Data Sheet 4V Drive Nch MOSFET RT1E060XN Structure Silicon N-channel MOSFET Dimensions (Unit : mm) TSST8 Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (TSST8). (8) (7) (6) (5) (1) (2) (3) (4) Abbreviated symbol : XR Application Switching Packaging specifications Package Type Code Basic ordering unit (pieces) RT1E060XN Inner circuit Taping TCR 3000 Absolute maximum ratings (Ta = 25C) Symbol Parameter Drain-source voltage Drain current Source current (Body Diode) Continuous Pulsed Continuous Unit 30 20 6 V V A *1 24 1 24 A A A *2 VGSS ID IDP *1 IS Pulsed ISP PD Power dissipation Channel temperature Range of storage temperature (7) (6) (5) ∗2 Limits VDSS Gate-source voltage (8) 1.25 W Tch Tstg 150 55 to 150 C C Symbol Limits Unit 100 C / W (1) Drain (2) Drain (3) Drain (4) Gate (5) Source (6) Drain (7) Drain (8) Drain ∗1 (1) (2) (3) (4) ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE *1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board. Thermal resistance Parameter Channel to Ambient Rth (ch-a)* *Mounted on a ceramic board. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/6 2011.04 - Rev.A Data Sheet RT1E060XN Electrical characteristics (Ta = 25C) Parameter Gate-source leakage Symbol Min. Typ. Max. Unit IGSS - - 10 A Drain-source breakdown voltage V(BR)DSS Zero gate voltage drain current Gate threshold voltage Conditions VGS=20V, VDS=0V 30 - - V ID=1mA, V GS=0V IDSS - - 1 A VDS=30V, VGS=0V VGS (th) 1.0 - 2.5 V - 16 22 ID=6A, VGS=10V - 21 29 m ID=6A, VGS=4.5V VDS=10V, ID=1mA Static drain-source on-state resistance RDS (on)* - 23 32 Forward transfer admittance l Yfs l * 4.5 - - S ID=6A, VDS=10V Input capacitance Ciss - 440 - pF VDS=10V Output capacitance Coss - 170 - pF VGS=0V Reverse transfer capacitance Crss - 85 - pF f=1MHz Turn-on delay time td(on) * - 8 - ns ID=3A, VDD 15V Rise time ID=6A, VGS=4.0V tr * - 16 - ns VGS=10V td(off) * - 32 - ns RL=5 tf * - 8 - ns RG=10 Total gate charge Qg * - 6.8 - nC ID=6A, VDD 15V Gate-source charge Qgs * Qgd * 1.6 2.6 - nC nC VGS=5V Gate-drain charge - Turn-off delay time Fall time *Pulsed Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage Symbol VSD * Min. Typ. Max. - - 1.2 Unit V Conditions Is=6A, VGS=0V *Pulsed www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/6 2011.04 - Rev.A Data Sheet RT1E060XN Electrical characteristic curves (Ta=25C) Fig.2 Typical Output Characteristics (Ⅱ) Fig.1 Typical Output Characteristics (Ⅰ) 6 6 VGS=3.0V Ta=25°C Pulsed VGS=10.0V 5 5 VGS=4.5V VGS=4.5V 4 VGS=4.0V VGS=2.8V Drain Current : ID [A] Drain Current : ID [A] VGS=10.0V VGS=4.0V 3 2 1 VGS=2.5V 4 VGS=3.0V VGS=2.8V 3 2 1 VGS=2.5V Ta=25°C Pulsed 0 0 0 0.2 0.4 0.6 0.8 1 0 2 4 Drain-Source Voltage : VDS [V] 10 Fig.4 Static Drain-Source On-State Resistance vs. Drain Current 100 100 VGS=10V pulsed Ta=25°C Pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] Static Drain-Source On-State Resistance RDS(on) [mΩ] 8 Drain-Source Voltage : VDS [V] Fig.3 Static Drain-Source On-State Resistance vs. Drain Current 10 VGS=4.0V VGS=4.5V VGS=10V 1 0.01 0.1 1 10 10 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 1 0.01 100 0.1 Drain Current : ID [A] 1 