SP3902 Green Product S a mHop Microelectronics C orp. Ver 1.1 Dual N-Channel Enhancement Mode Field Effect Transistor FEATURES Super high dense cell design for low R DS(ON). PRODUCT SUMMARY V DSS ID R DS(ON) (m Ω) Max Rugged and reliable. 17 @ VGS=10V 30V Suface Mount Package. 10A 27 @ VGS=4.5V D1 D1 D2 D2 S1 G1 S2 G2 PIN1 PDFN 5x6 ABSOLUTE MAXIMUM RATINGS ( T A=25 °C unless otherwise noted ) Symbol Parameter Limit Units VDS Drain-Source Voltage 30 V VGS Gate-Source Voltage ±20 V ID Drain Current-Continuous TA=25°C 10 A TA=70°C 8 A IDM EAS -Pulsed ae b Single Pulse Avalanche Energy a PD Maximum Power Dissipation TJ, TSTG Operating Junction and Storage Temperature Range d 42 A 49 mJ TA=25°C 2.5 W TA=70°C 1.6 W -55 to 150 °C 50 °C/W THERMAL CHARACTERISTICS R JA Thermal Resistance, Junction-to-Ambient Details are subject to change without notice. Jul,18,2013 1 www.samhop.com.tw SP3902 Ver 1.1 ELECTRICAL CHARACTERISTICS ( T A=25 °C unless otherwise noted ) Symbol Parameter OFF CHARACTERISTICS BVDSS Drain-Source Breakdown Voltage Conditions Min VGS=0V , ID=250uA 30 IDSS Zero Gate Voltage Drain Current VDS=24V , VGS=0V IGSS Gate-Body Leakage Current VGS= ±20V , VDS=0V ON CHARACTERISTICS Gate Threshold Voltage VGS(th) RDS(ON) Drain-Source On-State Resistance gFS Forward Transconductance Max Units V 1 uA ±100 nA 1.7 2.5 V VGS=10V , ID=5A 13 17 m ohm VGS=4.5V , ID=4A 19 27 m ohm VDS=10V , ID=5A 18 S VDS=15V,VGS=0V f=1.0MHz 500 119 93 pF pF pF 12.8 14.6 ns ns 17.3 ns 16 9 ns VDS=VGS , ID=250uA 1.0 Typ c DYNAMIC CHARACTERISTICS Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS SWITCHING CHARACTERISTICS tD(ON) Turn-On Delay Time tr Rise Time tD(OFF) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge c VDD=15V ID=1A VGS=10V RGEN= 6 ohm VDS=15V,ID=5A,VGS=10V nC VDS=15V,ID=5A,VGS=4.5V 5.1 nC VDS=15V,ID=5A, VGS=10V 1.4 nC 3 nC DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS Diode Forward Voltage VSD VGS=0V,IS=3A 0.81 1.3 V Notes _ 10sec. a.Surface Mounted on FR4 Board,t < _ 300us, Duty Cycle < _ 2%. b.Pulse Test:Pulse Width < c.Guaranteed by design, not subject to production testing. d.Starting TJ=25°C,L=0.5mH,VDD = 20V.(See Figure13) e.Drain current limited by maximum junction temperature. Jul,18,2013 2 www.samhop.com.tw SP3902 Ver 1.1 40 30 VGS=5V 32 ID, Drain Current(A) ID, Drain Current(A) VGS=10V VGS=4V VGS=4.5V 24 16 VGS=3.5V 8 24 18 Tj=125 C 12 25 C -55 C 6 VGS=3V 0 1.0 0.5 1.5 2.5 2.0 0 3.0 0 3.2 4.0 4.8 Figure 1. Output Characteristics Figure 2. Transfer Characteristics 1.6 50 1.5 40 30 V G S =4.5V 20 10 V G S =10V 8 1 16 24 1.3 1.2 32 0 40 BVDSS, Normalized Drain-Source Breakdown Voltage V DS =V G S I D =250uA 1.2 1.0 0.8 0.6 0.4 25 50 25 50 75 100 125 150 T j ( °C ) Figure 4. On-Resistance Variation with Drain Current and Temperature 1.6 0 0 Tj, Junction