Data Sheet 4V Drive Nch + Nch MOSFET SH8K14 Structure Silicon N-channel MOSFET Dimensions (Unit : mm) SOP8 Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (SOP8). (8) (5) (1) (4) Application Switching Inner circuit Packaging specifications Type Package Code Basic ordering unit (pieces) Taping TB 2500 ○ SH8K14 (8) Absolute maximum ratings (Ta = 25C) Parameter Symbol Limits Unit Drain-source voltage VDSS 30 V Gate-source voltage VGSS 20 V Drain current Source current (Body Diode) Continuous ID Pulsed Continuous IDP Is *1 Pulsed Isp *1 PD *2 Power dissipation Channel temperature Range of storage temperature Tch Tstg 7.0 A 28 1.6 A A 28 A (1) Tr1 Source (2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain (7) ∗2 (6) (5) ∗2 ∗1 (1) ∗1 (2) (3) (4) ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE 2.0 W / TOTAL 1.4 W / ELEMENT 150 C 55 to 150 C *1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/6 2011.03 - Rev.A Data Sheet SH8K14 Electrical characteristics (Ta = 25C) <It is the same ratings for Tr1 and Tr2.> Parameter Gate-source leakage Symbol Min. Typ. Max. Unit IGSS - - 10 A VGS=20V, VDS=0V Drain-source breakdown voltage V (BR)DSS Conditions 30 - - V ID=1mA, VGS=0V IDSS - - 1 A VDS=30V, VGS=0V Gate threshold voltage VGS (th) 1.0 - 2.5 V VDS=10V, ID=1mA Static drain-source on-state resistance RDS (on)* - 20 28 ID=7.0A, VGS=10V - 25 35 m ID=7.0A, VGS=4.5V - 28 39 Forward transfer admittance l Yfs l* 4.5 - - S ID=7.0A, VDS=10V Input capacitance Ciss - 390 - pF VDS=10V Output capacitance Coss - 150 - pF VGS=0V Reverse transfer capacitance Crss - 70 - pF f=1MHz Turn-on delay time td(on) * - 7 - ns ID=3.5A, VDD 15V tr * - 30 - ns VGS=10V td(off) * - 30 - ns RL=4.3 Zero gate voltage drain current Rise time Turn-off delay time Fall time ID=7.0A, VGS=4.0V tf * - 8 - ns RG=10 Total gate charge Qg * - 5.8 - nC ID=7A, VDD 15V Gate-source charge Gate-drain charge Qgs * Qgd * - 1.5 2.3 - nC nC VGS=5V *Pulsed Body diode characteristics (Source-Drain) (Ta = 25C) <It is the same ratings for Tr1 and Tr2.> Parameter Forward Voltage Symbol VSD * Min. Typ. Max. - - 1.2 Unit Conditions V Is=7.0A, VGS=0V *Pulsed www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/6 2011.03 - Rev.A Data Sheet SH8K14 Electrical characteristic curves (Ta=25C) Fig.1 Typical Output Characteristics(Ⅰ) Fig.2 Typical Output Characteristics(Ⅱ) 7 7 Ta=25°C Pulsed VGS= 10V VGS= 4.5V VGS= 4.0V 5 6 DRAIN CURRENT : ID[A] DRAIN CURRENT : ID[A] 6 VGS= 2.8V 4 3 2 VGS= 2.5V 1 VGS= 2.5V VGS= 2.8V 4 3 2 0 0 0.2 0.4 0.6 0.8 1 0 2 4 6 8 DRAIN-SOURCE VOLTAGE : VDS[V] DRAIN-SOURCE VOLTAGE : VDS[V] Fig.3 Typical Transfer Characteristics Fig.4 Static Drain-Source On-State Resistance vs. Drain Current(Ⅰ) 10 10 1000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] VDS= 10V Pulsed DRAIN CURRENT : ID[A] 5 1 0 1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 0.01 Ta=25°C Pulsed 100 10 VGS= 4.0V VGS= 4.5V VGS= 10V 1 0.001 0 1 2 0.1 3 1 DRAIN-CURRENT : ID[A] GATE-SOURCE VOLTAGE : VGS[V] 10 Fig.6 Static Drain-Source On-State Resistance vs. Drain Current(Ⅲ) Fig.5 Static Drain-Source On-State Resistance