ID25, Note 1 40 RGi Gate Input Resistance Ciss Coss tr td(off) tf S 0.7 nF 6.0 nF 2.0 pF 59 ns 24 ns 83 ns 7 ns 180 nC 92 nC 40 nC VGS = 0V, VDS = 25V, f = 1MHz Resistive Switching Times VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 RG = 2 (External) Qg(on) Qgs 68 11.3 Crss td(on) TO-264P Outline VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 Qgd RthJC 0.12C/W RthCS 0.15C/W E1 A E Q R Q1 D1 D R1 4 1 2 3 L1 D2 c b1 x2 e b2 b A Terminals: 1 = Gate 2,4 = Drain 3 = Source Source-Drain Diode Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) Characteristic Values Min. Typ. Max. IS VGS = 0V 100 A ISM Repetitive, Pulse Width Limited by TJM 400 A VSD IF = IS , VGS = 0V, Note 1 1.4 V trr QRM IRM 205 IF = 50A, -di/dt = 100A/s 1.8 VR = 100V, VGS = 0V PLUS247TM Outline ns μC 18.0 A Terminals: Note 1. Pulse test, t 300s, duty cycle, d 2%. 1 - Gate 2,4 - Drain 3 - Source ADVANCE TECHNICAL INFORMATION The product presented herein is under development. The Technical Specifications offered are derived from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a "considered reflection" of the anticipated result. IXYS reserves the right to change limits, test conditions, and dimensions without notice. IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXYS MOSFETs and IGBTs are covered 4,835,592 by one or more of the following U.S. patents: 4,860,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,381,025 5,486,715 6,162,665 6,259,123 B1 6,306,728 B1 6,404,065 B1 6,534,343 6,583,505 6,683,344 6,727,585 7,005,734 B2 6,710,405 B2 6,759,692 7,063,975 B2 6,710,463 6,771,478 B2 7,071,537 7,157,338B2