PANASONIC 2SB1435

Power Transistors
2SB1435
Silicon PNP epitaxial planar type
For low-frequency output amplification
Unit: mm
90˚
10.8±0.2
• Low collector-emitter saturation voltage VCE(sat)
• Large collector current IC
• Allowing automatic insertion with radial taping
0.85±0.1
1.0±0.1 0.8 C
16.0±1.0
2.5±0.1
0.65±0.1
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
−50
V
Collector-emitter voltage (Base open)
VCEO
−50
V
Emitter-base voltage (Collector open)
VEBO
−5
V
Collector current
IC
−2
A
Peak collector current
ICP
−3
A
Collector power dissipation
PC
1.5
W
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
0.8 C
0.7±0.1
0.7±0.1
1.15±0.2
1.15±0.2
0.4±0.1
0.5±0.1
0.8 C
1
2
2.5±0.2
3
2.05±0.2
■ Features
4.5±0.2
3.8±0.2
7.5±0.2
2.5±0.2
1: Emitter
2: Collector
3: Base
MT-3-A1 Package
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Collector-base voltage (Emiter open)
VCBO
IC = −10 µA, IE = 0
−50
V
Collector-emitter voltage (Base open)
VCEO
IC = −1 mA, IB = 0
−50
V
Emiter-base voltage (Collector open)
VEBO
IE = −10 µA, IC = 0
−5
Collector-base cutoff current (Emitter open)
ICBO
VCB = −20 V, IE = 0
Forward current transfer ratio
hFE1 *
V
− 0.1
µA
340

VCE = −2 V, IC = −200 mA
120
hFE2
VCE = −2 V, IC = −1 A
60
Collector-emitter saturation voltage
VCE(sat)
IC = −1 A, IB = −50 mA
− 0.2
− 0.3
V
Base-emitter saturation voltage
VBE(sat)
IC = −1 A, IB = −50 mA
− 0.85
−1.20
V
Transition frequency
fT
Collector output capacitance
(Common base, input open circuited)
Cob
VCB = −10 V, IE = 50 mA, f = 200 MHz
80
VCB = −10 V, IE = 0, f = 1 MHz
45
MHz
60
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank
R
S
hFE1
120 to 240
170 to 340
Publication date: March 2003
SJD00074BED
1
2SB1435
PC  Ta
IC  VCE
Collector current IC (A)
1.2
0.8
0.4
–7mA
1.2
–6mA
0.9
–4mA
–5mA
–3mA
0.6
–2mA
0.3
0
40
80
120
160
–1mA
0
2
VBE(sat)  IC
10
Ta=25˚C
100
10
1
25˚C
320
–25˚C
240
160
80
1 000
1
10
100
200
1 000
160
120
80
40
0
1 000
1
Collector current IC (mA)
10
100
Emitter current IE (mA)
Rth  t
Without heat sink
f=1MHz
IE=0
TC=25˚C
Thermal resistance Rth (°C/W)
100
100
VCB=–10V
f=200MHz
TC=25˚C
104
120
Ta=25˚C
fT  I E
Cob  VCB
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
Ta=–25˚C
0.01
Collector current IC (mA)
Ta=75˚C
Collector current IC (mA)
80
60
40
103
102
10
1
20
0
1
10
100
10−1
10−4
10−3
10−2
10−1
1
Time t (s)
Collector-base voltage VCB (V)
2
Ta=75˚C
240
400
0
1
0.1
VCE=–5V
Forward current transfer ratio hFE
Base-emitter saturation voltage VBE(sat) (V)
Ta=–25˚C
0.1
0.01
1
0.001
10
IC/IB=20
hFE  IC
10
Ta=75˚C
8
480
IC/IB=20
1
6
10
Collector-emitter voltage VCE (V)
Ambient temperature Ta (°C)
100
4
Transition frequency fT (MHz)
Collector power dissipation PC (W)
IB=–8mA
1.5
1.6
0
Collector-emitter saturation voltage VCE(sat) (V)
Ta=25˚C
Without heat sink
0
VCE(sat)  IC
1.8
2.0
SJD00074BED
10
102
103
104
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
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product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
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2002 JUL