vs. Drain Current(Ⅱ) 1000 1000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] VGS= 10V Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] Ta=25°C Pulsed VGS= 10V VGS= 4.5V VGS= 4.0V Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 100 10 1 VGS= 4.5V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 100 10 1 0.1 1 10 0.1 DRAIN-CURRENT : ID[A] www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1 10 DRAIN-CURRENT : ID[A] 3/6 2011.03 - Rev.A Data Sheet SH8K14 Fig.7 Static Drain-Source On-State Resistance vs. Drain Current(Ⅳ) Fig.8 Forward Transfer Admittance vs. Drain Current 100 VGS= 4.0V Pulsed FORWARD TRANSFER ADMITTANCE : |Yfs| [S] STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(on)[mΩ] 1000 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 100 10 1 VDS= 10V Pulsed 10 1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 0.1 1 0.01 10 0.1 DRAIN-CURRENT : ID[A] 50 10 Ta=25°C Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ] VGS=0V Pulsed SOURCE CURRENT : Is [A] 10 Fig.10 Static Drain-Source On-State Resistance vs. Gate Source Voltage Fig.9 Reverse Drain Current vs. Sourse-Drain Voltage 1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 0.01 ID= 3.5A 40 ID= 7.0A 30 20 10 0 0 0.5 1 1.5 0 2 SOURCE-DRAIN VOLTAGE : VSD [V] 4 6 8 10 GATE-SOURCE VOLTAGE : VGS[V] Fig.11 Switching Characteristics Fig.12 Dynamic Input Characteristics 10 1000 tf GATE-SOURCE VOLTAGE : VGS [V] Ta=25°C VDD= 15V VGS=10V RG=10W Pulsed td(off) SWITCHING TIME : t [ns] 1 DRAIN-CURRENT : ID[A] 100 td(on) 10 8 6 4 Ta=25°C VDD= 15V ID= 7A Pulsed 2 tr 1 0 0.01 0.1 1 10 0 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1 2 3 4 5 6 7 8 9 10 TOTAL GATE CHARGE : Qg [nC] DRAIN-CURRENT : ID[A] 4/6 2011.03 - Rev.A Data Sheet SH8K14 Fig.13 Typical Capacitance vs. Drain-Source Voltage Fig.14 Maximum Safe Operating Aera 1000 DRAIN CURRENT : ID (A) CAPACITANCE : C [pF] 10000 Ciss 1000 Crss Coss 100 Operation in this area is limited by RDS(ON) (VGS=10V) 100 10 PW =100us 1 PW =1ms PW = 10ms Ta=25°C Single Pulse : 1Unit Mounted on a ceramic board. (30mm × 30mm × 0.8mm) 0.1 Ta=25°C f=1MHz VGS=0V 10 DC operation 0.01 0.01 0.1 1 10 100 0.1 DRAIN-SOURCE VOLTAGE : VDS[V] 1 10 100 DRAIN-SOURCE VOLTAGE : VDS[V] Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width NORMARIZED TRANSIENT THERMAL RESISTANCE : r (t) 10 Ta=25°C Single Pulse : 1Unit 1 0.1 0.01 Mounted on a ceramic board. (30mm × 30mm × 0.8mm) Rth(ch-a)=89.3°C/W Rth(ch-a)(t)=r(t)×Rth(ch-a) 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 PULSE WIDTH : Pw(s) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/6 2011.03 - Rev.A Data Sheet SH8K14 Measurement circuits Pulse width VGS ID VDS 90% 50% 10% VGS VDS RL 50% 10% D.U.T. VDD RG 10% 90% td(on) ton Fig.1-1 Switching Time Measurement Circuit 90% td(off) tr tf toff Fig.1-2 Switching Waveforms VG VGS ID VDS Qg RL IG(Const.) VGS D.U.T. Qgs Qgd VDD Charge Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform Notice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/6 2011.03 - Rev.A Notice Notes Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A