Composite Transistors XN04402 (XN4402) Silicon PNP epitaxial planar type Unit: mm 2.90+0.20 –0.05 1.9±0.1 (0.95) (0.95) 6 3 2 1 (0.65) • Two elements incorporated into one package • Reduction of the mounting area and assembly cost by one half 0.30+0.10 –0.05 0.50+0.10 –0.05 ■ Basic Part Number 0.4±0.2 1.50+0.25 –0.05 5 2.8+0.2 –0.3 4 ■ Features 0.16+0.10 –0.06 5˚ For general amplification 1.1+0.2 –0.1 Parameter Symbol Rating Unit Collector-base voltage (Emitter open) VCBO −60 V Collector-emitter voltage (Base open) VCEO −50 V Emitter-base voltage (Collector open) VEBO −5 V Collector current IC −500 mA Peak collector current ICP −1 A Total power dissipation PT 300 mW Junction temperature Tj 150 °C Storage temperature Tstg −55 to +150 °C 1: Collector (Tr1) 2: Base (Tr2) 3: Emitter (Tr2) EIAJ : SC-74 0 to 0.1 ■ Absolute Maximum Ratings Ta = 25°C 1.1+0.3 –0.1 10˚ • 2SB0710 (2SB710) × 2 4: Collector (Tr2) 5: Base (Tr1) 6: Emitter (Tr1) Mini6-G1 Package Marking Symbol: OH Internal Connection 4 5 Tr2 3 6 Tr1 2 1 ■ Electrical Characteristics Ta = 25°C ± 3°C Parameter Symbol Collector-base voltage (Emitter open) VCBO IC = −10 µA, IE = 0 −60 Collector-emitter voltage (Base open) VCEO IC = −2 mA, IB = 0 −50 V Emitter-base voltage (Collector open) VEBO IE = −10 µA, IC = 0 −5 V Collector-base cutoff current (Emitter open) ICBO VCB = −20 V, IE = 0 Forward current transfer ratio * hFE1 VCE = −10 V, IC = −150 mA 85 40 Collector-emitter saturation voltage * Base-emitter saturation voltage * Transition frequency Collector output capacitance (Common base, input open circuited) Conditions Min Typ hFE2 VCE = −10 V, IC = −500 mA IC = −300 mA, IB = −30 mA VBE(sat) IC = −300 mA, IB = −30 mA −1.1 VCB = −10 V, IE = 50 mA, f = 200 MHz 200 Cob VCB = −10 V, IE = 0, f = 1 MHz Unit V VCE(sat) fT Max − 0.1 µA 340 − 0.35 − 0.60 6 −1.5 V V MHz 15 pF Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Pulse measurement Note) The part number in the parenthesis shows conventional part number. Publication date: February 2004 SJJ00072BED 1 XN04402 PT Ta IC VCE −2 mA −1 mA −200 −300 −200 100 −100 80 120 0 160 −4 0 −1 25°C Ta = 75°C −25°C −10−2 −10 −102 −102 −103 Ta = −25°C 75°C −10−2 −1 −10 −102 VCB = −10 V Ta = 25°C 200 160 120 80 40 Emitter current IE (mA) 102 24 16 12 8 4 0 −1 −10 −102 Collector-base voltage VCB (V) SJJ00072BED −10 250 Ta = 75°C 200 25°C 150 −25°C 100 50 −10 −102 −103 Collector current IC (mA) f = 1 MHz IE = 0 Ta = 25°C 20 −8 VCE = −10 V 0 −1 −103 Cob VCB Collector output capacitance C (pF) (Common base, input open circuited) ob fT I E −6 hFE IC 25°C −1 −4 300 Collector current IC (mA) 240 10 −2 0 Base current IB (mA) IC / IB = 10 −10 Collector current IC (mA) 1 0 −20 −10−1 −10−3 −1 0 −16 VBE(sat) IC IC / IB = 10 −10−1 −12 Collector-emitter voltage VCE (V) Base-emitter saturation voltage VBE(sat) (V) −10 −8 Forward current transfer ratio hFE 40 VCER RBE −120 Collector-emitter voltage (V) (Resistor between B and E) VCER 0 −100 VCE(sat) IC Collector-emitter saturation voltage VCE(sat) (V) −400 −3 mA −300 Ambient temperature Ta (°C) Transition frequency fT (MHz) −500 −4 mA −400 200 −600 Collector current IC (mA) Collector current IC (mA) Total power dissipation PT (mW) −500 VCE = −10 V Ta = 25°C −700 IB = −10 mA −9 mA −8 mA −7 mA −6 mA −5 mA −600 300 −800 Ta = 25°C −700 400 0 2 IC I B −800 500 IC = −2 mA Ta = 25°C −100 −80 −60 −40 −20 0 1 10 102 103 Base-emitter resistance RBE (kΩ) Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2003 SEP