PANASONIC 2SD1264A

Power Transistors
2SD1264, 2SD1264A
Silicon NPN triple diffusion planar type
For low-freauency power amplification
For TV vertical deflection output
Complementary to 2SB940 and 2SB940A
Unit: mm
■ Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
Collector to base voltage
VCBO
200
V
Collector to
2SD1264
150
VCEO
emitter voltage 2SD1264A
180
6
V
Peak collector current
ICP
3
A
Collector current
IC
2
A
dissipation
PC
Ta=25°C
Junction temperature
Tj
Storage temperature
Tstg
■ Electrical Characteristics
Parameter
150
˚C
–55 to +150
˚C
Symbol
Conditions
IEBO
VEB = 4V, IC = 0
Collector to base voltage
VCBO
IC = 50µA, IE = 0
VCEO
IC = 5mA, IB = 0
2SD1264A
Emitter to base voltage
Forward current transfer ratio
4.2±0.2
7.5±0.2
2
3
1:Base
2:Collector
3:Emitter
TO–220 Full Pack Package(a)
min
typ
6
60
50
VCE = 10V, IC = 400mA
Collector to emitter saturation voltage
VCE(sat)
IC = 500mA, IB = 50mA
Transition frequency
fT
VCE = 5V, IC = 0.5A, f = 1MHz
µA
50
µA
V
V
180
IE = 500µA, IC = 0
VCE = 10V, IC = 400mA
Unit
50
150
VCE = 10V, IC = 150mA
VBE
max
200
hFE1*
hFE2
FE1
1
VEBO
Base to emitter voltage
*h
2.54±0.25
VCB = 200V, IE = 0
Emitter cutoff current
2SD1264
0.5 +0.2
–0.1
(TC=25˚C)
ICBO
voltage
0.8±0.1
1.3±0.2
W
2
Collector cutoff current
Collector to emitter
1.4±0.1
5.08±0.5
VEBO
30
φ3.1±0.1
V
Emitter to base voltage
Collector power TC=25°C
16.7±0.3
0.7±0.1
(TC=25˚C)
2.7±0.2
4.0
●
14.0±0.5
●
High collector to emitter VCEO
Large collector power dissipation PC
Full-pack package which can be installed to the heat sink with
one screw
4.2±0.2
5.5±0.2
Solder Dip
■ Features
●
10.0±0.2
V
240
1
1
20
V
V
MHz
Rank classification
Rank
Q
P
hFE1
60 to 140
100 to 240
1
Power Transistors
2SD1264, 2SD1264A
PC — Ta
IC — VCE
(1)
30
1.0
20
(2)
10
IB=7mA
0.8
5mA
4mA
0.6
3mA
0.4
2mA
0.2
0
20
40
60
80 100 120 140 160
Ambient temperature Ta (˚C)
4
8
12
16
20
TC=100˚C
25˚C
–25˚C
0.1
0.03
0.03
0.1
0.3
300
TC=100˚C
100
–25˚C
30
10
3
1ms
0.3
DC
0.1
0.03
0.003
0.001
1
3
10
30
100
2SD1264A
0.01
300
Collector to emitter voltage VCE
1000
100
30
10
3
1
0.1
0.3
1
3
0.1
0.01 0.03
10
(V)
0.1
0.3
1
3
Collector current IC (A)
Rth(t) — t
(1) Without heat sink
(2) With a 100 × 100 × 2mm Al heat sink
102
(1)
(2)
10
1
10–1
10–2
10–4
1.2
0.3
103
Thermal resistance Rth(t) (˚C/W)
5ms
1.0
VCE=5V
f=1MHz
TC=25˚C
300
Collector current IC (A)
t=0.5ms
0.8
fT — IC
25˚C
1
0.01 0.03
1
2SD1264
Collector current IC (A)
IC
1
0.6
VCE=10V
Non repetitive pulse
TC=25˚C
ICP
3
0.4
1000
Area of safe operation (ASO)
10
0.2
Base to emitter voltage VBE (V)
3000
Collector current IC (A)
2
0
1000
0.01
0.01
0.4
24
10000
Forward current transfer ratio hFE
3
0.3
0.6
hFE — IC
IC/IB=10
1
0.8
Collector to emitter voltage VCE (V)
VCE(sat) — IC
10
–25˚C
0
0
Transition frequency fT (MHz)
0
TC=100˚C
0.2
1mA
(3)
(4)
25˚C
1.0
6mA
Collector current IC (A)
40
1.2
TC=25˚C
(1) TC=Ta
(2) With a 100 × 100 × 2mm
Al heat sink
(3) With a 50 × 50 × 2mm
Al heat sink
(4) Without heat sink
(PC=2W)
0
Collector to emitter saturation voltage VCE(sat) (V)
IC — VBE
1.2
Collector current IC (A)
Collector power dissipation PC (W)
50
10–3
10–2
10–1
1
Time t (s)
10
102
103
104
10