VS-GT140DA60U Datasheet

VS-GT140DA60U
www.vishay.com
Vishay Semiconductors
Insulated Gate Bipolar Transistor
(Trench IGBT), 140 A
FEATURES
• Trench IGBT technology
temperature coefficient
with
positive
• Square RBSOA
• 3 μs short circuit capability
• FRED Pt® antiparallel diodes with ultrasoft reverse
recovery
• TJ maximum = 175 °C
• Fully isolated package
SOT-227
• Very low internal inductance ( 5 nH typical)
• Industry standard outline
• UL approved file E78996
PRODUCT SUMMARY
VCES
600 V
IC DC
140 A at 90 °C (1)
VCE(on) typical at 100 A, 25 °C
1.72 V
IF DC
71 A at 90 °C
Speed
8 kHz to 30 kHz
Package
SOT-227
Circuit
Single switch diode
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
BENEFITS
• Designed for increased operating efficiency in power
conversion: UPS, SMPS, welding, induction heating
• Easy to assemble and parallel
• Direct mounting to heatsink
• Plug-in compatible with other SOT-227 packages
Note
(1) Maximum collector current admitted is 100 A, to do not exceed
the maximum temperature of terminals
• Lower conduction losses and switching losses
• Low EMI, requires less snubbing
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Collector to emitter voltage
SYMBOL
TEST CONDITIONS
VCES
TC = 25 °C
MAX.
UNITS
600
V
200
Continuous collector current
IC (1)
Pulsed collector current
ICM
350
Clamped inductive load current
ILM
350
Diode continuous forward current
Gate-to-emitter voltage
Power dissipation, IGBT
Power dissipation, diode
Isolation voltage
IF
TC = 90 °C
TC = 25 °C
104
TC = 90 °C
71
VGE
PD
PD
VISOL
140
± 20
TC = 25 °C
652
TC = 90 °C
370
TC = 25 °C
238
TC = 90 °C
135
Any terminal to case, t = 1 min
2500
A
V
W
V
Note
(1) Maximum collector current admitted is 100 A, to do not exceed the maximum temperature of terminals
Revision: 31-May-16
Document Number: 94772
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown
voltage
Collector to emitter voltage
Gate threshold voltage
SYMBOL
VBR(CES)
VCE(on)
VGE(th)
Temperature coefficient of threshold
voltage
VGE(th)/TJ
Collector to emitter leakage current
ICES
TEST CONDITIONS
MIN.
TYP.
MAX.
VGE = 0 V, IC = 250 μA
600
-
-
VGE = 15 V, IC = 100 A
-
1.7
2.0
VGE = 15 V, IC = 100 A, TJ = 125 °C
-
2.0
2.2
VGE = 15 V, IC = 100 A, TJ = 175°C
-
2.15
-
VCE = VGE, IC = 250 μA
UNITS
V
3.5
4.6
6.5
VCE = VGE, IC = 250 μA, TJ = 125 °C
-
2.65
-
VCE = VGE, IC = 1 mA (25 °C to 125 °C)
-
-16.8
-
mV/°C
μA
VGE = 0 V, VCE = 600 V
-
0.6
100
VGE = 0 V, VCE = 600 V, TJ = 125 °C
-
0.15
3
VGE = 0 V, VCE = 600 V, TJ = 175 °C
-
8
-
mA
IF = 40 A, VGE = 0 V
-
1.74
2.2
Forward voltage drop, diode
VFM
IF = 40 A, VGE = 0 V, TJ = 125 °C
-
1.35
1.74
IF = 40 A, VGE = 0 V, TJ = 150 °C
-
1.2
-
Gate to emitter leakage current
IGES
VGE = ± 20 V
-
-
± 200
nA
UNITS
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
MIN.
TYP.
MAX.
Turn-on switching loss
SYMBOL
Eon
-
0.43
-
Turn-off switching loss
Eoff
-
1.50
-
-
1.93
-
-
130
-
-
50
-
-
127
-
-
82
-
-
0.43
-
-
2.12
-
-
2.55
-
-
130
-
-
52
-
-
130
-
-
100
-
Total switching loss
Etot
Turn-on delay time
td(on)
Rise time
Turn-off delay time
Fall time
tr
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on delay time
td(on)
Fall time
Reverse bias safe operating area
tr
IC = 100 A, VCC = 360 V,
VGE = 15 V, Rg = 5  
L = 500 μH, TJ = 125 °C
td(off)
tf
RBSOA
Diode reverse recovery time
trr
Diode reverse recovery current
Irr
Diode recovery charge
Qrr
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Short circuit safe operating area
Energy losses
include tail and
diode
recovery.