10 100 Drain Current : ID [A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current Fig.5 Static Drain-Source On-State Resistance vs. Drain Current 100 100 10 1 0.01 VGS=4V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] VGS=4.5V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] 6 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 1 10 1 0.01 100 Drain Current : ID [A] www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 1 10 100 Drain Current : ID [A] 3/6 2011.04 - Rev.A Data Sheet RT1E060XN Fig.8 Typical Transfer Characteristics Fig.7 Forward Transfer Admittance vs. Drain Current 100 100 VDS=10V pulsed VDS=10V pulsed Drain Currnt : ID [A] Forward Transfer Admittance Yfs [S] 10 10 1 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 0.1 0.01 0.001 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 1 0.1 0.01 0.001 0.01 0.1 1 10 100 0.0 1.0 2.0 2.5 3.0 3.5 Drain Current : ID [A] Fig.9 Source Current vs. Source-Drain Voltage Fig.10 Static Drain-Source On-State Resistance vs. Gate-Source Voltage 100 VGS=0V pulsed Static Drain-Source On-State Resistance RDS(on) [mΩ] Ta=25°C Pulsed 10 Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 1 0.1 80 ID=6.0A ID=3.0A 60 40 20 0 0.01 0.0 0.5 1.0 1.5 0 2.0 2 4 6 8 10 Gate-Source Voltage : VGS [V] Source-Drain Voltage : VSD [V] Fig.11 Switching Characteristics Fig.12 Dynamic Input Characteristics 1000 10 VDD≒15V VGS=10V RG=10Ω Ta=25°C Pulsed 100 Ta=25°C VDD=15V ID=6A Pulsed 8 Gate-Source Voltage : VGS [V] tf Switching Time : t [ns] 1.5 Gate-Source Voltage : VGS [V] 100 Source Current : Is [A] 0.5 td(off) td(on) 10 6 4 2 tr 1 0 0.01 0.1 1 10 100 0 4 6 8 10 12 14 Total Gate Charge : Qg [nC] Drain Current : ID [A] www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2 4/6 2011.04 - Rev.A Data Sheet RT1E060XN Fig.13 Typical Capacitance vs. Drain-Source Voltage Fig.14 Maximum Safe Operating Area 10000 100 Operation in this area is limited by RDS(on) (VGS = 10V) Ta=25°C f=1MHz VGS=0V Drain Current : ID [ A ] Capacitance : C [pF] 10 1000 Ciss 100 Coss 1 10 PW = 1ms PW = 10ms Ta=25°C Single Pulse Mounted on a ceramic board. (30mm × 30mm × 0.8mm) 10 0.1 1 0.1 Crss 0.01 PW = 100μs 0.01 0.01 100 0.1 1 DC operation 10 100 Drain-Source Voltage : VDS [ V ] Drain-Source Voltage : VDS [V] Fig.15 Normalized Transient Thermal Resistance v.s. Pulse Width Normalized Transient Thermal Resistance : r(t) 10 Ta=25°C Single Pulse 1 0.1 0.01 Mounted on a ceramic board. (30mm × 30mm × 0.8mm) Rth(ch-a)=100°C/W Rth(ch-a)(t)=r(t)×Rth(ch-a) 0.001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse width : Pw (s) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/6 2011.04 - Rev.A Data Sheet RT1E060XN Measurement circuits Pulse width VGS ID VDS 90% 50% 10% VGS VDS RL 50% 10% D.U.T. VDD RG 10% 90% td(on) ton Fig.1-1 Switching Time Measurement Circuit 90% td(off) tr tf toff Fig.1-2 Switching Waveforms VG VGS ID VDS Qg RL IG(Const.) VGS D.U.T. Qgs Qgd VDD Charge Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform Notice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/6 2011.04 - Rev.A Notice Notes Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A