Temperature(° C ) Figure 3. On-Resistance vs. Drain Current and Gate Voltage -50 -25 V G S =4.5V I D =4A 1.1 I D, Drain Current(A) 1.4 V G S =10V I D =5A 1.4 1.0 1 Vth, Normalized Gate-Source Threshold Voltage 2.4 V GS, Gate-to-Source Voltage(V) 60 0.2 1.6 0.8 VDS, Drain-to-Source Voltage(V) R DS(on), On-Resistance Normalized RDS(on)(m Ω) 0 75 100 125 150 Tj, Junction Temperature( ° C ) 1.15 I D =250uA 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 150 Tj, Junction Temperature(° C ) Figure 5. Gate Threshold Variation with Temperature Figure 6. Breakdown Voltage Variation with Temperature Jul,18,2013 3 www.samhop.com.tw SP3902 Ver 1.1 20 48 Is, Source-drain current(A) I D =5A 40 RDS(on)(m Ω) 32 24 125 C 16 75 C 25 C 8 0 4 6 8 75 C 10 0 0.25 0.50 0.75 1.00 1.25 VGS, Gate-to-Source Voltage(V) VSD, Body Diode Forward Voltage(V) Figure 7. On-Resistance vs. Gate-Source Voltage Figure 8. Body Diode Forward Voltage Variation with Source Current V GS, Gate to Source Voltage(V) 10 750 C, Capacitance(pF) 25 C 125 C 1 2 0 900 600 Ciss 450 300 Coss 150 Crss 0 10 0 5 10 15 20 25 VDS=15V ID=5A 8 6 4 2 0 30 2 0 4 6 8 10 VDS, Drain-to-Source Voltage(V) Qg, Total Gate Charge(nC) Figure 9. Capacitance Figure 10. Gate Charge 12 I D, Drain Current(A) 100 Switching Time(ns) TD(off ) Tr Tf TD(on) 10 VDS=15V,ID=1A VGS=10V 10 R (O DS N) Lim it 10 1m 10 0m s ms s DC 1 0.1 10 0u s VGS=10V Single Pulse TA=25 C 1 1 6 10 60 100 0.1 1 10 Rg, Gate Resistance(Ω) V DS, Drain-Source Voltage(V) Figure 11. switching characteristics Figure 12. Maximum Safe Operating Area Jul,18,2013 4 www.samhop.com.tw SP3902 Ver 1.1 V(BR)DSS tp L VDS D.U.T RG + - VDD IAS 20V tp 0.01 IAS Unclamped Inductive Waveforms Uncamped Inductive Test Circuit Figure 13b. Figure 13a. 1 Normalized Transient Thermal Resistance 0.5 0.2 0.1 0.1 0.05 0.02 P DM 0.01 0.01 t1 Single Pulse 1. 2. 3. 4. t2 R thJ A (t)=r (t) * R thJ A R thJ A =S ee Datas heet T J M-T A = P DM* R thJ A (t) Duty C ycle, D=t1/t2 0.001 0.00001 0.0001 0.001 0.1 0.01 1 Square Wave Pulse Duration(sec) 100 10 1000 Figure 14. Normalized Thermal Transient Impedance Curve Jul,18,2013 5 www.samhop.com.tw SP3902 Ver 1.1 PACKAGE OUTLINE DIMENSIONS PDFN 5x6-8L E1 E E2 D D1 e D2 b L2 L L1 BOTTOM VIEW TOP VIEW A A1 c SIDE VIEW SYMBOLS A A1 b c D D1 D2 E E1 E2 e L L1 L2 0 MIN 0.85 0.00 0.30 0.15 0.50 0.45 0.00 MILLIMETERS NOM 0.95 0.40 0.20 5.20 BSC 4.35 BSC 0.60 5.55 BSC 6.05 BSC 3.82 BSC 1.27 BSC 0.55 MAX 1.00 0.05 0.50 0.25 0.75 0.65 0.15 0.68 REF 0o 10o Jul,18,2013 6 www.samhop.com.tw SP3902 Ver 1.1 TOP MARKING DEFINITION PDFN 5x6-8L SamHop Logo 3902 Product No. XXXXXX Pin 1 SMC internal Code No.(A,B,C...Z) Wafer Lot No. Production Date (1,2 ~ 9, A,B.....) Production Month (1,2 ~ 9, A,B,C) Production Year (2009 = 9, 2010 = A.....) Jul,18,2013 7 www.samhop.com.tw