Diode used
60APH06
tf
Eon
Turn-off delay time
IC = 100 A, VCC = 360 V,
VGE = 15 V, Rg = 5 
L = 500 μH, TJ = 25 °C
td(off)
Turn-on switching loss
Rise time
TEST CONDITIONS
SCSOA
TJ = 175 °C, IC = 350 A, Rg = 22 
VGE = 15 V to 0 V, VCC = 400 V,
VP = 600 V, L = 500 μH
IF = 50 A, dIF/dt = 200 A/μs, VR = 200 V
IF = 50 A, dIF/dt = 200 A/μs, 
VR = 200 V, TJ = 125 °C
TJ = 175 °C, Rg = 22 VGE = 15 V to 0 V,
VCC = 400 V, VP = 600 V
mJ
ns
mJ
ns
Fullsquare
-
72
-
-
5.5
-
A
-
200
-
nC
-
144
-
ns
-
13
-
A
-
930
-
nC
3
ns
μs
Revision: 31-May-16
Document Number: 94772
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VS-GT140DA60U
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Vishay Semiconductors
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Junction and storage temperature range
IGBT
Junction to case
SYMBOL
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-40
-
175
°C
-
-
0.23
-
-
0.63
-
0.1
-
-
30
-
RthJC
Diode
Case to heatsink
RthCS
Flat, greased surface
Weight
Mounting torque
-
-
1.1 (9.7)
Nm (lbf.in)
Torque to heatsink
-
-
1.3 (11.5)
Nm (lbf.in)
SOT-227
180
Allowable Case Temperature (°C)
160
140
DC
120
100
80
60
40
20
0
160
140
120
100
80
60
40
20
0
20 40 60 80 100 120 140 160 180 200 220
0
20
40
60
80
100
120
IC - Continuous Collector Current (A)
IF - Continuous Forward Current (A)
Fig. 1 - Maximum DC IGBT Collector Current
vs. Case Temperature
Fig. 3 - Maximum Allowable Forward Current
vs. Case Temperature, Diode Leg
300
200
VGE = 15 V
TJ = 125 °C
250
IF - Forward Current (A)
Allowable Case Temperature (°C)
180
IC - Collector-to-Emitter Current (A)
g
Torque to terminal
Case style
0
°C/W
200
150
TJ = 25 °C
TJ = 175 °C
100
50
0
160
TJ = 175 °C
120
80
TJ = 25 °C
40
TJ = 125 °C
0
0.0
1.0
2.0
3.0
4.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VCE - Collector-to-Emitter Voltage (V)
VF - Forward Voltage Drop Characteristics (V)
Fig. 2 - Typical Collector to Emitter Current
Output Characteristics of IGBT
Fig. 4 - Typical Diode Forward Voltage Drop Characteristics
Revision: 31-May-16
Document Number: 94772
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VS-GT140DA60U
Vishay Semiconductors
VCE - Collector-to-Emitter Voltage (V)
IC - Collector-to-Emitter Current (A)
www.vishay.com
140
120
100
TJ = 175 °C
80
60
40
TJ = 125 °C
TJ = 25 °C
20
0
2.4
IC = 100 A
2.2
2
IC = 75 A
1.8
IC = 50 A
1.6
1.4
IC = 25 A
1.2
1
3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5
0
40
80
100 120 140 160 180
TJ - Junction Temperature (°C)
Fig. 5 - Typical IGBT Transfer Characteristics
Fig. 8 - Typical IGBT Collector to Emitter Voltage
vs. Junction Temperature, VGE = 15 V
2.2
0.1
TJ = 125 °C
0.01
0.001
TJ = 25 °C
0.0001
Switching Energy (mJ)
1
Eoff
2
TJ = 175 °C
1.8
1.6
1.4
1.2
1
0.8
0.6
Eon
0.4
0.2
0
0.00001
0
100
200
300
400
500
600
10 20 30 40 50 60 70 80 90 100 110 120
VCES - Collector-to-Emitter Voltage (V)
IC - Collector Current (A)
Fig. 9 - Typical IGBT Energy Losses vs. IC
TJ = 125 °C, L = 500 μH, VCC = 360 V,
Rg = 5 , VGE = 15 V, Diode used: 60APH06
Fig. 6 - Typical IGBT Zero Gate Voltage Collector Current
1
5
4.5
TJ = 25 °C
Switching Time (μs)
VGETH - Threshold Voltage (V)
60
VGE - Gate-to-Emitter Voltage (V)
10
ICES - Collector Current (mA)
20
4
3.5
3
2.5
TJ = 125 °C
2
0.1
td(on)
tr
1.5
1
0.20
td(off)
tf
0.01
0.40
0.60
0.80
1.00
0
20
40
60
80
100
120
IC (mA)
IC - Collector Current (A)
Fig. 7 - Typical IGBT Threshold Voltage
Fig. 10 - Typical IGBT Switching Time vs. IC
TJ = 125 °C, L = 500 μH, VCC = 360 V,
Rg = 5 , VGE = 15 V, Diode used: 60APH06
Revision: 31-May-16
Document Number: 94772
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-GT140DA60U
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Vishay Semiconductors
6
200
180
5
125 °C
160
4.5
4
Eoff
3.5
140
trr (ns)
Energy Losses (mJ)
VR = 200 V
IF = 50 A
Eon
5.5
3
2.5
120
100
2
25 °C
80
1.5
1
60
0.5
40
0
0
10
20
30
40
100
50
1000
Rg (Ω)
dIF/dt (A/μs)
Fig. 11 - Typical IGBT Energy Loss vs. Rg
TJ = 125 °C, IC = 100 A, L = 500 μH,
VCC = 360 V, VGE = 15 V, Diode used: 60APH06
Fig. 13 - Typical Reverse Recovery Time vs. dIF/dt of Diode
2000
1
1500
td(on)
td(off)
Qrr (nC)
Switching Time (μs)
VR = 200 V
IF = 50 A
tr
0.1
125 °C
1000
tf
500
25 °C
0.01
0
10
20
30
40
50
0
100
60
1000
Rg (Ω)
dIF/dt (A/μs)
Fig. 12 - Typical IGBT Switching Time vs. Rg
TJ = 125 °C, L = 500 μH, VCC = 360 V,
IC = 100 A, VGE = 15 V, Diode used: 60APH06
Fig. 14 - Typical Stored Charge vs. dIF/dt of Diode
35
VR = 200 V
IF = 50 A
30
IRR (A)
25
20
125 °C
15
10
25 °C
5
0
100
1000
dIF/dt (A/μs)
Fig. 15 - Typical Reverse Recovery Current vs. dIF/dt of Diode
Revision: 31-May-16
Document Number: 94772
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VS-GT140DA60U
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Vishay Semiconductors
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
PDM
D = 0.75
D = 0.50
D = 0.25
D = 0.1
D = 0.05
D = 0.02
DC
0.01
0.001
0.0001
0.001
0.01
t1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.1
1
.
