BLM3400

Pb Free Product
BLM3400
N-Channel Enhancement Mode Power MOSFET
DESCRIPTION
The BLM3400 uses advanced trench technology to provide
D
excellent RDS(ON), low gate charge and operation with gate
voltages as low as 2.5V. This device is suitable for use as a
G
Battery protection or in other Switching application.
S
GENERAL FEATURES
● VDS = 30V,ID = 5.8A
Schematic diagram
RDS(ON) < 59mΩ @ VGS=2.5V
RDS(ON) < 45mΩ @ VGS=4.5V
RDS(ON) < 41mΩ @ VGS=10V
● High Power and current handing capability
● Lead free product is acquired
Marking and pin Assignment
● Surface Mount Package
Application
●PWM applications
●Load switch
SOT-23 top view
●Power management
Package Marking And Ordering Information
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
3400
BLM3400
SOT-23
Ø180mm
8 mm
3000 units
Absolute Maximum Ratings (TA=25℃
℃unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Drain Current-Continuous
ID
Drain Current-Pulsed (Note 1)
IDM
Maximum Power Dissipation
PD
Operating Junction and Storage Temperature Range
TJ,TSTG
Limit
Unit
30
V
±12
V
5.8
A
30
A
1.4
W
-55 To 150
℃
1.0
℃/W
Thermal Characteristic
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
30
33
-
V
Off Characteristics
Drain-Source Breakdown Voltage
Page1
BVDSS
VGS=0V ID=250µA
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BLM3400
Zero Gate Voltage Drain Current
IDSS
VDS=30V,VGS=0V
-
-
1
µA
Gate-Body Leakage Current
IGSS
VGS=±12V,VDS=0V
-
-
±100
nA
VGS(th)
VDS=VGS,ID=250µA
0.7
0.9
1.4
V
VGS=2.5V, ID=4A
-
45
59
mΩ
VGS=4.5V, ID=2.9A
-
34
45
mΩ
VGS=10V, ID=2.9A
-
31
41
mΩ
VDS=5V,ID=2.9A
10
-
-
S
-
623
-
PF
-
99
-
PF
On Characteristics (Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
RDS(ON)
gFS
Dynamic Characteristics (Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
-
77
-
PF
Turn-on Delay Time
td(on)
-
3.3
-
nS
Turn-on Rise Time
tr
VDD=15V,ID=2.9A
-
4.8
-
nS
td(off)
VGS=10V,RGEN=3Ω
-
26
-
nS
-
4
-
nS
-
9.5
-
nC
-
1.5
-
nC
-
3
-
nC
-
0.75
1.2
V
-
-
2.9
A
VDS=15V,VGS=0V,
F=1.0MHz
Switching Characteristics (Note 4)
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS=15V,ID=5.8A,
VGS=4.5V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
VSD
Diode Forward Current (Note 2)
IS
VGS=0V,IS=2.9A
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
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BLM3400
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
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BLM3400
SOT-23 PACKAGE INFORMATION
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
Dimensions in Millimeters
MIN.
MAX.
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950TYP
1.800
2.000
0.550REF
0.300
0.500
0°
8°
NOTES
1. All dimensions are in millimeters.
2. Tolerance ±0.10mm (4 mil) unless otherwise specified
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
Page4
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