10
t1 - Rectangular Pulse Duration (s)
Fig. 16 - Maximum Thermal Impedance ZthJC Characteristics, IGBT
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
D = 0.75
D = 0.50
D = 0.25
D = 0.1
D = 0.05
D = 0.02
DC
0.01
PDM
t1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.001
0.0001
0.001
0.01
0.1
1
.
10
t1 - Rectangular Pulse Duration (s)
Fig. 17 - Maximum Thermal Impedance ZthJC Characteristics, Diode
1000
IC (A)
100
10
1
0.1
0.01
1
10
100
1000
VCE (V)
Fig. 18 - IGBT Reverse BIAS SOA, TJ = 175 °C, VGE = 15 V
Revision: 31-May-16
Document Number: 94772
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VS-GT140DA60U
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Vishay Semiconductors
R=
L
D.U.T.
VCC
ICM
VC *
50 V
1000 V
D.U.T.
1
2
+
-V
CC
Rg
* Driver same type as D.U.T.; VC = 80 % of Vce(max)
* Note: Due to the 50 V power supply, pulse width and inductor
will increase to obtain Id
19a - Clamped Inductive Load Test Circuit
19b - Pulsed Collector Current Test Circuit
Diode clamp/
D.U.T.
L
- +
-5V
+
VCC
D.U.T./
driver
Rg
20a - Switching Loss Test Circuit
1
2
90 %
10 %
3
VC
90 %
td(off)
10 %
IC
5%
tf
tr
td(on)
t = 5 µs
Eoff
Eon
Ets = (Eon + Eoff)
20b - Switching Loss Waveforms Test Circuit
Revision: 31-May-16
Document Number: 94772
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VS-GT140DA60U
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Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
G
T
140
D
A
60
U
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Insulated Gate Bipolar Transistor (IGBT)
3
-
T = trench IGBT Technology
4
-
Current rating (140 = 140 A)
5
-
Circuit configuration (D = single switch with antiparallel diode)
6
-
Package indicator (A = SOT-227)
7
-
Voltage rating (60 = 600 V)
8
-
Speed/type (U = ultrafast IGBT)
CIRCUIT CONFIGURATION
CIRCUIT
CIRCUIT
CONFIGURATION CODE
CIRCUIT DRAWING
3 (C)
Single switch diode
Lead Assignment
4
3
1
2
D
2 (G)
1, 4 (E)
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95423
Packaging information
www.vishay.com/doc?95425
Revision: 31-May-16
Document Number: 94772
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Outline Dimensions
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Vishay Semiconductors
SOT-227 Generation II
DIMENSIONS in millimeters (inches)
38.30 (1.508)
37.80 (1.488)
Ø 4.10 (0.161)
Ø 4.30 (0.169)
-A-
4 x M4 nuts
6.25 (0.246)
6.50 (0.256)
12.50 (0.492)
13.00 (0.512)
25.70 (1.012)
24.70 (0.972)
-B-
7.45 (0.293)
7.60 (0.299)
14.90 (0.587)
15.20 (0.598)
R full 2.10 (0.083)
2.20 (0.087)
30.50 (1.200)
29.80 (1.173)
31.50 (1.240)
32.10 (1.264)
4x
2.20 (0.087)
1.90 (0.075)
8.30 (0.327)
7.70 (0.303)
0.25 (0.010) M C A M B M
4.10 (0.161)
4.50 (0.177)
12.30 (0.484)
11.70 (0.460)
-C0.13 (0.005)
25.00 (0.984)
25.50 (1.004)
Note
• Controlling dimension: millimeter
Revision: 02-Aug-12
Document Number: 95423
1
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Revision: 02-Oct-12
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Document Number: 91000